Patents by Inventor Maureen A. Curran

Maureen A. Curran has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • GASKETLESS LOW TEMPERATURE HERMETIC SEALING WITH SOLDER
    Publication number: 20110024416
    Abstract: In accordance with the invention, containers or interfaces having two surfaces 201a and 201b to be joined, and a region to be sealed, are fused by providing between the surfaces 201a and 201b a thin strip or wire of RCM 102 embedded within a fusible material 101, applying pressure 205 and igniting the RCM 102. The released energy from the ignited RCM 102 results in a melting of the fusible material 101 and subsequent bonding of the fusible material 101 upon cooling to the 101 surrounding surfaces 201a and 201b, achieving a hermetic seal there between without the use of a separate gasket component.
    Type: Application
    Filed: June 26, 2008
    Publication date: February 3, 2011
    Applicant: REACTIVE NANOTECHNOLGIES, INC.
    Inventors: Yuwei Xun, David Van Heerden, Maureen A. Curran, Timothy P. Weihs