Patents by Inventor Max Siebert
Max Siebert has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11590528Abstract: The present invention discloses a tool holding device for shank type tools, comprising at least one tool holder, a base part and a top part, whereby at least the top part comprises uptake holes for the at least one tool holder characterized in that, the tool holding device can be used for more than one process step among transfer, cleaning, pretreatment, coating, posttreatment, and each of the at least one tool holders can optionally take up a sleeve holding the shank type tool in a distinct, preferably upright position and comprises one or more openings, which allow fluid and/or solid treatment agents to exit the tool holder and/or sleeve and the at least one tool holder and/or sleeve enables three-fold rotation of the shank type tool. Further a method using the inventive tool holding device is disclosed.Type: GrantFiled: February 16, 2018Date of Patent: February 28, 2023Assignee: OERLIKON SURFACE SOLUTIONS AG, PFÄFFIKONInventors: Remo Vogel, Max Siebert, Mario Rombach, Philipp Bartholet, Masar Demiri, Dieter Mueller, Sven Hegersweiler, Sebastian Benedikt, Roger Walt
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Publication number: 20230042478Abstract: The invention relates to a holding device (2) for holding a magnetizable substrate (8) during machining of at least one substrate surface, in particular of a magnetizable tool to be machined, comprising a magnetic holding unit (4) arranged at the end for fixing the substrate (8) at the end by forming a magnetic field, a receiving unit (6) arranged on the holding unit (4) for receiving the substrate (8), a replaceable adapter unit (10) arranged within the receiving unit (6) for guiding and shielding the substrate (8), the adapter unit (10) having at least one recess (12) for the feedthrough of the substrate (8), the substrate (8) being fixable within the holding device (2) in a laterally supported manner by means of the recess (12).Type: ApplicationFiled: December 16, 2020Publication date: February 9, 2023Inventors: Dieter Mueller, Max Siebert, Christoph Hoeweling
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Publication number: 20230026860Abstract: The invention relates to a holding system (1) for holding substrates (12) for use in a surface processing system having a covering area (20), comprising a plurality of fixing elements (2), a body (24) arranged within the covering area (20) for receiving the fixing elements (2), and a positioning element (26) for adjusting the covering and a machining area (20, 22), wherein a plurality of substrates (12) can be fixed by the fixing elements (2) and processed within the machining area (22).Type: ApplicationFiled: December 16, 2020Publication date: January 26, 2023Inventors: Max Siebert, Jens Eggemann, Christian Becker, Dieter Mueller
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Patent number: 11286402Abstract: Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a triazine derivative of the general formula (I) wherein R1, R2, R3, R4, R5 and R6 are independently from each other H, methyl, ethyl, propyl, butyl, pentyl, C2-C10-alkylcarboxylic acid, hydroxymethyl, vinyl or allyl (C) at least one amino acid, (D) at least one oxidizer (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.Type: GrantFiled: December 11, 2015Date of Patent: March 29, 2022Inventors: Robert Reichardt, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim, Reza Golzarian, Haci Osman Guevenc, Julian Proelss, Leonardus Leunissen
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Patent number: 11264250Abstract: Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) an anionic surfactant of the general formula (I) R-S wherein R is C5-C20-alkyl, C5-C20-alkenyl, C5-C20-alkylacyl or C5-C20-alkenylacyl and S is a sulfonic acid derivative, an amino acid derivative or a phosphoric acid derivative or salts or mixtures thereof (C) at least one amino acid, (D) at least one oxidizer (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.Type: GrantFiled: April 27, 2016Date of Patent: March 1, 2022Inventors: Robert Reichardt, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim, Reza M Golzarian, Haci Osman Guevenc, Julian Proelss, Leonardus Leunissen
