Patents by Inventor Mavyn McAuliffe

Mavyn McAuliffe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Lasable bond-ply materials for high density printed wiring boards
    Publication number: 20040170795
    Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
    Type: Application
    Filed: November 17, 2003
    Publication date: September 2, 2004
    Applicant: AlliedSignal Inc.
    Inventors: David R. Haas, Chengzeng Xu, Mavyn McAuliffe, Scott Zimmerman, Laura Miller, Meifang Qin, Baopei Xu, Richard J. Pommer
  • Lasable bond-ply materials for high density printed wiring boards
    Patent number: 6673190
    Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
    Type: Grant
    Filed: April 4, 2001
    Date of Patent: January 6, 2004
    Assignee: Honeywell International Inc.
    Inventors: David Haas, Chengzeng Xu, Mavyn McAuliffe, Scott Zimmerman, Laura Miller, Meifang Qin, Baopei Xu, Richard Pommer
  • Microfiber dielectrics which facilitate laser via drilling
    Patent number: 6530147
    Abstract: This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.
    Type: Grant
    Filed: November 7, 2000
    Date of Patent: March 11, 2003
    Assignee: Honeywell International Inc.
    Inventors: David R. Haas, Chengzeng Xu, Mavyn McAuliffe
  • Lasable bond-ply materials for high density printed wiring boards
    Publication number: 20020004352
    Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
    Type: Application
    Filed: April 4, 2001
    Publication date: January 10, 2002
    Applicant: AlliedSignal, Inc.
    Inventors: David Haas, Chengzeng Xu, Mavyn McAuliffe, Scott Zimmerman, Laura Miller, Meifang Qin, Baopei Xu, Richard Pommer
  • Lasable bond-ply materials for high density printed wiring boards
    Patent number: 6245696
    Abstract: This invention concerns lasable bond-ply materials comprising a nonwoven reinforcing material and at least one resin material. The present invention also includes methods for using the bond-ply of this invention to manufacture high density multilayer printed wiring boards.
    Type: Grant
    Filed: June 25, 1999
    Date of Patent: June 12, 2001
    Assignee: Honeywell International Inc.
    Inventors: David R. Haas, Chengzeng Xu, Mavyn McAuliffe, Scott Zimmerman, Laura Miller, Meifang Qin, Baopei Xu, Richard J. Pommer
  • Microfiber dielectrics which facilitate laser via drilling
    Patent number: 6224965
    Abstract: This invention concerns electronic substrates comprising a non-woven filler material and a resin material. The present invention also includes electronic products manufactured from the electronic substrates of this invention including, but not limited to prepregs, metal clad laminates, and printed wiring boards with and without lased via holes. The present invention further includes a method of manufacturing printed built-up wiring boards including the steps of forming a prepreg and forming at least one via in the prepreg.
    Type: Grant
    Filed: June 25, 1999
    Date of Patent: May 1, 2001
    Assignee: Honeywell International Inc.
    Inventors: David R. Haas, Chengzeng Xu, Mavyn McAuliffe