Abstract: A vacuum system, in particular an EUV lithography system, includes: a vacuum housing (2), in which a vacuum environment (16) is formed. A surface (2a) of the vacuum housing is subjected to contaminating particles (17) in the vacuum environment. A surface structure (18) at the surface reduces adhesion of the contaminating particles and has pore-shaped depressions (24) separated from one another by webs (25).

Abstract: A vacuum system, in particular an EUV lithography system, includes: a vacuum housing (2), in which a vacuum environment (16) is formed. A surface (2a) of the vacuum housing is subjected to contaminating particles (17) in the vacuum environment. A surface structure (18) at the surface reduces adhesion of the contaminating particles and has pore-shaped depressions (24) separated from one another by webs (25).

Abstract: A vacuum system, in particular an EUV lithography system, includes: a vacuum housing, in which a vacuum environment is formed, and also at least one component (14), e.g., an optical element, having a surface (14a) which is subjected to contaminating particles in the vacuum environment. A surface structure (18) is formed at the surface in order to reduce adhesion of the contaminating particles, said surface structure having pore-shaped depressions (24) separated from one another by webs (25). The optical element has a substrate (19), and a multilayer coating (20) applied to the substrate and configured to reflect EUV radiation (6). The surface structure formed at the surface (14a) of the multilayer coating (20) reduces adhesion of contaminating particles (17) via pore-shaped depressions (24) separated from one another by webs (25).

Abstract: A vacuum linear feed-through (20), e.g., for an EUV lithography system, includes: a vacuum diaphragm bellows (21), which has a first end (21a) attaching a component and a second end (21b), opposite the first end, attaching to a vacuum housing, and an actuator device (27) generating a linear reciprocating motion of the bellows. The feed-through has at least one first shield (30, 30?), connected to the bellows at the first end, and at least one second shield (31, 31?), connected to the bellows at the second end. The first and second shield annularly surround the bellows, and the first and second shield overlap in the longitudinal direction of the bellows (21). At least one first shield and at least one second shield are formed of a permanently magnetic material, and/or the feed-through has a voltage-generating device (33) generating an electric field (E) between the first shield and the second shield.

Abstract: A vacuum linear feed-through (20), e.g., for an EUV lithography system, includes: a vacuum diaphragm bellows (21), which has a first end (21a) attaching a component and a second end (21b), opposite the first end, attaching to a vacuum housing, and an actuator device (27) generating a linear reciprocating motion of the bellows. The feed-through has at least one first shield (30, 30?), connected to the bellows at the first end, and at least one second shield (31, 31?), connected to the bellows at the second end. The first and second shield annularly surround the bellows, and the first and second shield overlap in the longitudinal direction of the bellows (21). At least one first shield and at least one second shield are formed of a permanently magnetic material, and/or the feed-through has a voltage-generating device (33) generating an electric field (E) between the first shield and the second shield.

Abstract: A vacuum system, in particular an EUV lithography system, includes: a vacuum housing, in which a vacuum environment is formed, and also at least one component (14), e.g., an optical element, having a surface (14a) which is subjected to contaminating particles in the vacuum environment. A surface structure (18) is formed at the surface in order to reduce adhesion of the contaminating particles, said surface structure having pore-shaped depressions (24) separated from one another by webs (25). The optical element has a substrate (19), and a multilayer coating (20) applied to the substrate and configured to reflect EUV radiation (6). The surface structure formed at the surface (14a) of the multilayer coating (20) reduces adhesion of contaminating particles (17) via pore-shaped depressions (24) separated from one another by webs (25).