Abstract: In various aspects and embodiments, the present disclosure relates to the manner in which precursor materials are provided to processing equipment and, more specifically, to the manner in which precursor materials of organic polymers are delivered to systems for forming and, in some embodiments, depositing the organic polymers. In one aspect, the disclosure relates to precursor supplies, which comprise vehicles, such as binders, supports and cartridges, for delivering a precursor material to a material processing system, such as a deposition system or other processing equipment. In another aspect, the disclosure relates to material processing systems with which the precursor supplies are configured to be used. Methods for preparing precursor supplies, using precursor supplies, providing process control, and recycling precursor supplies are also disclosed.

Abstract: An electronic device includes a port for connecting the electronic device to other electronic devices and a moisture detector configured to detect an electrically conductive liquid in the first port. The moisture detector is configured to maintain a voltage on a first electrical contact of the port and to detect a short circuit between the first electrical contact and a second electrical contact of the port. The moisture detector determines that the electronic device has been exposed to an electrically conductive liquid if the monitor module detects the short circuit. The moisture detector may also put the electronic device into safe mode if it is exposed to an electrically conductive liquid.

Abstract: Systems, devices and methods for sensing moisture within an electronic device are disclosed. A device may include a housing and a display defining an exterior of an electronic device and an interior of the electronic device. Further, the device may include an integrated circuit (IC) within the electronic device and a control element within the electronic device. The device may also include a moisture sensor such as an inductive sensor, a capacitance sensor, or both. The moisture sensor, which may be part of the IC, together with the control element may sense moisture within the electronic device.

Abstract: A material processing system that prevents transmission of infrared radiation from its pyrolysis tube to one or more adjacent elements, such as a vaporization chamber or a deposition chamber, is disclosed. Such a material processing system may include at least one conduit with a non-linear element. The non-linear element of such a conduit may preclude the presence of a line-of-sight through the length of the conduit. The non-linear element may also have a shape that enables gas or vapor to flow therethrough with little or no turbulence, which, in embodiments where part or all of the material processing system lacks valves, enables the gas or vapor to flow freely through the material processing system, or at least through the valveless portion thereof.

Abstract: Systems and methods for monitoring the moisture to which an electronic device is exposed may alter or vary operation of the electronic device. Operation of the electronic device may be altered or varied to provide a notification that the electronic device has been exposed to moisture. When an electronic device is exposed to moisture, an operational mode of the electronic device may be changed. A change in the operational mode of the electronic device may include termination of the supply of power to one or more components, which may protect those components. Programs or apps that provide a user of the electronic device with information regarding exposure of the electronic device to an amount of moisture that meets or exceeds a moisture response threshold are also disclosed.

Abstract: A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.

Abstract: One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

Abstract: An electronic device includes a port for connecting the electronic device to other electronic devices and a moisture detector configured to detect an electrically conductive liquid in the first port. The moisture detector is configured to maintain a voltage on a first electrical contact of the port and to detect a short circuit between the first electrical contact and a second electrical contact of the port. The moisture detector determines that the electronic device has been exposed to an electrically conductive liquid if the monitor module detects the short circuit. The moisture detector may also put the electronic device into safe mode if it is exposed to an electrically conductive liquid.

Abstract: An approach to refurbishing or remanufacturing an electronic device may involve exposing electrical components that are situated within an interior of the electronic device. The approach may also involve replacing one or more defective electronic components of the electronic device with one or more replacement components and applying a protective coating to at least a portion of the interior of the electronic device. The protective coating may cover the circuit board and the electronic components it carries. The protective coating may also cover at least some of the electrical connections of the electronic device. The protective coating may also be applied to the replacement component prior to reassembly. The resulting refurbished or remanufactured electronic device may thus be provided with moisture resistance to help protect the electronic device from damage caused by exposure to moisture.

