Abstract: An implantable electrode system of is disclosed that includes a conductive electrode layer, an interconnect coupled to the electrode layer, an insulator that insulates the interconnect, and an anchor that more securely fixes the electrode layer in place. This structure is particularly useful with the electrode layer being a neural interface that is configured to provide either a recording or stimulating function. A method for forming such an implantable electrode system includes forming an interconnect over a base layer, forming an anchoring structure over the base layer, depositing an insulating material layer over the interconnect structure and over the anchoring structure, exposing a portion of the interconnect structure, forming an electrode layer over the insulating layer, the electrode layer contacting the exposed portion of the interconnect structure.

Abstract: Waveguide neural interface devices and methods for fabricating such devices are provided herein. An exemplary interface device includes a neural device comprising an exterior neural device sidewall extending to a distal end portion of the neural device, an array of electrode sites supported by a first face of the neural device sidewall. The array includes a recording electrode site. The exemplary interface device further includes a waveguide extending along the neural device, the waveguide having a distal end to emit light to illuminate targeted tissue adjacent to the recording electrode site, and a light redirecting element disposed at the distal end of the waveguide. The light redirecting element redirects light traveling through the waveguide in a manner that avoids direct illumination of the recording electrode site on the first face of the neural device sidewall.

Abstract: An implantable electrode system of is disclosed that includes a conductive electrode layer, an interconnect coupled to the electrode layer, an insulator that insulates the interconnect, and an anchor that more securely fixes the electrode layer in place. This structure is particularly useful with the electrode layer being a neural interface that is configured to provide either a recording or stimulating function. A method for forming such an implantable electrode system includes forming an interconnect over a base layer, forming an anchoring structure over the base layer, depositing an insulating material layer over the interconnect structure and over the anchoring structure, exposing a portion of the interconnect structure, forming an electrode layer over the insulating layer, the electrode layer contacting the exposed portion of the interconnect structure.

Abstract: The implantable electrode system of the preferred embodiments includes a conductor, an interconnect coupled to the conductor, an insulator that insulates the interconnect, and an anchor that overlaps a peripheral edge of the electrode layer. The anchor is mechanically interlocked with the insulator. This structure is particularly useful with the electrode layer being a neural interface that is configured to provide either a recording and stimulating function.

Abstract: A waveguide neural interface device including: a neural device implantable in tissue and including an array of electrode sites that electrically communicate with their surroundings, in which the array of electrode sites includes at least one recording electrode site; and a waveguide, coupled to the neural device, that carries light along a longitudinal axis and includes a light directing element that redirects the carried light from the waveguide to illuminate selectively targeted tissue, in which at least a portion of the redirected light is directed laterally away from the longitudinal axis and the recording electrode site is configured to sample illuminated tissue. A method for assembling a waveguide neural interface device is also described.

Abstract: A compact lens system for imaging a sample comprising a substrate having a well formed therein. Index matching material is disposed in the well and a lens member is further disposed in the well in optical contact with the index matching material disposed in the well. A spacer member extends from at least one of the substrate and the lower transparent member to define a spacing from a focal point of the lens member, wherein the lens member and index matching material cooperate to image a sample disposed below the lower transparent member.

Abstract: One embodiment of the invention includes an implantable electrode lead system that includes a series of shims stacked upon each other, a series of first components, and a series of second components connected to the series of first components through a series of connectors. One of the first components extends from one of the shims, and another of the first components extends from another one of the shims. The shims position the first components in a three dimensional arrangement.

Abstract: The implantable electrode system of the preferred embodiments includes a conductor, an interconnect coupled to the conductor, an insulator that insulates the interconnect, and an anchor that is connected to both the conductor and the insulating element. The anchor is mechanically interlocked with at least one of the conductor and the insulator.

Abstract: A method of manufacturing an implantable electronic device, including: providing a silicon wafer; building a plurality of layers coupled to the wafer including an oxide layer coupled to the silicon wafer; a first reactive parylene layer coupled to the oxide layer, an electrode layer coupled to the first reactive parylene layer, and a second reactive parylene layer, coupled to the electrode layer, that chemically bonds to the first reactive polymer layer, and a second polymer layer coupled to the second reactive parylene layer; coating the plurality of layers with an encapsulation, and modifying the encapsulation and at least one of the plurality of layers to expose an electrode site in the electrode layer.

Abstract: The implantable electrode system of the preferred embodiments includes a conductor, an interconnect coupled to the conductor, an insulator that insulates the interconnect, and an anchor that overlaps a peripheral edge of the electrode layer. The anchor is mechanically interlocked with the insulator. This structure is particularly useful with the electrode layer being a neural interface that is configured to provide either a recording and stimulating function.

