Abstract: An intermediate electrode layer is used to fabricate an integrated micro-electromechanical system. An intermediate electrode layer is formed on an integrated circuit wafer. The intermediate electrode layer places drive electrodes a predetermined height above the surface of the integrated circuit wafer. A micro-electromechanical system wafer having micromachined optical mirrors is bonded to the integrated circuit wafer such that the drive electrodes are positioned a predetermined distance from the optical mirrors.

Abstract: A flip-bonding technique is used to fabricate complex micro-electromechanical systems. Various micromachined structures are fabricated on the front side of each of two wafers. One of the wafers is flipped over and bonded to the other wafer so that the front sides of the two wafers are bonded together in a flip-stacked configuration.

Abstract: A position sensor includes a receiver capable of receiving a position signal from an external source, and an inertial motion unit capable of sensing movement and producing a movement signal based upon the sensed movement. The position sensor also includes a processor operatively coupled with the receiver and the inertial motion unit. The processor is capable of calculating position information based on at least one of the position signal and the movement signal. Moreover, the receiver, inertial motion unit and processor are formed on a single chip.

Abstract: A method of producing a shadow mask having a set of apertures (the set of apertures including a given aperture with an aperture boundary) uses a wafer having at least a first silicon layer, a second silicon layer, and an insulator layer between the first and second silicon layers. A first portion of the first silicon layer within the aperture boundary is removed. This produces a second portion of the first silicon layer, which remains within the aperture boundary. The second silicon layer within the aperture boundary is removed, as well as the insulator layer within the aperture boundary. The second portion of the first silicon layer remaining within the aperture boundary then is removed.

Abstract: A probe card characterizes optical structures formed on a MEMS wafer. The probe includes a substrate having a circuit thereon. The substrate has an opening wherein a plurality of metal probes, electrically coupled to the circuit, pass through the opening. The probe card further includes an optical test device electrically coupled to the circuit. The optical test device includes a light source and a photosensitive area. The photosensitive area receives directly light reflected from the optical structures. The optical test device can be positioned directly over the opening, or the optical test device can be positioned on a periphery of the opening. Furthermore, the optical test device can be positioned so as to provide a test light beam that is parallel to the wafer to test pop-up optical MEMS components. The optical test device also may be positioned between the probe card and the MEMS wafer.

Abstract: A packaged device includes a package substrate and a plurality of optical structures formed on a semiconductive substrate and positioned on the package substrate, forming an active area. The packaged device further includes a contiguous solderable seal structure surrounding the plurality of optical structures and a cap formed over the plurality of optical structures and upon the contiguous solderable seal structure. The cap has, formed thereon, patterned metalization. The patterned metalization is located over the active area.

Abstract: A cover cap for semiconductor wafer devices is disclosed. According to the invention, a wafer of material that is at least one of photo-etchable or transparent is patterned and attached as a cover to a substrate including a number of semiconductor devices. Preferably, the cover wafer is made from a photo-etchable material so that portions of the cover wafer may be selectively sensitized and etched. In particular, one or more cover caps may be defined in the cover wafer such that each cover cap corresponds to a respective device on the device substrate. Once the cover wafer is attached to the device substrate to form an assembly, the assembly is diced into individual devices and the devices are packaged. The invention provides several advantages for a number of semiconductor device fabrication applications, including those relating to image sensors, and micro-machined devices such as MEMS.

Abstract: Individual caps are provided for mutually spaced MEMS on a common wafer by establishing a fixed spatial array of caps in positions that correspond to the positions of the MEMS on the wafer, and simultaneously bonding the caps to corresponding MEMS. The caps are preferably held in place within recesses in a template, and include protective sealing rings that are bonded to the MEMS wafer. The wafer is diced into individual MEMS chips after the caps have been bonded. The caps can be provided with circuitry that faces away from MEMS wafer and is wire bonded to the wafer, or that faces towards the wafer with a flip-chip mounting.

Abstract: A miniature, full-color display includes two rows of light-emitting elements that are both selected to emit light in substantially non-overlapping wavelength ranges comprising a blue-green wavelength range and a red wavelength range. The light-emitting elements as well as a magnifying lens, and an oscillating mirror are placed in a light-tight box having an opening through which the mirror may be viewed. The light from the blue-green elements is filtered by a filter which transmits either blue or green light depending on the mirror movement. The light-emitting devices are selectively illuminated as the mirror moves to create a full-color, substantially planar, two-dimensional image. The light box may be sized to be hand-held, or may be capable of being mounted to a pair of glasses, a headband or similar device.

Abstract: Deformation of TAB tapes due to temperature changes is prevented by thermo-mechanical leads. In one embodiment of the invention, a semiconductor device (30) includes an electronic component (31) and a TAB tape. The tape includes a carrier film (12) and electrical leads (20) formed on the carrier film. The electrical leads are electrically coupled to the electronic component. Also included on the carrier film are thermo-mechanical leads (32) which are formed in opposing regions of the carrier film, regions which are typically void of leads. The thermo-mechanical leads have approximately the same lead pitch as the electrical leads in order to provide a uniform distribution of stresses across the TAB tape upon exposure to varying temperatures.

Abstract: Deformation of TAB tapes due to temperature changes is prevented by thermo-mechanical leads. In one embodiment of the invention, a semiconductor device (30) includes an electronic component (31) and a TAB tape. The tape includes a carrier film (12) and electrical leads (20) formed on the carrier film. The electrical leads are electrically coupled to the electronic component. Also included on the carrier film are thermo-mechanical leads (32) which are formed in opposing regions of the carrier film, regions which are typically void of leads. The thermo-mechanical leads have approximately the same lead pitch as the electrical leads in order to provide a uniform distribution of stresses across the TAB tape upon exposure to varying temperatures.

Abstract: A test probe for testing electronic circuits is provided with a flexible conductive pad disposed at the end of the test probe. The flexible conductive pad is resilient so that when it makes physical and electrical contact with an electronic circuit, it compresses and does not damage either the electrical circuit or the probe itself.

Abstract: A semiconductor device having a package sealed by a UV-curable, thixotropic, acrylated epoxy and a method for sealing the package are disclosed. The package is sealed at room temperature by polymer cross-linking of the epoxy which is initiated by exposure of at least a portion of the expoxy to ultraviolet (UV) frequency radiation. In accordance with one embodiment of the invention, a base is provided having an electronic component attached to the base at a predetermined location. A lid having a layer of UV-curable epoxy screen-printed to a bonding portion is positioned onto the base enclosing the electronic component within a cavity formed by the union of the base and the lid. The lid is sealed to the base at room temperature by irradiating an exposed edge portion of the epoxy layer with UV frequency radiation. The formation of the seal at room temperature avoids thermal damage to temperature sensitive materials in both the package and the enclosed electronic component.

Abstract: A variable thickness intermediate cooling member adapted to be disposed between a circuit board having electronic module or packages mounted thereon and a cold plate providing thermal coupling between the cold plate and the circuit board. The intermediate cooling member is comprised of a foldable heat conductive member having a manually operable handle for moving the member between a maximum thickness circuit board engaging position to provide thermal contact, and a minimum thickness circuit board disengaging position to enable access to the circuit board.