Patents by Inventor Matthias Merz
Matthias Merz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11979503Abstract: The invention relates to a method for a secure transmission of electronic data packets in a network comprising network components.Type: GrantFiled: April 10, 2019Date of Patent: May 7, 2024Assignee: UBIRCH GMBHInventors: Michael Merz, Matthias Jugel
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Patent number: 11953486Abstract: The present invention relates to a sensor (1) for sensing organic carbon in a liquid (L), comprising: a container (2) having an interior space (20) for receiving the liquid (L), a photodetector (3), and a light source (4) configured to emit ultraviolet light (5) so that the ultraviolet light (5) travels along an optical path (P) through liquid (L) residing in the interior space (20) and is absorbable by carbon bonds of organic molecules in the liquid (L).Type: GrantFiled: July 19, 2020Date of Patent: April 9, 2024Assignee: SENSIRION AGInventors: Raffaele Di Giacomo, Matthias Streiff, Michael Merz, Nicolas Moeller
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Patent number: 11879752Abstract: A sensor module as well as a method for manufacturing a sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board, at least one sensor on the printed circuit board for measuring a parameter of the surrounding air and a housing for the printed circuit board. A part of the printed circuit board protrudes from an opening in the housing (10), wherein the at least one sensor (21, 22) is located on a front side of the protruding part of the printed circuit board. In addition, at least the front side of the protruding part of the printed circuit board, with the exception of a recess for the at least one sensor, is encapsulated with a filling compound. The sensor module can be used in an interior or an air duct of motor vehicles or buildings. In one embodiment, the sensor module measures temperature, relative humidity and gas concentration in a fluid, especially in the surrounding air.Type: GrantFiled: October 23, 2018Date of Patent: January 23, 2024Assignee: Sensirion AGInventors: Stephan Braun, Tobias Schmid, Thomas Brugger, Matthias Merz, Manuel Becker
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Publication number: 20220176780Abstract: The invention relates to a sensor module (1) for measuring at least one measurand, comprising: a housing (2) having a flow duct (23) with an air inlet (21) and an air outlet (22), the housing (2) enclosing an interior (20) of the housing (2); a circuit board (4) arranged in the interior (20); at least one sensor (3) which is arranged on the circuit board (4) and is designed to measure at least one measurand of an air flow (L) conducted past the sensor (3); a terminal (5) arranged on the circuit board (4) for making electrical contact with the sensor module (1); and a fan (6), which has a motor (60) and a rotor (61) which can be rotated about an axis of rotation (z) by means of the motor (60), the motor (60) being electrically conductively connected to the circuit board (4), and the fan (6) being designed to generate an air flow (L) in the flow duct (23) between the air inlet (21) and the air outlet (22) such that the air flow (L) flows past the sensor (3) and, in the region of the air inlet (21), flows in a fType: ApplicationFiled: April 6, 2020Publication date: June 9, 2022Applicant: SENSIRION AGInventors: Matthias MERZ, Manuel BECKER
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Publication number: 20210188625Abstract: Aspects of the invention relate to a semiconductor chip comprising a substrate and a stack arranged on the substrate. The stack comprises one or more insulating layers and one or more metal layers. The chip comprises a sensor device arranged in a sensor area (SA) of the semiconductor chip and processing circuitry arranged in a processing area (PA) of the semiconductor chip. The chip further comprises connection circuitry configured to provide an electrical connection between the sensor device and the processing circuitry. A first seal ring structure is arranged between an outer edge (ED) of the chip and an inner area (IA) of the chip. The inner area (IA) of the chip encompasses the sensor area (SA) and the processing area (PA). A second seal ring structure is arranged between the sensor area (SA) and the processing area (PA) and configured to constrain an infiltration of contaminants from the sensor area (SA) to the processing area (PA).Type: ApplicationFiled: May 17, 2018Publication date: June 24, 2021Applicant: Sensirion AGInventors: Matthias STUDER, Robert WÜEST, Matthias MERZ, Gijs VAN STEENWIJK, Dominikus KÖLBL, Cyrill KÜMIN
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Patent number: 10942141Abstract: The disclosure relates to a sensor for detecting and/or analysing a gas. The sensor comprises a substrate, a recess or opening arranged in the substrate, a first bridge structure and a second bridge structure. The first bridge structure and the second bridge structure extend over said recess or opening and are anchored in the substrate. The first bridge structure forms a first hotplate and comprises a first patch of sensing material, in particular of a metal oxide material, arranged on the first hotplate, electrodes adapted to measure an electrical property of the first patch and a heater adapted to heat the first hotplate. The second bridge structure comprises a temperature sensor. The sensor comprises circuitry for driving the heater and for processing signals from the electrodes and the temperature sensor.Type: GrantFiled: October 30, 2017Date of Patent: March 9, 2021Assignee: SENSIRION AGInventors: Matthias Merz, Mark Hornung, Felix Hoehne