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Publication number: 20210102093Abstract: A chemical mechanical polishing composition may be used for chemical mechanical polishing of a substrate including (i) cobalt and/or (ii) a cobalt alloy and (iii) TiN and/or TaN, wherein the CMP composition includes (A) inorganic particles (B) at least one organic compound including an amino-group and an acid group, the compound including n amino groups and at least n+1 acidic protons, a being a integer ?1; (C) at least one oxidizer in an amount of from 0.2 to 2.5 wt.-% based on the total weight of the MP composition; and (D) an aqueous medium. The CMP composition may have a pH of more than 6 and less than 9.Type: ApplicationFiled: December 16, 2020Publication date: April 8, 2021Applicant: BASF SEInventors: Robert REICHARDT, Max SIEBERT, Yongqing LAN, Michael LAUTER, Sheik USMAN IBRAHIM, Reza M. GOLZARIAN, Te Yu WEI, Haci Osman GUEVENC, Julian PROELSS, Leonardus LEUNISSEN
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Patent number: 10899945Abstract: Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy and (iii) Ti N and/or TaN, wherein the CMP composition (Q) comprises (E) Inorganic particles (F) at least one organic compound comprising an amino-group and an acid group (Y), wherein said compound comprises n amino groups and at least n+1 acidic protons, wherein n is a integer?1. (G) at least one oxidizer in an amount of from 0.2 to 2.5 wt.-% based on the total weight of the respective CMP composition, (H) an aqueous medium wherein the CMP composition (Q) has a pH of more than 6 and less than 9.Type: GrantFiled: August 9, 2016Date of Patent: January 26, 2021Assignee: BASF SEInventors: Robert Reichardt, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim, Reza M. Golzarian, Te Yu Wei, Haci Osman Guevenc, Julian Proelss, Leonardus Leunissen
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Patent number: 10865361Abstract: Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) one or more water-soluble nonionic copolymers of the general formula (I) and mixtures thereof, formula (I) wherein R1 and R3 are independently from each other hydrogen, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-Butyl, or sec-butyl, R2 is methyl and x and y are an integer, 1 (B)poly(acrylic acid) (PAA) or acrylic acid-maleic acid copolymer with a mass average molar mass (Mw) of up to 10,000 g/mol, and (C) water, wherein the pH of the composition is in the range of from 7.0 to 10.5.Type: GrantFiled: May 31, 2017Date of Patent: December 15, 2020Assignee: BASF SEInventors: Christian Daeschlein, Max Siebert, Michael Lauter, Leonardus Leunissen, Ivan Garcia Romero, Haci Osman Guevenc, Peter Przybylski, Julian Proelss, Andreas Klipp
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Patent number: 10844325Abstract: A post chemical-mechanical-polishing (post-CMP) cleaning composition including: (A) polyethylene glycol (PEG) with a mass average molar mass (Mw) in the range of from 400 to 8,000 g/mol, (B) an anionic polymer selected from poly(acrylic acid) (PAA), acrylic acid-maleic acid copolymers, polyaspartic acid (PASA), polyglutamic acid (PGA), polyvinylphosphonic acid, polyvinylsulfonic acid, poly(styrenesulfonic acid), polycarboxylate ethers (PCE), PEG-phosphorous acids, and copolymers of the polymers thereof, and (C) water, where the pH of the composition is from 7.0 to 10.5.Type: GrantFiled: December 20, 2016Date of Patent: November 24, 2020Assignee: BASF SEInventors: Christian Daeschlein, Max Siebert, Michael Lauter, Peter Przybylski, Julian Proelss, Andreas Klipp, Haci Osman Guevenc, Leonardus Leunissen, Roelf-Peter Baumann, Te Yu Wei
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Patent number: 10844333Abstract: Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) one or more nonionic polymers selected from the group consisting of poly-acrylamides, polyhydroxyethyl(meth)acrylates (PHE(M)A), polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), polymers of formula (I), and mixtures thereof, wherein R1 is hydrogen, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl, or sec-butyl, R2 is hydrogen or methyl, and n is an integer, (B) poly(acrylic acid) (PAA) or acrylic acid-maleic acid copolymer with a mass average molar mass (Mw) of up to 10,000 g/mol, and (C) water, wherein the pH of the composition is in the range of from 7.0 to 10.5.Type: GrantFiled: December 20, 2016Date of Patent: November 24, 2020Assignee: BASF SEInventors: Christian Daeschlein, Max Siebert, Michael Lauter, Piotr Przybylski, Julian Proelss, Andreas Klipp, Haci Osman Guevenc, Leonardos Leunissen, Roelf-Peter Baumann, Te Yu Wei
