Patents by Inventor Matthias Urben

Matthias Urben has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for mounting a semiconductor chip onto a substrate
    Patent number: 7407084
    Abstract: A method for mounting a semiconductor chip onto a substrate the side of which facing towards the substrate is coated with an adhesive layer is characterised by the following steps: (1) Lowering the semiconductor chip until the semiconductor chip touches the substrate, (2) Waiting a predetermined period of time during which a force exerted on the semiconductor chip disappears or is at least comparatively small, and (3) Applying a bond force.
    Type: Grant
    Filed: December 5, 2005
    Date of Patent: August 5, 2008
    Assignee: Unaxis Trading Ltd
    Inventor: Matthias Urben
  • Method for mounting a semiconductor chip onto a substrate
    Publication number: 20060118602
    Abstract: A method for mounting a semiconductor chip onto a substrate the side of which facing towards the substrate is coated with an adhesive layer is characterised by the following steps: (1) Lowering the semiconductor chip until the semiconductor chip touches the substrate, (2) Waiting a predetermined period of time during which a force exerted on the semiconductor chip disappears or is at least comparatively small, and (3) Applying a bond force.
    Type: Application
    Filed: December 5, 2005
    Publication date: June 8, 2006
    Inventor: Matthias Urben