Abstract: A system, a method, and an apparatus are disclosed. In an embodiment, a system includes a host processor with a communications unit, a memory coupled to the communications unit, and a coprocessor coupled to the communications unit. The memory may include at least a first area and a second area. The coprocessor may be configured to request access to the first area of the memory via the communications unit. The communications unit may be configured to verify an identity of the coprocessor, and grant access to the first area of the memory responsive to a positive identification of the coprocessor.

Abstract: An integrated circuit package may have a package substrate with a surface to which an integrated circuit die is soldered. A first set of contacts on the package substrate may mate with contacts on the integrated circuit die. Solder may be used to connect the integrated circuit die to the first set of contacts. A covering material such as a plastic mold cap may be used to cover the integrated circuit die and the first set of contacts. The mold cap may have a rectangular shape or other footprint. A rectangular ring-shaped border region or a border region of other shapes may surround the mold cap and may be free of mold cap material. A second set of contacts on the package substrate may be formed on the surface in the border region.

Abstract: In the case of a method for working a tube made from a metallic material, wherein at least one punching is made in a tube wall of the tube at at least one first circumferential location of the tube wall, the tube wall is provided, at at least one second circumferential location, which faces away from the first circumferential location in the circumferential direction, with at least one forming selected from the group that consists of at least one depression of the tube wall, at least one throughhole in the tube wall.