Patents by Inventor Maxat N. Touzelbaev

Maxat N. Touzelbaev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor chip thermal interface structures
    Patent number: 8304291
    Abstract: Various thermal interface structures and methods are disclosed. In one aspect, a method of manufacturing is provided. The method includes providing plural carbon nanotubes in a thermal interface structure. The thermal interface structure is soldered to a side of a semiconductor chip. In another aspect, an apparatus is provided. The apparatus includes a thermal interface structure that has plural carbon nanotubes. A semiconductor chip is soldered to the thermal interface structure.
    Type: Grant
    Filed: June 29, 2009
    Date of Patent: November 6, 2012
    Assignees: Advanced Micro Devices, Inc., ATI Technologies ULC
    Inventors: Maxat N. Touzelbaev, Gamal Refai-Ahmed
  • Semiconductor Chip Thermal Interface Structures
    Publication number: 20100327431
    Abstract: Various thermal interface structures and methods are disclosed. In one aspect, a method of manufacturing is provided. The method includes providing plural carbon nanotubes in a thermal interface structure. The thermal interface structure is soldered to a side of a semiconductor chip. In another aspect, an apparatus is provided. The apparatus includes a thermal interface structure that has plural carbon nanotubes. A semiconductor chip is soldered to the thermal interface structure.
    Type: Application
    Filed: June 29, 2009
    Publication date: December 30, 2010
    Inventors: Maxat N. Touzelbaev, Gamal Refai-Ahmed