Patents by Inventor May Ting Hng

May Ting Hng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Multi-chip electronic package with reduced stress
    Patent number: 8604595
    Abstract: An electronic component includes lead fingers and a die paddle. A tape pad is mounted below the lead fingers and the die paddle. A first semiconductor chip is bonded onto the tape pad by a layer of first adhesive and a second semiconductor chip is bonded onto the die paddle by a layer of second adhesive. Electrical contacts are disposed between the contact areas of the semiconductors chips and the lead fingers. An encapsulating compound covers part of the lead fingers, the tape pad, the semiconductor chips and the electrical contacts.
    Type: Grant
    Filed: August 14, 2008
    Date of Patent: December 10, 2013
    Assignee: Infineon Technologies AG
    Inventors: Chee Chian Lim, May Ting Hng
  • Electronic component and method for its production
    Patent number: 8049311
    Abstract: An electronic component includes a number of leads and at least one cooling element. The bottom surface of the cooling element is exposed and the material of the cooling element is different from the material of the leads. At least one semiconductor chip is provided on the cooling element. An encapsulation compound covers at least part of the leads, at least part of the semiconductor chip(s), and at least part of the cooling element(s).
    Type: Grant
    Filed: May 4, 2009
    Date of Patent: November 1, 2011
    Assignee: Infineon Technologies AG
    Inventors: Chee Chian Lim, Yoke Chin Goh, Koh Hoo Goh, May Ting Hng
  • Multi-Chip Electronic Package with Reduced Stress
    Publication number: 20090008756
    Abstract: An electronic component includes lead fingers and a die paddle. A tape pad is mounted below the lead fingers and the die paddle. A first semiconductor chip is bonded onto the tape pad by a layer of first adhesive and a second semiconductor chip is bonded onto the die paddle by a layer of second adhesive. Electrical contacts are disposed between the contact areas of the semiconductors chips and the lead fingers. An encapsulating compound covers part of the lead fingers, the tape pad, the semiconductor chips and the electrical contacts.
    Type: Application
    Filed: August 14, 2008
    Publication date: January 8, 2009
    Applicant: INFINEON TECHNOLOGIES AG
    Inventors: Chee Chian Lim, May Ting Hng