Abstract: A method of the present invention for producing an anion exchange membrane includes the steps of: (i) irradiating a first polymer film with radiation; and (ii) graft-polymerizing a monomer containing a site into which a functional group having anion conducting ability can be introduced and an unsaturated carbon-carbon bond onto the radiation-irradiated first polymer film so as to form a second polymer film containing grafted chains. This method further includes the subsequent steps of: (a) subjecting the second polymer film to a treatment including irradiation with radiation so as to introduce a crosslinked structure into the grafted chains; and (b) introducing the functional group having anion conducting ability into the site.

Abstract: The invention provides a fuel cell which comprises a cathode and an anode arranged to sandwich a proton-conductive ion exchange electrolytic membrane, oxygen and hydrogen containing carbon monoxide being supplied to the cathode and the anode, respectively, in which the cathode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and the anode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and further at least the anode carries a proton-supplying material thereon.

Abstract: The present invention provides a method for controlling an optical property of a wavelength conversion sheet. The method is a method for controlling an optical property of a wavelength conversion sheet that contains a transparent resin and a phosphor and achieves wavelength conversion by absorbing light in a specific wavelength range other than a target wavelength range and emitting light in a target wavelength range, wherein the phosphor contains a phosphor having a perylene skeleton, and a stokes shift of the wavelength conversion sheet is controlled by adjusting a concentration of the phosphor having a perylene skeleton to the transparent resin in a range of 0.5% to 3.5% by weight.

Abstract: A color correction filter with excellent durability is provided that can remove intermediate colors of light while preventing brightness of an image display from deteriorating and thereby can improve color tone representation of the image display. A color correction filter 10 of the present invention includes a color correction layer 11 and two protective layers 12. The color correction layer 11 contains a J aggregate of a dye. The dye is at least one dye selected from the group consisting of cyanine, merocyanine, squarylium, and porphyrin. The half bandwidth at a maximum absorption peak of the color correction layer is in the range of 5 to 30 nm. The two protective layers 12 are formed on both surfaces of the color correction layer 11, respectively.

Abstract: A crosslinked product with excellent durability is provided that can remove intermediate colors of light while preventing brightness from deteriorating and thereby can improve color tone representation. The crosslinked product of the present invention includes a J aggregate of a dye and is characterized in that the dye is at least one dye selected from the group consisting of cyanine, merocyanine, squarylium, and porphyrin, the J aggregate of the dye is formed in a matrix resin, and the matrix resin has been crosslinked.

Abstract: The present invention provides a highly practicable color purity improving sheet that while preventing unevenness in color and brightness from occurring, allows light with an improved color purity to be used for an image display efficiently and can improve color reproducibility of the image display. The color purity improving sheet includes a light-emitting layer which improves the purity of a color in a target wavelength range by absorbing light in a specific wavelength range other than the target wavelength range and converts the absorbed light to emitted light in the target wavelength range. The surface of the light-emitting layer on at least the light outgoing side is roughened so as to have an arithmetic average surface roughness Ra defined in JIS B 0601 (1994 version) in the range of 0.1 to 100 ?m.

Abstract: An optical apparatus that prevents unevenness in color and brightness from occurring in an image display, and can improve the color purity of transmitted light and color reproducibility of the image display and is excellent in practical use. An optical apparatus that includes a light source device; a reflective layer; a color purity improving sheet; and a reflective polarizer. The color purity improving sheet includes a light-emitting layer which improves purity of a color in a target wavelength range by absorbing light in a specific wavelength range other than the target wavelength range and converts the absorbed light to emitted light in the target wavelength range. Light emitted from the light source device exits through the reflective polarizer to the outside. The color purity improving sheet is disposed between the reflective polarizer and the reflective layer. The light source device is disposed in a location between the color purity improving sheet and the reflective layer.

Abstract: A color purity improving sheet that improves color purity while preventing brightness from degrading due to absorption of light of a necessary color. The color purity improving sheet includes a light-emitting layer containing a light-emitting means for absorbing light in a specific wavelength range other than the target wavelength range and converting its wavelength to emit light in the target wavelength range, and a reflective layer. The light-emitting layer has a transmittance of at least 70% at the maximum absorption wavelength of the light-emitting layer. The light-emitting layer and the reflective layer are laminated together in this order in a direction from which light of a backlight is incident. The reflective layer selectively reflects part of light in the specific wavelength range other than the target wavelength range and has been transmitted without being absorbed by the light-emitting means in the light-emitting layer, allowing entrance into the light-emitting layer again.

Abstract: The invention provides a fuel cell which comprises a cathode and an anode arranged to sandwich a proton-conductive ion exchange electrolytic membrane, oxygen and hydrogen containing carbon monoxide being supplied to the cathode and the anode, respectively, in which the cathode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and the anode comprises an electroconductive porous substrate which carries thereon platinum or a platinum alloy and a proton-conductive ion exchange electrolytic polymer, and further at least the anode carries a proton-supplying material thereon.

