Abstract: A substrate unload and load apparatus adapted to unload and load a plurality of processed substrates from a plurality of arrayed substrate holders, the apparatus having a frame and a plurality of processed substrate supports coupled to the frame configured to support the processed substrates. A plurality of unprocessed substrate supports is coupled to the frame configured to support the unprocessed substrates, each of the unprocessed substrate supports alternating and interleaved with each of the processed substrate supports. A holder release is coupled to the frame and configured to engage the arrayed substrate holders having a first state where the arrayed substrate holders releases the processed substrates from the arrayed substrate holders, the holder release having a second state where the arrayed substrate holders captures the unprocessed substrates with arrayed substrate holders.

Abstract: A substrate holder adapted to hold and retain a substrate during vertical fluid processing of a surface of the substrate. The wafer holder has a frame. A first leg is coupled to the frame by a first compliant flexure, the first leg having a first contact member configured to engage a first edge of the substrate. A second leg is coupled to the frame by a second compliant flexure, the second leg having a second contact member configured to engage a second edge of the substrate. Upon deflection of the first and second compliant flexures, the first and second legs are moveable in substantially opposite directions disengaging the first and second contact fingers from the first and second edges of the substrate respectively.

Abstract: The present invention is directed to a scanning apparatus and method for processing a workpiece, wherein the scanning apparatus comprises a wafer arm and moving arm fixedly coupled to one another, wherein the wafer arm and moving arm are operable to rotate about a first axis. An end effector, whereon the workpiece resides, is coupled to the wafer arm. A rotational shaft couples the wafer arm and moving arm to a first actuator, wherein the first actuator provides a rotational force to the shaft. A momentum balance mechanism is coupled to the shaft and is operable to generally reverse the rotational direction of the shaft. The momentum balance mechanism comprises one or more fixed spring elements operable to provide a force to a moving spring element coupled to the moving arm. A controller is further operable to maintain a generally constant translational velocity of the end effector within a predetermined scanning range.

Abstract: The present invention is directed to a scanning apparatus and method for processing a substrate, wherein the scanning apparatus comprises a first link and a second link rigidly coupled to one another at a first joint, wherein the first link and second link are rotatably coupled to a base portion by the first joint, therein defining a first axis. An end effector, whereon the substrate resides, is coupled to the first link. The second link is coupled to a first actuator via at least second joint. The first actuator is operable to translate the second joint with respect to the base portion, therein rotating the first and second links about the first axis and translating the substrate along a first scan path in an oscillatory manner. A controller is further operable to maintain a generally constant translational velocity of the end effector within a predetermined scanning range.

Abstract: The present invention is directed to a scanning apparatus and method for processing a substrate, wherein the scanning apparatus comprises a base portion and a rotary subsystem. The rotary subsystem comprises a first link comprising a first joint, wherein the first link is rotatably coupled to the base portion by the first joint, and a second link comprising a second joint, wherein the second link is rotatably coupled to the first link by the second joint. The first joint and the second joint are spaced a predetermined distance from one another. The second link further comprising an end effector whereon the substrate resides, and wherein the end effector is operably coupled to the second link.

Abstract: A work piece transfer apparatus for use with an ion beam implanter for treating a work piece at sub-atmospheric pressure. The work piece transfer apparatus includes an evacuable load lock system in fluid communication with an interior region the implantation chamber interior region. The load lock system includes a support surface for supporting the work piece with an opening aligned with the work piece. The work piece transfer apparatus further includes a work piece support within the implantation chamber having a pedestal supported by a linkage with two degrees of freedom. The linkage moves the pedestal transversely through the load lock support surface opening to pick up the work piece from the support surface prior to treatment. The pedestal holds the work piece in position in the implantation chamber for treatment. The linkage then moves the pedestal transversely through the load lock support surface opening to deposit the work piece on the support surface subsequent to treatment.

Abstract: The present invention is directed to a scanning apparatus and method for processing a workpiece, wherein the scanning apparatus comprises a wafer arm and moving arm fixedly coupled to one another, wherein the wafer arm and moving arm are operable to rotate about a first axis. An end effector, whereon the workpiece resides, is coupled to the wafer arm. A rotational shaft couples the wafer arm and moving arm to a first actuator, wherein the first actuator provides a rotational force to the shaft. A momentum balance mechanism is coupled to the shaft and is operable to generally reverse the rotational direction of the shaft. The momentum balance mechanism comprises one or more fixed spring elements operable to provide a force to a moving spring element coupled to the moving arm. A controller is further operable to maintain a generally constant translational velocity of the end effector within a predetermined scanning range.

Abstract: The present invention is directed to a scanning apparatus and method for processing a substrate, wherein the scanning apparatus comprises a first link and a second link rigidly coupled to one another at a first joint, wherein the first link and second link are rotatably coupled to a base portion by the first joint, therein defining a first axis. An end effector, whereon the substrate resides, is coupled to the first link. The second link is coupled to a first actuator via at least second joint. The first actuator is operable to translate the second joint with respect to the base portion, therein rotating the first and second links about the first axis and translating the substrate along a first scan path in an oscillatory manner. A controller is further operable to maintain a generally constant translational velocity of the end effector within a predetermined scanning range.

Abstract: A work piece transfer apparatus for use with an ion beam implanter for treating a work piece at sub-atmospheric pressure. The work piece transfer apparatus includes an evacuable load lock system in fluid communication with an interior region the implantation chamber interior region. The load lock system includes a support surface for supporting the work piece with an opening aligned with the work piece. The work piece transfer apparatus further includes a work piece support within the implantation chamber having a pedestal supported by a linkage with two degrees of freedom. The linkage moves the pedestal transversely through the load lock support surface opening to pick up the work piece from the support surface prior to treatment. The pedestal holds the work piece in position in the implantation chamber for treatment. The linkage then moves the pedestal transversely through the load lock support surface opening to deposit the work piece on the support surface subsequent to treatment.

Abstract: The present invention is directed to a scanning apparatus and method for processing a substrate, wherein the scanning apparatus comprises a base portion and a rotary subsystem. The rotary subsystem comprises a first link comprising a first joint, wherein the first link is rotatably coupled to the base portion by the first joint, and a second link comprising a second joint, wherein the second link is rotatably coupled to the first link by the second joint. The first joint and the second joint are spaced a predetermined distance from one another. The second link further comprising an end effector whereon the substrate resides, and wherein the end effector is operably coupled to the second link.

Abstract: A substrate heating apparatus having a housing forming a substrate receiving chamber and a heater located inside the chamber. The heater has a thin film flat ribbon heater element sandwiched between two glass-ceramic panels.

Abstract: A substrate heating apparatus having a housing forming a substrate receiving chamber and a heater located inside the chamber. The heater has a thin film flat ribbon heater element sandwiched between two glass-ceramic panels.