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Publication number: 20210055139Abstract: A sensor module as well as a method for manufacturing a sensor module for determining a property of a fluid, in particular for measuring air quality, comprises a printed circuit board, at least one sensor on the printed circuit board for measuring a parameter of the surrounding air and a housing for the printed circuit board. A part of the printed circuit board protrudes from an opening in the housing (10), wherein the at least one sensor (21, 22) is located on a front side of the protruding part of the printed circuit board. In addition, at least the front side of the protruding part of the printed circuit board, with the exception of a recess for the at least one sensor, is encapsulated with a filling compound. The sensor module can be used in an interior or an air duct of motor vehicles or buildings. In one embodiment, the sensor module measures temperature, relative humidity and gas concentration in a fluid, especially in the surrounding air.Type: ApplicationFiled: October 23, 2018Publication date: February 25, 2021Inventors: Stephan BRAUN, Tobias SCHMID, Thomas BRUGGER, Matthias MERZ, Manuel BECKER
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Publication number: 20190293590Abstract: The disclosure relates to a sensor for detecting and/or analysing a gas. The sensor comprises a substrate, a recess or opening arranged in the substrate, a first bridge structure and a second bridge structure. The first bridge structure and the second bridge structure extend over said recess or opening and are anchored in the substrate. The first bridge structure forms a first hotplate and comprises a first patch of sensing material, in particular of a metal oxide material, arranged on the first hotplate, electrodes adapted to measure an electrical property of the first patch and a heater adapted to heat the first hotplate. The second bridge structure comprises a temperature sensor. The sensor comprises circuitry for driving the heater and for processing signals from the electrodes and the temperature sensor.Type: ApplicationFiled: October 30, 2017Publication date: September 26, 2019Applicant: SENSIRION AGInventors: Matthias MERZ, Mark HORNUNG, Felix HOEHNE
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Patent number: 10197520Abstract: Disclosed is an integrated circuit comprising a substrate (10) carrying a plurality of circuit elements; a metallization stack (12, 14, 16) interconnecting said circuit elements, said metallization stack comprising a patterned upper metallization layer comprising a first metal portion (20) and a second metal portion (21); a passivation stack (24, 26, 28) covering the metallization stack; a gas sensor including a sensing material portion (32, 74) on the passivation stack; a first conductive portion (38) extending through the passivation stack connecting a first region of the sensing material portion to the first metal portion; and a second conductive portion (40) extending through the passivation stack connecting a second region of the sensing material portion to the second metal portion. A method of manufacturing such an IC is also disclosed.Type: GrantFiled: July 24, 2012Date of Patent: February 5, 2019Assignee: ams International AGInventors: Matthias Merz, Aurelie Humbert, Roel Daamen, David Tio Castro
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Patent number: 9884715Abstract: A container for containing a perishable substance has a container wall with an inner side and an outer side. The wall has an electrically conductive layer extending between the inner side and the outer side. The inner side faces the space containing the substance. The container comprises electronic circuitry having a sensor for sensing a physical property or condition of the substance, and an antenna for communicating an RF signal to a receiver, external to the container. The RF signal is indicative of the physical property or condition sensed. The sensor is positioned so as to be exposed to the space containing the substance in operational use of the container. The antenna is positioned at the outer side, or between the outer side and the electrically conductive layer, and is electrically isolated from the electrically conductive layer.Type: GrantFiled: May 26, 2011Date of Patent: February 6, 2018Assignee: NXP B.V.Inventors: Romano Hoofman, Roel Daamen, Youri Victorovitch Ponomarev, Fotopoulou Kyriaki, Matthias Merz, Gilberto Curatola, Anton Tombeur
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Patent number: 9679857Abstract: Disclosed is a semiconductor device comprising a stack of patterned metal layers separated by dielectric layers, the stack comprising a first conductive support structure and a second conductive support structure and a cavity in which an inertial mass element comprising at least one metal portion is conductively coupled to the first support structure and the second support structure by respective conductive connection portions, at least one of said conductive connection portions being designed to break upon the inertial mass element being exposed to an acceleration force exceeding a threshold defined by the dimensions of the conductive connection portions. A method of manufacturing such a semiconductor device is also disclosed.Type: GrantFiled: September 15, 2016Date of Patent: June 13, 2017Assignee: NXP B.V.Inventors: Matthias Merz, Youri Victorovitch Ponomarev, Mark van Dal
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Patent number: 9651514Abstract: Disclosed is a pH and conductivity sensor including a carrier comprising a plurality of conductive tracks and an exposed conductive area defining a reference electrode connected to a first track of said plurality of conductive tracks, a sensing device mounted on the carrier and connected to at least a second track of said plurality of conductive tracks, the sensing device including an exposed surface that is sensitive to H+ concentrations, and a plurality of electrodes adjacent to the exposed surface, an encapsulation covering the carrier, said encapsulation including a first cavity exposing a surface of the sensing device, and a second cavity exposing the exposed conductive area.Type: GrantFiled: July 30, 2014Date of Patent: May 16, 2017Assignee: NXP B.V.Inventors: Dimitri Soccol, Matthias Merz
