Abstract: In an enhanced technique for electroless metal deposition, the substrate is heated to or above the operating temperature for the specific plating solution, while the plating solution may be maintained at a non-critical low temperature to substantially prevent spontaneous self-decomposition within the plating tool. Hence, significant advantages with respect to process control and cost of ownership may be achieved.

Abstract: By using signals from an electric drive assembly of an electroplating tool, the operating position of the substrate surface to be plated may be determined in an automated fashion wherein, based on a reference position, the meniscus of the electrolyte and/or any appropriate operating position may be determined. Consequently, accuracy and throughput may be enhanced compared to conventional manual or semi-automatic adjustment procedures.

Abstract: In an enhanced technique for electroless metal deposition, the substrate is heated to or above the operating temperature for the specific plating solution, while the plating solution may be maintained at a non-critical low temperature to substantially prevent spontaneous self-decomposition within the plating tool. Hence, significant advantages with respect to process control and cost of ownership may be achieved.

Abstract: The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. In another embodiment, the diffuser element comprises at least two patterns of passages that are movable relatively to each other so as to adjust an overlap and thus an effective size of the corresponding passages. Moreover, the path of ions within the plating reactor may be controlled by an electromagnetically driven diffuser element so that a required thickness profile on the workpiece surface may be obtained.

Abstract: A plating tool for a single-use plating process comprises a reclaim system in combination with a support tank to enable collection of non-consumed plating solution drained off from the process chamber, which is then re-circulated to the support tank after an efficient treatment in the reclaim system. Since the non-consumed plating solution is continuously recycled, the electrolyte may be preserved substantially without any time limit while at the same time production costs for a single-use plating process are significantly reduced.

Abstract: An electroplating tool is operated in combination with a controller which automatically determines the individual currents for a multi-anode configuration of the plating tool. The calculation of the anode currents may be based on sensitivity data and measurement data as well as on a desired target profile, so that a fast response with respect to process variations may be achieved even for a plating tool including a plurality of process chambers.

Abstract: The flow of electrolyte and/or of ions is controlled by a diffuser element provided in a plating reactor, wherein, in one embodiment, the diffuser element comprises a mechanical adjustment mechanism to adjust the effective size of passages of the diffuser element. In another embodiment, the diffuser element comprises at least two patterns of passages that are movable relatively to each other so as to adjust an overlap and thus an effective size of the corresponding passages. Moreover, the path of ions within the plating reactor may be controlled by an electromagnetically driven diffuser element so that a required thickness profile on the workpiece surface may be obtained.

Abstract: In a new method of electroplating metal onto a patterned dielectric layer including small diameter vias and large diameter trenches, a pulse reverse electroplating sequence with a two-component chemistry is modified to substantially fill the vias, while in a subsequent DC deposition the bulk material is deposited to completely fill the large diameter trenches. Thus, good control quality compared to conventional three-component chemistry electroplating is obtained while the superior characteristics of a metal layer deposited by a two-component chemistry are preserved. The method is particularly advantageous in electroplating copper.