Patents by Inventor Maxim Tsupko

Maxim Tsupko has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10819087
    Abstract: A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.
    Type: Grant
    Filed: July 31, 2019
    Date of Patent: October 27, 2020
    Assignee: GE GLOBAL SOURCING LLC
    Inventors: Sarit Ratadiya, Ajith Kuttannair Kumar, Tharunendra Sekhar, Mark Allen Murphy, Jacob Alan Hubbell, Kevin Ruybal, Emil Nikolov, Maxim Tsupko, Jeffrey Louis Daigle
  • Publication number: 20190356116
    Abstract: A bus assembly is provided having a bus bar with first and second conductive layers extending along an insulator sheet interposed between the first and second conductive layers. The first and second conductive layers are partially aligned with respect to each other to form a first overlap region of the insulator sheet. The bus assembly includes a first set of arms having a set of diodes and a second set of arms having a set of switches. The bust bar includes a plurality of bus links coupling the plurality of arms to the bus bar forming a plurality of inverters. Each of bus links include a respective first bracket and a respective second bracket aligned with each other forming a second overlap region of the insulator sheet. The first bracket is electrically coupled to the first conductive layer and the second bracket is electrically coupled to the second conductive layer.
    Type: Application
    Filed: July 31, 2019
    Publication date: November 21, 2019
    Inventors: Sarit Ratadiya, Ajith Kuttannair Kumar, Tharunendra Sekhar, Mark Allen Murphy, Jacob Alan Hubbell, Kevin Ruybal, Emil Nikolov, Maxim Tsupko, Jeffrey Louis Daigle