Abstract: A system for measuring the junction temperature of a photonics device comprising a) a test chamber, wherein a photonics device to be tested is placed inside, b) at least one heater, c) at least one temperature sensor, d) a source-meter configured to apply a driving current to the photonics device in order to read the corresponding forward voltage value at that temperature, e) a power supply, f) a control system and g) a software configured to start and control the measurements with either predefined default settings or the settings entered by the user.

Abstract: A geodetic levelling staff, a method for measuring a height with the geodetic levelling staff and a system including the geodetic levelling staff and a level are provided. The geodetic levelling staff includes a circular level that indicates whether the geodetic levelling staff is in a vertical position, a level detection unit for detecting a bubble position of the circular level, a control circuit that receives detected data performed by the level detection unit and transmits the detected data to a near field communication tool, the near field communication tool for performing a communication from the geodetic levelling staff to the level according to the detected data received from the control circuit, wherein the level operates according to the detected data received from the near field communication tool.

Abstract: An assembly of synthetic jet devices is provided for cooling a heat sink. The assembly includes a mounting member for coupling to a heat sink including a plurality of fins, and a plurality of synthetic jet devices. Each of the plurality of synthetic jet devices includes an actuation module having a first actuator and a first plate opposite a second actuator and a second plate, and an extension module operably coupling the actuation module to the mounting member. Each actuation module of a synthetic jet device is configured to be suspended within a channel between two fins of the plurality of fins.

Abstract: Disclosed is a PCB used in multifunctional LED applications, having an electronic side with circuit components and a LED side with lighting components; which has at least one metal surface coated on the ground of the mentioned electronic side, at least one metal surface coated on the ground of the mentioned LED surface, or at least one pipe located in the inner cross-section of the mentioned PCB in order to reduce the heating generated on the mentioned PCB by dissipating it over the surface of board.

Abstract: A lighting apparatus and system and method for controlled lighting are provided. In one embodiment, a lighting apparatus comprises a heat sink including a center passageway passing from a chimney inlet to a driver circuit housing, a plurality of internal heat sink fins within the center passageway, and a plurality of external heat sink fins adjacent the driver circuit housing. A flow channel is between each set of two adjacent heat sink fins of the plurality of heat sink fins to provide a plurality of internal inlet flow channels and a plurality of external outlet flow channels, with each flow channel aligned with one of a plurality of PCBs, each having an LED mounted thereon.

Abstract: Apparatus and method are provided for reducing acoustical noise when cooling a device, such as a lamp system. The apparatus includes at least a set of a first synthetic jet and a second synthetic jet. The first and second synthetic jets are responsive to respective actuating signals having a phase difference (e.g., 180°) between one another chosen to reduce acoustic noise produced by the first and second synthetic jets when cooling the device.

Abstract: A system for cooling a device includes a heat sink comprising a substrate having a plurality of fins arranged thereon, a fan positioned to direct an ambient fluid in a first direction across the heat sink, and a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets. The first synthetic jet assembly is configured to direct the ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction.

Abstract: A system for cooling a device includes a heat sink comprising a substrate having a plurality of fins arranged thereon, a fan positioned to direct an ambient fluid in a first direction across the heat sink, and a first synthetic jet assembly comprising one of a multi-orifice synthetic jet and a plurality of single orifice synthetic jets. The first synthetic jet assembly is configured to direct the ambient fluid in a second direction across the heat sink, wherein the second direction is approximately perpendicular to the first direction.

Abstract: A system and method for remotely monitoring the operation of a turbine includes a remote device having a power module connected to a sensor and a transmitter. The remote device is powered by the power module and connected to a system such that the remote device is self-powered. The remote device wirelessly transmits information acquired by the sensor out of the turbine.

Abstract: A light emitting or absorbing lighting system includes at least one radiation layer which is placed along the optical path of light with or without phosphor, makes radiation by absorbing light and contains silk fibroin, and which is capable of controlling the light distribution.