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Publication number: 20200299547Abstract: The presently claimed subject matter is directed to a chemical mechanical polishing (CMP) composition comprising inorganic particles, at least one organic compound comprising an amino group and/or at least one acid group (Y), potassium persulfate, at least one corrosion inhibitor and an aqueous medium for polishing substrates of the semiconductor industry comprising cobalt and/or a cobalt alloy and TiN and/or TaN.Type: ApplicationFiled: November 12, 2018Publication date: September 24, 2020Applicant: BASF SEInventors: Christian DAESCHLEIN, Max SIEBERT, Yongqing LAN, Michael LAUTER, Sheik Ansar USMAN IBRAHIM, Reza M GOLZARIAN, Te Yu WEI, Haci Osman GUEVENC, Julian PROELSS, Leonardus LEUNISSEN
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Publication number: 20200294813Abstract: Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) an anionic surfactant of the general formula (I) R-S wherein R is C5-C20-alkyl, C5-C20-alkenyl, C5-C20-alkylacyl or C5-C20-alkenylacyl and S is a sulfonic acid derivative, an amino acid derivative or a phosphoric acid derivative or salts or mixtures thereof (C) at least one amino acid, (D) at least one oxidizer (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.Type: ApplicationFiled: April 27, 2016Publication date: September 17, 2020Applicant: BASF SEInventors: Robert REICHARDT, Max SIEBERT, Yongqing LAN, Michael LAUTER, Sheik Ansar USMAN IBRAHIM, Reza M GOLZARIAN, Haci Osman GUEVENC, Julian PROELSS, Leonardus LEUNISSEN
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Patent number: 10738219Abstract: Use of a chemical mechanical polishing (CMP) composition for polishing of cobalt and/or co-balt alloy comprising substrates Abstract Use of a chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) comprising (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) comprises (A) Inorganic particles (B) a substituted tetrazole derivative of the general formula (I), wherein R1 is H, hydroxy, alkyl, aryl, alkylaryl, amino, carboxyl, alkylcarboxyl, thio or alkylthio. (C) at least one amino acid (D) at least one oxidizer, (E) an aqueous medium and wherein the CMP composition (Q) has a pH of from 7 to 10.Type: GrantFiled: December 16, 2015Date of Patent: August 11, 2020Assignee: BASF SEInventors: Robert Reichardt, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim, Reza M Golzarian, Haci Osman Guevenc, Julian Proelss, Leonardus Leunissen
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Patent number: 10570316Abstract: A chemical mechanical polishing (CMP) composition (Q) comprising (A) Colloidal or fumed inorganic particles (A) or a mixture thereof in a total amount of from 0.0001 to 2.5 wt.-% based on the total weight of the respective CMP composition (B) at least one amino acid in a total amount of from 0.2 to 1 wt.-% based on the total weight of the respective CMP composition (C) at least one corrosion inhibitor in a total amount of from 0.001 to 0.02 wt.-% based on the total weight of the respective CMP composition (D) hydrogen peroxide as oxidizing agent in a total amount of from 0.0001 to 2 wt.-% based on the total amount of the respective CMP composition (E) aqueous medium wherein the CMP composition (Q) has a pH in the range of from 6 to 9.5.Type: GrantFiled: July 14, 2015Date of Patent: February 25, 2020Assignee: BASF SEInventors: Robert Reichardt, Max Siebert, Yongqing Lan, Michael Lauter, Haci Osman Guevenc, Julian Proelss, Sheik Ansar Usman Ibrahim, Reza Golzarian
