Abstract: A method for producing a housing cover for a laser component, a housing for a laser component, and a laser component are provided. The method includes providing an at least partially radiation-permeable window including an aluminum oxide, provide a copper carrier for the window, and forming a copper oxide in an oxide region on the copper carrier. The method further includes arranging the window at the oxide region, forming a eutectic bond between the window and the copper oxide in the oxide region, and thereby fixing the window to the copper carrier.

Abstract: A method for producing a housing cover for a laser component, a housing for a laser component, and a laser component are provided. The method includes providing an at least partially radiation-permeable window including an aluminum oxide, provide a copper carrier for the window, and forming a copper oxide in an oxide region on the copper carrier. The method further includes arranging the window at the oxide region, forming a eutectic bond between the window and the copper oxide in the oxide region, and thereby fixing the window to the copper carrier.

Abstract: A method for manufacturing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment, a method includes applying a conversion layer including a luminescence conversion material to a support plate including a glass, arranging at least two optoelectronic semiconductor chips over the conversion layer on a side remote from the support plate and forming an envelope material free from a luminescence conversion material between the optoelectronic semiconductor chips, thereby forming a workpiece.

Abstract: A method for manufacturing an optoelectronic component and an optoelectronic component are disclosed. In an embodiment, a method includes applying a conversion layer including a luminescence conversion material to a support plate including a glass, arranging at least two optoelectronic semiconductor chips over the conversion layer on a side remote from the support plate and forming an envelope material free from a luminescence conversion material between the optoelectronic semiconductor chips, thereby forming a workpiece.

Abstract: An optoelectronic component includes an optoelectronic semiconductor chip at least partly enclosed by a molded body, wherein a front side of the molded body is covered by a reflecting film, at least in some sections, and a section of the reflecting film is enclosed between the optoelectronic semiconductor chip and the molded body.

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.

Abstract: A mounting carrier for semiconductor chips includes a second main surface provided for mounting of semiconductor chips, and a first main surface opposite to the second main surface. The mounting carrier also includes a mounting body, wherein the mounting body includes a first metallization on the side facing the first main surface and the first main surface includes a structure having a plurality of columnar structural elements.

Abstract: A mounting carrier for semiconductor chips includes a second main surface provided for mounting of semiconductor chips, and a first main surface opposite to the second main surface. The mounting carrier also includes a mounting body, wherein the mounting body includes a first metallization on the side facing the first main surface and the first main surface includes a structure having a plurality of columnar structural elements.

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.