Abstract: A lighting apparatus and system and method for controlled lighting are provided. In one embodiment, a lighting apparatus comprises a heat sink including a center passageway passing from a chimney inlet to a driver circuit housing, a plurality of internal heat sink fins within the center passageway, and a plurality of external heat sink fins adjacent the driver circuit housing. A flow channel is between each set of two adjacent heat sink fins of the plurality of heat sink fins to provide a plurality of internal inlet flow channels and a plurality of external outlet flow channels, with each flow channel aligned with one of a plurality of PCBs, each having an LED mounted thereon.

Abstract: A system and method for the packaging of a synthetic jet actuator is disclosed. A synthetic jet actuator is provided that includes a first plate, a second plate spaced apart from the first plate and arranged parallelly thereto, and a housing positioned about the first and second plates and defining a chamber. The housing includes at least one orifice therein such that the chamber is in fluid communication with an external environment. The synthetic jet actuator also includes a mounting mechanism configured to mount the first and second plates within the housing in a suspended arrangement and an actuator element coupled to at least one of the first and second plates to selectively cause deflection thereof, thereby changing a volume within the chamber so that a series of fluid vortices are generated and projected to the external environment out from the at least one orifice of the housing.

Abstract: Disclosed is a PCB used in multifunctional LED applications, having an electronic side with circuit components and a LED side with lighting components; which has at least one metal surface coated on the ground of the mentioned electronic side, at least one metal surface coated on the ground of the mentioned LED surface, or at least one pipe located in the inner cross-section of the mentioned PCB in order to reduce the heating generated on the mentioned PCB by dissipating it over the surface of board.

Abstract: An assembly of synthetic jet devices is provided for cooling a heat sink. The assembly includes a mounting member for coupling to a heat sink including a plurality of fins, and a plurality of synthetic jet devices. Each of the plurality of synthetic jet devices includes an actuation module having a first actuator and a first plate opposite a second actuator and a second plate, and an extension module operably coupling the actuation module to the mounting member. Each actuation module of a synthetic jet device is configured to be suspended within a channel between two fins of the plurality of fins.

Abstract: A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream fins, while the shape of the fins limits pressure drop in the flow over the cooling fins.

Abstract: A system and method for cooling heat-producing devices using synthetic jet embedded heat sinks is disclosed. The cooling system includes a heat sink comprising a base portion and a plurality of fins disposed on the base portion and extending vertically out therefrom, the plurality of fins spaced to define a channel between adjacent fins. The cooling system also includes at least one synthetic jet actuator attached to the heat sink, with each of the at least one synthetic jet actuators comprising a plurality of orifices therein and being configured to generate and project a series of fluid vortices out from the plurality of orifices and toward at least a portion of the channels of the heat sink.

Abstract: A heat sink with shape-optimized fins provides for improved heat transfer. Synthetic jets create vortices which enhance heat transfer and cooling of downstream fins, while the shape of the fins limits pressure drop in the flow over the cooling fins.

Abstract: A chassis with distributed jet cooling is provided. The chassis includes one or more sidewalls defining a volume configured to substantially surround one or more heat generating components positioned within the volume. The chassis further includes at least one array of fins thermally coupled to a respective one of the one or more sidewalls and at least one synthetic jet assembly comprising a multi-orifice synthetic jet or a number of single orifice synthetic jets disposed on a side of a respective one of the array(s) of fins. The chassis further includes at least one attachment means for attaching a respective one of the at least one synthetic jet assemblies to a respective one of the one or more sidewalls.

Abstract: A mounting apparatus for a cooling device is disclosed. The mounting apparatus includes a plurality of connectors extending outwardly from the cooling device. The mounting apparatus also includes at least one mounting post coupled to the plurality of connectors and configured to mount the cooling device on a substrate.

Abstract: A method and system for increasing cooling of an enclosure is provided. The component enclosure includes one or more sidewalls defining a volume, the sidewalls are configured to substantially surround a heat generating component positioned within the volume. The component enclosure further includes a synthetic jet assembly positioned adjacent at least one of the sidewalls. The synthetic jet assembly includes at least one synthetic jet ejector having a jet port. The jet port is aligned at least one of perpendicularly, parallelly, and obliquely with a surface of the at least one sidewall. The synthetic jet assembly is configured to direct a jet of fluid through the port at least one of substantially parallel to the surface, perpendicularly onto the surface, and obliquely toward the surface.