Patents by Inventor Mei-Hua Chen
Mei-Hua Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240152880Abstract: A multi-channel payment method for a multi-channel payment system comprises the payer or the payee who initiated the payment request logs in to the multi-channel payment system; the payer or the payee who initiated the payment request placing an order in the multi-channel payment system, wherein the order comprises a designated payment gateway; the multi-channel payment system determining a predicted fee of the order according to the designated payment gateway, past order records, and a real-time exchange rate; the multi-channel payment system performing an anti-money laundering verification of the order; the payer reviewing the order and the predicted fee through a multiple auditing method; and the multi-channel payment system executing payment from the payer to the payee according to the order and the designated payment gateway, and storing a payment detail of the order.Type: ApplicationFiled: February 13, 2023Publication date: May 9, 2024Applicant: OBOOK INC.Inventors: Chun-Kai Wang, Chung-Han Hsieh, Chun-Jen Chen, Po-Hua Lin, Wei-Te Lin, Pei-Hsuan Weng, Mei-Su Wang, I-Cheng Lin, Cheng-Wei Chen
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Patent number: 11973260Abstract: A light-transmitting antenna includes a substrate, a first and a second conductive pattern. The first and the second conductive pattern is disposed on a first and a second surface of the substrate respectively. The first conductive pattern includes a first feeder unit, a first and a second radiation unit, a first and a second coupling unit and a first parasitic unit. The first feeder unit is connected to the second radiation unit. The first and the second radiation unit are located between the first and the second coupling unit. One side and the other side of the first parasitic unit is connected to the second coupling unit and adjacent to the first coupling unit respectively. The second conductive pattern includes a second feeder unit, a third coupling unit, a second parasitic unit, and a fourth coupling unit.Type: GrantFiled: November 9, 2022Date of Patent: April 30, 2024Assignee: Industrial Technology Research InstituteInventors: Ruo-Lan Chang, Mei-Ju Lee, Cheng-Hua Tsai, Meng-Hsuan Chen, Wei-Chung Chen
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Publication number: 20240120656Abstract: A light-transmitting antenna includes a substrate, a first conductive pattern, and a second conductive pattern. The first conductive pattern has a first feeder unit, a first radiation unit, a second radiation unit, and a first connection unit. The first feeder unit and the first connection unit are connected to two sides of the first radiation unit. The first connection unit connects the first radiation unit and the second radiation unit. The second conductive pattern has a second feeder unit, a third radiation unit, a fourth radiation unit, and a second connection unit. The second feeder unit and the second connection unit are connected to two sides of the third radiation unit. The second connection unit connects the third radiation unit and the fourth radiation unit. An orthogonal projection of the second feeder unit on a first surface of the substrate at least partially overlaps the first feeder unit.Type: ApplicationFiled: December 22, 2022Publication date: April 11, 2024Applicant: Industrial Technology Research InstituteInventors: Meng-Hsuan Chen, Cheng-Hua Tsai, Mei-Ju Lee, Ruo-Lan Chang, Wei-Chung Chen
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Patent number: 8294444Abstract: A power tracking device for a power generation apparatus is provided. A multiplier generates a power level signal according to a current signal and a voltage signal both sensed from the output of the power generation apparatus. A sample-and-hold circuit samples the power level signal according to a sampling clock and generates a current level signal, a peak level signal, and a threshold level signal according to an update signal. A compare circuit compares the current, peak and threshold level signals to generate the update signal and a change signal. A converter performs pulse width modulation (PWM) to generate a PWM signal according to a control signal corresponding to the change signal and converts the output of the power generation apparatus to a load according to the PWM signal.Type: GrantFiled: March 9, 2010Date of Patent: October 23, 2012Assignees: Sinergy Power Solutions Inc., Sinergy Micro Devices Inc.Inventor: Mei-Hua Chen
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Publication number: 20110221418Abstract: A power tracking device for a power generation apparatus is provided. A multiplier generates a power level signal according to a current signal and a voltage signal both sensed from the output of the power generation apparatus. A sample-and-hold circuit samples the power level signal according to a sampling clock and generates a current level signal, a peak level signal, and a threshold level signal according to an update signal. A compare circuit compares the current, peak and threshold level signals to generate the update signal and a change signal. A converter performs pulse width modulation (PWM) to generate a PWM signal according to a control signal corresponding to the change signal and converts the output of the power generation apparatus to a load according to the PWM signal.Type: ApplicationFiled: March 9, 2010Publication date: September 15, 2011Applicants: SINERGY POWER SOLUTIONS INC., SINERGY MICRO DEVICES INC.Inventor: Mei-Hua Chen
