Abstract: A memory device includes an array of resistive memory cells. Each resistive memory cell in the array includes a first resistive memory element, a second resistive memory element, and a two-terminal switching element. The first resistive memory element is electrically coupled to the second resistive memory element and to the switching element at a common node.

Abstract: Components of a memory system, such as a memory controller and memory device, which detect accumulated memory read disturbances and correct such disturbances before they reach a level that causes errors. The memory device includes a memory array and a disturbance control circuit. The memory array includes a plurality of memory rows. Each memory row is associated with a disturbance warning circuit having a state that corresponds to an accumulated disturbance in the memory row. The disturbance control circuit determines, responsive to an activation of a memory row of the plurality of memory rows specified by a row access command, whether the disturbance condition is present in the memory row based on the state of the disturbance warning circuit associated with the memory row. If a disturbance condition is present, the disturbance control circuit causes a recovery operation to be performed on the memory row to reduce the accumulated disturbances.

Abstract: A memory device includes an array of resistive memory cells. Each resistive memory cell in the array includes a first resistive memory element, a second resistive memory element, and a two-terminal switching element. The first resistive memory element is electrically coupled to the second resistive memory element and to the switching element at a common node.

Abstract: Structures and methods of operating a resistive switching memory device are disclosed herein. In one embodiment, a resistive switching memory device, can include resistive memory cells configured to be programmed to a low resistance state by application of a first voltage, and to be erased to a high resistance state by application of a second voltage; a detector configured to detect when at least one resistive switching memory cell is to be rendered inoperable; and a program/erase controller configured to render the at least one resistive switching memory cell inoperable by application of a third voltage during a program/erase operation, where the third voltage is greater in absolute value than the first or second voltage, and where the at least one resistive switching memory cell rendered inoperable remains in the low/high resistance state after subsequent erase/program operations.

Abstract: Components of a memory system, such as a memory controller and memory device, which detect accumulated memory read disturbances and correct such disturbances before they reach a level that causes errors. The memory device includes a memory array and a disturbance control circuit. The memory array includes a plurality of memory rows. Each memory row is associated with a disturbance warning circuit having a state that corresponds to an accumulated disturbance in the memory row. The disturbance control circuit determines, responsive to an activation of a memory row of the plurality of memory rows specified by a row access command, whether the disturbance condition is present in the memory row based on the state of the disturbance warning circuit associated with the memory row. If a disturbance condition is present, the disturbance control circuit causes a recovery operation to be performed on the memory row to reduce the accumulated disturbances.

Abstract: Structures and methods of operating a programmable impedance element are disclosed herein. In one embodiment, a method of operating a programmable impedance element can include: (i) determining an operation to be performed on the programmable impedance element, where the programmable impedance element includes a solid electrolyte between an active electrode and an inert electrode; (ii) in response to the determined operation being a program operation, programming the programmable impedance element by completing formation of a conductive path from a partial conductive path between the active and inert electrodes; and (iii) in response to the determined operation being an erase operation, erasing the programmable impedance element by substantially dissolving the conductive path, and then by forming the partial conductive path.

Abstract: Data is stored in a quantum-well type structure with double gate control. According to an example embodiment, a transistor-based data storage circuit includes a gate, a back gate and a semiconductor channel between the gate and the back gate. Carriers are stored in a storage pocket structure in the channel, in response to biases applied to the gate and back gate. Current passing through the channel is sensed and used to detect the stored carriers and, correspondingly, a memory state of the storage circuit.

Abstract: Data is stored in a quantum-well type structure with double gate control. According to an example embodiment, a transistor-based data storage circuit includes a gate, a back gate and a semiconductor channel between the gate and the back gate. Carriers are stored in a storage pocket structure in the channel, in response to biases applied to the gate and back gate. Current passing through the channel is sensed and used to detect the stored carriers and, correspondingly, a memory state of the storage circuit.