Abstract: A circuit board for mounting a bare chip in the form of a flip chip. A metallic foil for protecting circuits in a state insulated therefrom is arranged in an area where the bare chip is located.

Abstract: A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

Abstract: A plurality of double-sided circuit boards 1 in which a circuit 4 is provided on either side of an insulating layer 3 comprising an organic high molecular resin with an alloy foil 2 as a basic substance, and two circuits 4 are electrically connected by a via with a soldered conductor 5a filled therein are laminated via an adhesive layer 6. The adhesive layer 6 has a bore opened at a predetermined position of a portion in direct contact with the circuits 4 of two double-sided circuit boards 1. A bore portion is provided with a soldered conductor 7. The circuits 4 of the two double-sided circuit boards 1 are electrically connected by the soldered conductor 7.

Abstract: A wafer-scale package structure in which a circuit board for rearranging electrode pads of a wafer is laminated on the wafer integrally. The circuit board can be divided into individual chip-size packages (CSPS) and which includes a layer of polyimide resin, and connection between the wafer and the circuit board is performed by solder bump, while the circuit board is stuck on the wafer with an adhesive.

Abstract: The present invention provides a mounted structure of circuit board which can be prepared by a simple method and exhibits a good heat dissipation from chip and undergoes relaxed heat stress and a multi-layer circuit board to be incorporated in the mounted structure. A novel mounted structure of circuit board is provided comprising a core material embedded in an insulating layer, said core material having a metal layer with a heat conductivity of not less than 100 W/m·K provided on at least one side of an Ni—Fe alloy foil, said insulating layer comprising a wire conductor provided and a semiconductor element mounted on at least one side thereof, characterized in that a solder metal member for heat conduction is provided interposed between said semiconductor element and said core material so that said semiconductor element and said core material are connected to each other.

Abstract: A low-thermal expansion circuit board comprising an insulating layer made of an organic polymer having thereon a wiring conductor for bare chip mounting, wherein the wiring conductor is an iron-nickel-based alloy layer having a copper layer on at least one side thereof; and a low-thermal expansion multilayer circuit board having a plurality of the low-thermal expansion circuit boards via an adhesive layer, the adhesive layer having through-holes filled with solder to connect the circuits layers.

Abstract: A double-sided circuit board of which a solder conductor is prevented from deformation in a cycling test so as to maintain high connection reliability, comprises an insulating layer 2 made of an organic high molecular weight resin and a circuit 3 provided on each side of the insulating layer 2, the circuits 3 on both sides being electrically connected through via-holes filled with a conductor 4 made of solder having a metal powder 6 dispersed therein.

Abstract: A semiconductor device in which the space between a semiconductor chip and an auxiliary wiring plate is sealed with resin. The auxiliary wiring plate has insulating layers and on both sides of the routing conductor, the insulating layer on the side of the semiconductor chip has a hole being led from the routing conductor to the electrode of the semiconductor chip, the metal filled in the hole and the metal bump formed so as to protrude from the hole serves as an inner electrode. The semiconductor device can be manufactured by the TAB technique.

Abstract: A semiconductor device capable of preventing the occurrence of defect of electroconductivity, wherein a semiconductor chip 1 equipped with electrodes 11 is mounted on an auxiliary wiring plate 2 in the state of facing the surface of the electrode 11 side, leading conductors 23 are disposed in the inside of the auxiliary wiring plate 2, one end of each leading conductor 23 forms an internal electrode 21 projecting from the surface of the auxiliary wiring plate 2 at the side of mounting the semiconductor chip 1, the other end of the leading conductor 23 forms an external electrode 22 projecting from the surface of the auxiliary wiring plate opposite to the side of mounting the semiconductor chip 1, and each of the internal electrodes 21 is connected to each of the electrodes 11 of the semiconductor chip 1, at least a gap between the semiconductor chip 1 and the auxiliary wiring plate 2 is encapsulated with a heat-welding polyimide resin layer.

Abstract: A semiconductor device in which a semiconductor chip is encapsulated in an epoxy resin composition comprising (A) an epoxy resin represented by formula (I): ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, and R.sub.4 each represents an alkyl group having from 1 to 4 carbon atoms, and (B) a reaction product obtained by preliminarily reacting a silane compound represented by formula (II): ##STR2## wherein X represents a monovalent organic group having at least one functional group selected from the group consisting of a glycidyl group, an amino group, and a mercapto group; Y represents an alkoxy group having from 1 to 4 carbon atoms; and n represents 0, 1 or 2, with a phenol aralkyl resin represented by formula (III) ##STR3## wherein m represents 0 or a positive integer. The epoxy resin composition has low moisture absorption and low stress to provide a semiconductor device excellent in thermal crack resistance and moisture resistance.