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Patent number: 9632049Abstract: Disclosed is an integrated circuit comprising an electrode arrangement for detecting the presence of a liquid, said electrode arrangement comprising a first electrode and a second electrode, wherein, prior to exposure of the electrode arrangement to said liquid, a surface of at least one of the first electrode and second electrode is at least partially covered by a compound that is soluble in the liquid; the electrical properties of the electrode arrangement being dependent on the amount of the compound covering said surface. An package and electronic device comprising such an IC and a method of manufacturing such an IC are also disclosed.Type: GrantFiled: December 7, 2010Date of Patent: April 25, 2017Assignee: AMS INTERNATIONAL AGInventors: Matthias Merz, Roel Daamen, Aurelie Humbert, Youri Victorovitch Ponomarev
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Patent number: 9606079Abstract: Disclosed is an integrated circuit comprising a substrate (10) carrying plurality of circuit elements (20); a plurality of sensing electrodes (34) over said substrate, each sensing electrode being electrically connected to at least one of said circuit elements; and a plurality of wells (50) for receiving a sample, each sensing electrode defining the bottom of one of said wells, wherein each sensing electrode comprises at least one portion (34?) extending upwardly into said well. A method of manufacturing such an IC is also disclosed.Type: GrantFiled: June 21, 2013Date of Patent: March 28, 2017Assignee: NXP B.V.Inventor: Matthias Merz
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Patent number: 9546884Abstract: A sensor comprising a silicon substrate having a first and a second surface, integrated circuitry provided on the first surface of the silicon substrate, and a sensor structure provided on the second surface of the silicon substrate. The sensor structure and the integrated circuitry are electrically coupled to each other.Type: GrantFiled: September 24, 2010Date of Patent: January 17, 2017Assignee: NXP B.V.Inventors: Roel Daamen, Aurelie Humbert, Matthias Merz, Youri Victorovitch Ponomarev
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Publication number: 20170005045Abstract: Disclosed is a semiconductor device comprising a stack of patterned metal layers separated by dielectric layers, the stack comprising a first conductive support structure and a second conductive support structure and a cavity in which an inertial mass element comprising at least one metal portion is conductively coupled to the first support structure and the second support structure by respective conductive connection portions, at least one of said conductive connection portions being designed to break upon the inertial mass element being exposed to an acceleration force exceeding a threshold defined by the dimensions of the conductive connection portions. A method of manufacturing such a semiconductor device is also disclosed.Type: ApplicationFiled: September 15, 2016Publication date: January 5, 2017Applicant: NXP B.V.Inventors: Matthias Merz, Youri Victorovitch Ponomarev, Mark van Dal
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Patent number: 9513247Abstract: An electrochemical sensor for sensing a target substance is disclosed. In one example, the sensor discloses an electrolyte matrix, wherein the matrix reposits an electrolyte; a working electrode coupled to the electrolyte matrix at a first location; a counter electrode coupled to the electrolyte matrix at a second location; an electrical circuit, coupled to the working electrode and the counter electrode, and capable of generating an output signal in response to an electrical current which flows between the working electrode and the counter electrode in response to a presence of the target substance.Type: GrantFiled: February 27, 2014Date of Patent: December 6, 2016Assignee: AMS INTERNATIONAL AGInventors: Matthias Merz, Dimitri Soccol
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Patent number: 9395318Abstract: There is disclosed an electrochemical sensor device comprising: an integrated electrochemical sensor element having: a substrate; first and second electrodes formed on the upper surface of the substrate; and an electrolyte layer formed on the first and second electrodes so as to electrically contact both the first and second electrodes; and a sensor integrated circuit electrically connected to the first and second electrodes of the integrated electrochemical sensor element. The integrated electrochemical sensor element and the sensor integrated circuit are provided in a single package.Type: GrantFiled: February 7, 2014Date of Patent: July 19, 2016Assignee: AMS INTERNATIONAL AGInventors: Matthias Merz, Dimitri Soccol
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Patent number: 9281239Abstract: A biocompatible electrode is manufactured by depositing filling metal 36 and etching back the filling metal to the surface of the surrounding insulator 30. Then, a further etch forms a recess 38 at the top of the via 32. An electrode metal 40 is then deposited and etched back to fill the recess 38 and form biocompatible electrode 42. In this way, a planar biocompatible electrode is achieved. The step of etching to form the recess may be carried out in the same CMP tool as is used to etch back the filling metal 36. A hydrogen peroxide etch may be used.Type: GrantFiled: October 26, 2009Date of Patent: March 8, 2016Assignee: NXP B.V.Inventors: Roel Daamen, Matthias Merz
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Publication number: 20150241375Abstract: An electrochemical sensor for sensing a target substance is disclosed. In one example, the sensor discloses an electrolyte matrix, wherein the matrix reposits an electrolyte; a working electrode coupled to the electrolyte matrix at a first location; a counter electrode coupled to the electrolyte matrix at a second location; an electrical circuit, coupled to the working electrode and the counter electrode, and capable of generating an output signal in response to an electrical current which flows between the working electrode and the counter electrode in response to a presence of the target substance.Type: ApplicationFiled: February 27, 2014Publication date: August 27, 2015Applicant: NXP B.V.Inventors: Matthias Merz, Dimitri Soccol