Abstract: An electronic device includes a port for connecting the electronic device to other electronic devices and a moisture detector configured to detect an electrically conductive liquid in the first port. The moisture detector is configured to maintain a voltage on a first electrical contact of the port and to detect a short circuit between the first electrical contact and a second electrical contact of the port. The moisture detector determines that the electronic device has been exposed to an electrically conductive liquid if the monitor module detects the short circuit. The moisture detector may also put the electronic device into safe mode if it is exposed to an electrically conductive liquid.

Abstract: An electronic device includes a port for connecting the electronic device to other electronic devices and a moisture detector configured to detect an electrically conductive liquid in the first port. The moisture detector is configured to maintain a voltage on a first electrical contact of the port and to detect a short circuit between the first electrical contact and a second electrical contact of the port. The moisture detector determines that the electronic device has been exposed to an electrically conductive liquid if the monitor module detects the short circuit. The moisture detector may also put the electronic device into safe mode if it is exposed to an electrically conductive liquid.

Abstract: Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.

Abstract: The disclosure extends to moisture resistant energy storage devices, such as rechargeable batteries, and associated methods of forming the same. An energy storage device, such as a rechargeable battery, may comprise a cell including at least one electrical terminal and a circuit board electrically coupled to the at least one electrical terminal. The rechargeable battery may also include a moisture resistant coating on at least a portion of at least one of a surface of the cell and a surface of the circuit board. A moisture resistant coating may reside between the circuit board and the cell.

Abstract: Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.

Abstract: An apparatus for applying a protective coating to a high volume of separate electronic device assemblies includes a treatment element that is configured to prepare the high volume of electronic devices before protective coatings are applied to the electronic devices. The apparatus also includes a coating element configured to apply protective coatings to the high volume of separate electronic device assemblies.

Abstract: A coating apparatus may be configured to concurrently receive and waterproof a large number of electronic device assemblies. The coating apparatus may include a track for transporting the electronic device assemblies into an application station. The application station may have a cubic shape, and include an entry door and an opposite exit door. The entry and exit doors may enable the introduction of substrates into the application station, as well as their removal from the application station. In addition, the entry and exit doors may enable isolation of the application station from an exterior environment and, thus, provide control over the conditions under which a moisture resistant material is applied to the substrates. Methods for making electronic devices and other substrates resistant to moisture are also disclosed.

Abstract: Systems and methods for monitoring the moisture to which an electronic device is exposed may alter or vary operation of the electronic device. Operation of the electronic device may be altered or varied to provide a notification that the electronic device has been exposed to moisture. When an electronic device is exposed to moisture, an operational mode of the electronic device may be changed. A change in the operational mode of the electronic device may include termination of the supply of power to one or more components, which may protect those components. Programs or apps that provide a user of the electronic device with information regarding exposure of the electronic device to an amount of moisture that meets or exceeds a moisture response threshold are also disclosed.

Abstract: One or more masks may be used to control the application of protective (e.g., moisture-resistant, etc.) coatings to one or more portions of various components of an electronic device during assembly of the electronic device. A method for applying a protective coating to an electronic device includes assembling two or more components of the electronic device with one another. A mask may then be applied to the resulting electronic assembly. The mask may shield selected portions of the electronic assembly, while other portions of the electronic assembly, i.e., those to which a protective coating is to be applied, may remain exposed through the mask. With the mask in place, application of a protective coating to portions of the electronic assembly exposed through the mask may commence. After application of the protective coating, the mask may be removed from the electronic assembly. Embodiments of masked electronic assemblies are also disclosed.

Abstract: A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.

Abstract: A moisture-resistant electronic device includes at least one electronic component at least partially covered by a moisture-resistant coating. The moisture-resistant coating may be located within an interior of the electronic device. The moisture-resistant coating may cover only portions of a boundary of an internal space within the electronic device. A moisture-resistant-coating may include one or more discernible boundaries, or seams, which may be located at or adjacent to locations where two or more components of the electronic device interface with each other. Assembly methods are also disclosed.