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Publication number: 20190388931Abstract: The present invention discloses a tool holding device for shank type tools, comprising at least one tool holder, a base part and a top part, whereby at least the top part comprises uptake holes for the at least one tool holder characterized in that, the tool holding device can be used for more than one process step among transfer, cleaning, pretreatment, coating, posttreatment, and each of the at least one tool holders can optionally take up a sleeve holding the shank type tool in a distinct, preferably upright position and comprises one or more openings, which allow fluid and/or solid treatment agents to exit the tool holder and/or sleeve and the at least one tool holder and/or sleeve enables three-fold rotation of the shank type tool. Further a method using the inventive tool holding device is disclosed.Type: ApplicationFiled: February 16, 2018Publication date: December 26, 2019Inventors: Remo Vogel, Max Siebert, Mario Rombach, Philipp Bartholet, Masar Demiri, Dieter Mueller, Sven Hegersweiler, Sebastian Benedikt, Roger Walt
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Patent number: 10385236Abstract: A chemical mechanical polishing (CMP) composition (Q) for chemical mechanical polishing of a substrate (S) containing (i) cobalt and/or (ii) a cobalt alloy, wherein the CMP composition (Q) contains: (A) Inorganic particles, (B) a substituted aromatic compound with at least one carboxylic acid function as corrosion inhibitor, (C) at least one amino acid, (D) at least one oxidizer, (E) an aqueous medium, wherein the CMP composition (Q) has a pH of from 7 to 10.Type: GrantFiled: December 22, 2015Date of Patent: August 20, 2019Assignee: BASF SEInventors: Robert Reichardt, Max Siebert, Yongqing Lan, Michael Lauter, Sheik Ansar Usman Ibrahim, Reza Golzarian, Haci Osman Guevenc, Julian Proelss, Leonardus Leunissen
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Publication number: 20190144781Abstract: Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) one or more water-soluble nonionic copolymers of the general formula (I) and mixtures thereof, formula (I) wherein R1 and R3 are idependently from each other hydrogen, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-Butyl, or sec-butyl, R2 is methyl and x and y are an integer,1 (B)poly(acrylic acid) (PAA) oracrylic acid-maleic acid copolymer with a mass average molar mass (Mw) of up to 10,000 g/mol, and (C)water, wherein the pH of the composition is in the range of from 7.0 to 10.5.Type: ApplicationFiled: May 31, 2017Publication date: May 16, 2019Applicant: BASF SEInventors: Christian DAESCHLEIN, Max SIEBERT, Michael LAUTER, Leonardus LEUNISSEN, Ivan GARCIA ROMERO, Haci Osman GUEVENC, Peter PRZYBYLSKI, Julian PROELSS, Andreas KLIPP
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Patent number: 10227506Abstract: Disclosed herein is a chemical mechanical polishing (CMP) composition (Q) containing (A) inorganic particles, (B) a compound of general formula (I) below, and (C) an aqueous medium, in which the composition (Q) has a pH of from 2 to 6.Type: GrantFiled: December 4, 2015Date of Patent: March 12, 2019Assignee: BASF SEInventors: Max Siebert, Michael Lauter, Yongqing Lan, Robert Reichardt, Alexandra Muench, Manuel Six, Gerald Daniel, Bastian Marten Noller, Kevin Huang, Sheik Ansar Usman Ibrahim
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Publication number: 20190002802Abstract: Described is a post chemical-mechanical-polishing (post-CMP) cleaning composition comprising or consisting of: (A) one or more nonionic polymers selected from the group consisting of poly-acrylamides, polyhydroxyethyl(meth)acrylates (PHE(M)A), polyvinylpyrrolidone (PVP), polyvinyl alcohol (PVA), polymers of formula (I), and mixtures thereof, wherein R1 is hydrogen, methyl, ethyl, n-propyl, iso-propyl, n-butyl, iso-butyl, or sec-butyl, R2 is hydrogen or methyl, and n is an integer, (B) poly(acrylic acid) (PAA) or acrylic acid-maleic acid copolymer with a mass average molar mass (Mw) of up to 10,000 g/mol, and (C) water, wherein the pH of the composition is in the range of from 7.0 to 10.5.Type: ApplicationFiled: December 20, 2016Publication date: January 3, 2019Applicant: BASF SEInventors: Christian DAESCHLEIN, Max SIEBERT, Michael LAUTER, Piotr PRZYBYLSKI, Julian PROELSS, Andreas KLIPP, Haci Osman GUEVENC, Leonardus LEUNISSEN, Roelf-Peter BAUMANN, Te Yu WEI
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Patent number: D881242Type: GrantFiled: January 29, 2018Date of Patent: April 14, 2020Assignee: Oerlikon Surface Solutions AG, PfaffikonInventors: Ewald Riedel, Armin Vester, Max Siebert