Abstract: The invention relates to a semiconductor component (2), comprising a semiconductor chip (3), a housing (5) and a connection point arrangement (10) having at least two rows (14, 16) of planar connection points (12), which are arranged on a bottom side of the housing (5) and can be electrically connected by means of connections to corresponding contacts of a contact arrangement having at least two rows, which contact arrangement is arranged on a printed circuit board, wherein the geometry of the contact arrangement corresponds to the geometry of the connection point arrangement (10), a first distance is specified between two adjacent first connection points (14A) of a first row (14) of the connection point arrangement (10) and a second distance is specified between two adjacent second connection points (16A) of a second row (16) of the connection point arrangement (10), and the second connection points (16A) of the second row (16) are offset to the first connection points (14A) of the first row (14).

Abstract: The invention relates to a semiconductor component (2), comprising a semiconductor chip (3), a housing (5) and a connection point arrangement (10) having at least two rows (14, 16) of planar connection points (12), which are arranged on a bottom side of the housing (5) and can be electrically connected by means of connections to corresponding contacts of a contact arrangement having at least two rows, which contact arrangement is arranged on a printed circuit board, wherein the geometry of the contact arrangement corresponds to the geometry of the connection point arrangement (10), a first distance is specified between two adjacent first connection points (14A) of a first row (14) of the connection point arrangement (10) and a second distance is specified between two adjacent second connection points (16A) of a second row (16) of the connection point arrangement (10), and the second connection points (16A) of the second row (16) are offset to the first connection points (14A) of the first row (14).

Abstract: The invention relates to a printed circuit board (10), with conductor tracks (11, 11a), which are arranged at least on a surface of the printed circuit board (10) and serve for the electrical contacting of components, and with at least one testing zone (12), which is formed by a portion of the conductor track (11) and serves for the electrical contacting of a testing element (20), in particular a testing head, wherein the surface of the printed circuit board (10) is provided with a protective layer (14), which is formed in the testing zone (12) such that it is interrupted in the region of a contact zone (15), and wherein the contact zone (15) is provided with a layer (18), which establishes an electrical contacting of the testing element (20) with the layer (18). According to the invention, it is provided that the contact zone (15) is arranged at least partially at a lateral distance from the edges of the conductor track (11) in the region of the testing zone (12).

Abstract: The invention relates to an electronic module comprising at least one electronic or electric component (3), a base plate (4), and a support plate (2), in particular a printed circuit board or a substrate. Said support plate (2) is arranged on the base plate (4) and comprises conductor paths. Said base plate (4) comprises a blind hole-type recess (5) on a side oriented towards the support plate (2). The component (3) is in contact on the support plate (2) and is arranged in the recess (5) of the base plate (4).

Abstract: The invention relates to an electronic module, a support plate (2) having a base area (20) and at least one connection element (21). Said connection element (21) is a part of the base area (20) and is arranged at an angle (a) to the base area (20), in addition to at least one electronic component (3), in particular a sensor, which is arranged in the connection element (21).

Abstract: The invention relates to an electronic module comprising at least one electronic or electric component (3), a base plate (4), and a support plate (2), in particular a printed circuit board or a substrate. Said support plate (2) is arranged on the base plate (4) and comprises conductor paths. Said base plate (4) comprises a blind hole-type recess (5) on a side oriented towards the support plate (2). The component (3) is in contact on the support plate (2) and is arranged in the recess (5) of the base plate (4).

Abstract: The invention relates to an electronic module, a support plate (2) having a base area (20) and at least one connection element (21). Said connection element (21) is a part of the base area (20) and is arranged at an angle (a) to the base area (20), in addition to at least one electronic component (3), in particular a sensor, which is arranged in the connection element (21).

Abstract: The invention relates to a plug connection device, comprising a plug (7) which has contacts (8) and comprising mating contacts (4) arranged on a substrate (2), wherein the contacts (8) are intended for electrical contacting of the mating contacts (4). According to the invention, the plug (7) has at least one recess (18) for accommodating an element (10) arranged on the substrate (2).

Abstract: The invention relates to a printed circuit board (10), with conductor tracks (11, 11a), which are arranged at least on a surface of the printed circuit board (10) and serve for the electrical contacting of components, and with at least one testing zone (12), which is formed by a portion of the conductor track (11) and serves for the electrical contacting of a testing element (20), in particular a testing head, wherein the surface of the printed circuit board (10) is provided with a protective layer (14), which is formed in the testing zone (12) such that it is interrupted in the region of a contact zone (15), and wherein the contact zone (15) is provided with a layer (18), which establishes an electrical contacting of the testing element (20) with the layer (18). According to the invention, it is provided that the contact zone (15) is arranged at least partially at a lateral distance from the edges of the conductor track (11) in the region of the testing zone (12).

Abstract: The invention relates to a plug connection device, comprising a plug (7) which has contacts (8) and comprising mating contacts (4) arranged on a substrate (2), wherein the contacts (8) are intended for electrical contacting of the mating contacts (4). According to the invention, the plug (7) has at least one recess (18) for accommodating an element (10) arranged on the substrate (2).