Patents by Inventor Mayu Fukuda

Mayu Fukuda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220098186
    Abstract: Provided herein are novel crystalline forms of a crystalline compound of Formula (I), which modulates the ORL-1 receptor. The crystalline compounds of Formula (I), compositions thereof, and methods of using thereof that are described herein are particularly useful for treatment, prevention, and management of several sleep disorders.
    Type: Application
    Filed: January 30, 2020
    Publication date: March 31, 2022
    Applicant: Purdue Pharma L.P.
    Inventors: Ronnie ORTIZ, David IGO, Naoki TSUNO, Mayu FUKUDA, Naoki MIYAKE
  • Publication number: 20160184980
    Abstract: There is provided a pinching tool capable of reliably pinching an object by a pair of pinching teeth each having a continuous mountain-valley shape and accurately performing a secondary operation on the object pinched between the pinching teeth. A first arm 1 and a second arm 2 each of which has a jaw 4 arranged on the front end and a grip 5 arranged on the rear end side are coupled in an X shape by coupling bosses 6 arranged on the arms 1, 2 adjacent to the jaws 4 and a coupling shaft 3. Lateral pinching teeth 11 are formed on front parts of opposed surfaces of the pair of jaws 4. Each of the lateral pinching teeth 11 includes a plurality of lateral rib teeth 17 which extend in a direction intersecting a tool central axis 8 and are continuous in a mountain-valley shape.
    Type: Application
    Filed: March 13, 2015
    Publication date: June 30, 2016
    Inventors: Mitsuhiro TAKASAKI, Shinnosuke KAWAI, Masanori ANDO, Mayu FUKUDA
  • Publication number: 20110207264
    Abstract: A method of manufacturing a semiconductor device includes cutting a part of a resin insulating layer formed on a surface of a semiconductor substrate with a cutting tool. The cutting the part of the resin insulating layer includes cutting a portion of the resin insulating layer that has a surface on which a metal layer is disposed. The cutting the portion of the resin insulating layer is performed in such a manner that, in a stress distribution inside the resin insulating layer along an edge portion of the cutting tool and a peripheral portion of the edge portion, a width at 90% of a maximum value is not more than 1.3 ?m.
    Type: Application
    Filed: October 15, 2010
    Publication date: August 25, 2011
    Applicant: DENSO CORPORATION
    Inventors: Manabu TOMISAKA, Akira Tai, Kazuo Akamatsu, Yutaka Fukuda, Yoshiko Fukuda, Yuji Fukuda, Mika Ootsuki, Mayu Fukuda
  • Publication number: 20110198733
    Abstract: In a method of manufacturing a semiconductor device, an electrode layer is formed on a surface of a semiconductor substrate, and a resin insulation layer is formed on the surface of the semiconductor substrate so that the electrode layer can be covered with the resin insulation layer. A tapered hole is formed in the insulation layer by using a tool bit having a rake angle of zero or a negative value. The tapered hole has an opening defined by the insulation layer, a bottom defined by the electrode layer, and a side wall connecting the opening to the bottom.
    Type: Application
    Filed: September 22, 2010
    Publication date: August 18, 2011
    Applicant: DENSO CORPORATION
    Inventors: Manabu Tomisaka, Michio Kameyama, Terukazu Fukaya, Kazuhito Katoh, Yutaka Fukuda, Akira Tai, Kazuo Akamatsu, Yoshiko Fukuda, Yuji Fukuda, Mika Ootsuki, Mayu Fukuda
  • Patent number: D791561
    Type: Grant
    Filed: July 14, 2015
    Date of Patent: July 11, 2017
    Assignee: ENGINEER INC.
    Inventors: Mitsuhiro Takasaki, Shinnosuke Kawai, Masanori Ando, Mayu Fukuda