Abstract: A waveguide neural interface device including: a neural device implantable in tissue and including an array of electrode sites that electrically communicate with their surroundings, in which the array of electrode sites includes at least one recording electrode site; and a waveguide, coupled to the neural device, that carries light along a longitudinal axis and includes a light directing element that redirects the carried light from the waveguide to illuminate selectively targeted tissue, in which at least a portion of the redirected light is directed laterally away from the longitudinal axis and the recording electrode site is configured to sample illuminated tissue. A method for assembling a waveguide neural interface device is also described.

Abstract: A compact lens system for imaging a sample comprising a substrate having a well formed therein. Index matching material is disposed in the well and a lens member is further disposed in the well in optical contact with the index matching material disposed in the well. A spacer member extends from at least one of the substrate and the lower transparent member to define a spacing from a focal point of the lens member, wherein the lens member and index matching material cooperate to image a sample disposed below the lower transparent member.

Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.

Abstract: A method of manufacturing an implantable electronic device, including: providing a silicon wafer; building a plurality of layers coupled to the wafer including an oxide layer coupled to the silicon wafer; a first reactive parylene layer coupled to the oxide layer, an electrode layer coupled to the first reactive parylene layer, and a second reactive parylene layer, coupled to the electrode layer, that chemically bonds to the first reactive polymer layer, and a second polymer layer coupled to the second reactive parylene layer; coating the plurality of layers with an encapsulation, and modifying the encapsulation and at least one of the plurality of layers to expose an electrode site in the electrode layer.

Abstract: The method of the preferred embodiments includes the steps of providing a base having a frame portion and a center portion; building a preliminary structure coupled to the base; removing a portion of the preliminary structure to define a series of devices and a plurality of bridges; removing the center portion of the base such that the frame portion defines an open region, wherein the plurality of bridges suspend the series of devices in the open region defined by the frame; and encapsulating the series of devices. The method is preferably designed for the manufacture of semiconductor devices, and more specifically for the manufacture of encapsulated implantable electrodes. The method, however, may be alternatively used in any suitable environment and for any suitable reason.

Abstract: A microsystem comprising a substrate having an aperture formed therethrough. The aperture includes a first cross-section and a second cross-section—the first cross-section being smaller than the second cross-section to define a ledge therebetween. A probe member is disposed within the aperture of the substrate, such that a backend of the probe member defines a cross-section that is greater than the first cross-section of the aperture and smaller than the second cross-section such that the probe member engages the ledge. A plurality of probe shanks extend from the probe member. Each of the probe shanks includes a plurality of leads disposed there along. Each of the leads extending from the probe shanks to an opposing side of the probe member.

Abstract: A device includes a first device structure having a semiconductor platform, and a second device structure having a microstructure spaced from the semiconductor platform. The device further includes a cable having a plurality of beams to couple the microstructure to the first device structure. Each beam of the plurality of beams has a polymer coating and a serpentine-shaped region.

Abstract: A waveguide neural interface device including: a neural device implantable in tissue and including an array of electrode sites that electrically communicate with their surroundings, in which the array of electrode sites includes at least one recording electrode site; and a waveguide, coupled to the neural device, that carries light along a longitudinal axis and includes a light directing element that redirects the carried light from the waveguide to illuminate selectively targeted tissue, in which at least a portion of the redirected light is directed laterally away from the longitudinal axis and the recording electrode site is configured to sample illuminated tissue. A method for assembling a waveguide neural interface device is also described.

Abstract: Disclosed herein is a method of fabricating a device having a microstructure. The method includes forming a connector on a semiconductor substrate, coating the connector with a polymer layer, and immersing the semiconductor substrate and the coated connector in an etchant solution to form the microstructure from the semiconductor substrate and to release the coated connector and the microstructure from the semiconductor substrate such that the microstructure remains coupled to a further element of the device via the coated connector. In some cases, the microstructure is defined by forming an etch stop in the semiconductor substrate, and the microstructure and the semiconductor substrate are coated with a polymer layer, which may then be selectively patterned. The microstructure may then be released from the semiconductor substrate in accordance with the etch stop.

Abstract: A method of manufacturing an implantable electronic device, including: providing a silicon wafer; building a plurality of layers coupled to the wafer including an oxide layer coupled to the silicon wafer; a first reactive parylene layer coupled to the oxide layer, an electrode layer coupled to the first reactive parylene layer, and a second reactive parylene layer, coupled to the electrode layer, that chemically bonds to the first reactive polymer layer, and a second polymer layer coupled to the second reactive parylene layer; coating the plurality of layers with an encapsulation, and modifying the encapsulation and at least one of the plurality of layers to expose an electrode site in the electrode layer.