Abstract: The present disclosure provides an immunomodulation and anti-tumor-related nanobody that specifically binds to a human leukocyte antigen-G, a programmed cell death ligand 1, and CD3 ?. The present disclosure also provides the nucleic acid sequence of the immunomodulation and anti-tumor-related nanobody, and use of the immunomodulation and anti-tumor-related nanobody for treating cancer and immune-related disorders.

Abstract: The present disclosure provides an anti-T-cell nanobody that specifically binds to CD3 ?. The present disclosure also provides the nucleic acid sequence of the anti-T-cell nanobody, use of the anti-T-cell nanobody for treating cancer, immunoregulation and activating immune cells, and a method for detecting expression levels of CD3 ?.

Abstract: The present disclosure provides an anti-immune-checkpoint nanobody that specifically binds to a programmed cell death ligand 1. The present disclosure also provides the nucleic acid sequence of the anti-immune-checkpoint nanobody, use of the anti-immune-checkpoint nanobody for treating cancer and immune-related disorders, and a method for detecting expression levels of PD-L1.

Abstract: A multispecific nanobodies chimeric antigen receptor and T-cell engager includes an HLA-G nanobody chimeric antigen receptor and a bispecific T-cell engager. The HLA-G nanobody chimeric antigen receptor includes an HLA-G nanobodies unit, a transmembrane domain, and a CD3z signaling domain. The bispecific T-cell engager includes a PD-L1 nanobodies unit and a CD3e nanobody.

Abstract: The present disclosure provides an anti-T-cell nanobody that specifically binds to CD3 ?. The present disclosure also provides the nucleic acid sequence of the anti-T-cell nanobody, use of the anti-T-cell nanobody for treating cancer, immunoregulation and activating immune cells, and a method for detecting expression levels of CD3 ?.

Abstract: The present disclosure provides an anti-immune-checkpoint nanobody that specifically binds to a programmed cell death ligand 1. The present disclosure also provides the nucleic acid sequence of the anti-immune-checkpoint nanobody, use of the anti-immune-checkpoint nanobody for treating cancer and immune-related disorders, and a method for detecting expression levels of PD-L1.

Abstract: The present disclosure provides an anti-tumor antigen nanobody that specifically binds to a human leukocyte antigen-G. The present disclosure also provides the nucleic acid sequence of the anti-tumor antigen nanobody, use of the anti-tumor antigen nanobody for treating cancer and immune-related disorders, and a method for detecting expression levels of HLA-G.

Abstract: The present disclosure provides an immunomodulation and anti-tumor-related nanobody that specifically binds to a human leukocyte antigen-G, a programmed cell death ligand 1, and CD3 ?. The present disclosure also provides the nucleic acid sequence of the immunomodulation and anti-tumor-related nanobody, and use of the immunomodulation and anti-tumor-related nanobody for treating cancer and immune-related disorders.

Abstract: A user interface includes a system status bar which is displayed on a desktop permanently. The system status bar includes an integrated toolbar which is displayed on the desktop through a touch panel sensing an input event. The integrated toolbar includes at least one workspace and an application launcher. The application launcher has at least one application icon for launching at least one application. Furthermore, a method for displaying a user interface and an electrical device are also disclosed herein.

Abstract: A flash memory device includes a Chip-On-Board (COB) type circuit board and a number of first and second contacts electrically connected to the circuit board. Each first contact includes a stiff first contact portion formed on an upper surface of the circuit board. Each second contact includes a cantilevered planar second contact portion extending along the front-to-rear direction. When the flash memory device is inserted into a USB 3.0 receptacle connector, the first and the second contact portions jointly electrically connect with the USB 3.0 receptacle connector. The planar second contact portions provide larger contacting area for mating with the corresponding contacts of the USB 3.0 receptacle connector.

Abstract: A flash memory device includes a circuit board and a contact module slidable with respect to the circuit board. The circuit board includes a plurality of first contacts each having a stiff first contact portion. The contact module includes a slider and a plurality of second contacts fixed to the slider. The slider is slidable with respect to the circuit board along a front-to-rear direction between a first position and a second position. The flash memory device is compatible to USB 2.0 and USB 3.0 receptacle connectors via the slidable contact module.

Abstract: A flash memory device includes a circuit board and a contact module slidable with respect to the circuit board. The circuit board includes a plurality of first contacts each having a stiff first contact portion. The contact module includes a slider and a plurality of second contacts fixed to the slider. The slider is slidable with respect to the circuit board along a front-to-rear direction between a first position and a second position. The flash memory device is compatible to USB 2.0 and USB 3.0 receptacle connectors via the slidable contact module.

Abstract: A flash memory device includes a circuit board and a contact module slidable with respect to the circuit board. The circuit board includes a plurality of first contacts each having a stiff first contact portion. The contact module includes a slider and a plurality of second contacts fixed to the slider. The slider is slidable with respect to the circuit board along a front-to-rear direction between a first position and a second position. The flash memory device is compatible to USB 2.0 and USB 3.0 receptacle connectors via the slidable contact module.

Abstract: A flash memory device includes a circuit board and a contact module slidable with respect to the circuit board. The circuit board includes a plurality of first contacts each having a stiff first contact portion. The contact module includes a slider and a plurality of second contacts fixed to the slider. The slider is slidable with respect to the circuit board along a front-to-rear direction between a first position and a second position. The flash memory device is compatible to USB 2.0 and USB 3.0 receptacle connectors via the slidable contact module.

Abstract: A flash memory device includes a Chip-On-Board (COB) type circuit board and a number of first and second contacts electrically connected to the circuit board. Each first contact includes a stiff first contact portion formed on an upper surface of the circuit board. Each second contact includes a cantilevered planar second contact portion extending along the front-to-rear direction. When the flash memory device is inserted into a USB 3.0 receptacle connector, the first and the second contact portions jointly electrically connect with the USB 3.0 receptacle connector. The planar second contact portions provide larger contacting area for mating with the corresponding contacts of the USB 3.0 receptacle connector.