Patents by Inventor Matthias Heid

Matthias Heid has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Device for dissipating heat from at least one electronic component
    Patent number: 10015875
    Abstract: The current embodiments provide an assembly for cooling a printed circuit board with at least one electronic component disposed on a first surface of the printed circuit board. The assembly may have a housing with first and second elastic elements and a cooling element configured to cool the at least one electronic component. The printed circuit board may be held between the first and second elastic elements in the housing. The assembly may further have at least one cooling surface region protruding from the cooling element and facing toward a second surface facing opposite the first surface of the printed circuit board in a region opposite of the electronic component.
    Type: Grant
    Filed: January 15, 2016
    Date of Patent: July 3, 2018
    Assignee: ZF Friedrichshafen AG
    Inventors: Karl-Heinz Müller, Matthias Heid, Horst Hübner