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Publication number: 20110150455Abstract: An optical device includes a lens, a horizontal transmission module, a vertical transmission module, a horizontal driving unit, a vertical driving unit, a horizontal orientation detector, a vertical orientation detector, a user interface, and a control unit. The horizontal driving unit moves the lens horizontally via the horizontal transmission module. The horizontal orientation detector can detect horizontal movement of the lens and emit a horizontal sensing signal. The vertical driving unit can move the lens vertically via the vertical transmission module. The vertical orientation detector can detect vertical movement of the lens and emit a vertical sensing signal. The user interface can generate an operation signal. The control unit can control movement of the lens according to the operation signal, the horizontal sensing signal, and the vertical sensing signal.Type: ApplicationFiled: December 16, 2010Publication date: June 23, 2011Applicant: ASIA OPTICAL CO., INC.Inventors: Cheng-Kung TSAI, Mei Hua Chen
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Publication number: 20100270106Abstract: A ladder is composed of a plurality of rung units and each unit includes two hollow tubes and a rung connected between the two hollow tubes. The hollow tubes of the rung units have gradually reduced outer diameters so that the hollow tubes can be telescopically received to form a compact size. The rung is connected to the two hollow tubes of each rung unit by two connectors and each connector includes two buttons which can be pushed in the direction perpendicular to the axis of the rung to release the interlock connection between the rung and the hollow tubes so as to easily collapse or extend the ladder.Type: ApplicationFiled: March 24, 2010Publication date: October 28, 2010Inventor: MEI-HUA CHEN
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Publication number: 20070125407Abstract: A jet stream cleaning apparatus includes a housing and a cleaning device. The housing is formed with a mounting space to be supplied with a pressurized cleaning fluid. The cleaning device includes a hollow nozzle retainer mounted in the mounting space, a particle-collecting pad mounted on the nozzle retainer, and a tubular nozzle. The nozzle includes a nozzle body having an inlet portion mounted to the nozzle retainer, and an outlet portion. The nozzle body extends through the particle-collecting pad such that the outlet portion is disposed outside the housing. The nozzle permits the pressurized cleaning fluid flowing into the mounting space to flow from the inlet portion through the outlet portion.Type: ApplicationFiled: December 1, 2005Publication date: June 7, 2007Inventor: Mei-Hua Chen
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Publication number: 20040183179Abstract: A package structure for a multi-chip integrated circuit (IC) is disclosed and the structure includes substrate having a position for bonding with chips for chip-bonding and having at least a hole for the passage of a gold wire in the course of wire-bonding, a first chip attached to the substrate with a chip bonding agent and being wire-bonded on the substrate and the chip bonding position being opposite to the 2nd chip with the substrate in-between, and the gold wire of the wire-bonding passed through the hole of the substrate from the substrate bonding pad at the substrate and on the same lateral side of the second chip and being connected to the pin pad of the first chip, at least a second chip being flip-chip bonded onto the substrate and the bonding position being at different sides of the bonding between the substrate and the first chip, and a package body including filler of the second chip extended to cover the hole of the substrate and the first chip and the gold wire connected to the substrate and thType: ApplicationFiled: March 20, 2003Publication date: September 23, 2004Inventors: Wen-Lo Shieh, Fu-Yu Huang, Chia-Chieh Hu, Ning Huang, Hui-Pin Chen, Chang-Ming Hsin, Shu-Wan Lu, Tou-Sung Wu, Chih-Yu Tsai, Yu-Tang Su, Mei-Hua Chen, Chia-Ling Lu, Yu-Ju Wang
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Publication number: 20040082159Abstract: A fabrication method for solder bump pattern of rear section wafer package is disclosed and the method includes the steps of: (a) pattern-etching the wafer at a passivation layer for the positioning of the solder bump; (b) depositing the entire under bump metal layer,Type: ApplicationFiled: March 10, 2003Publication date: April 29, 2004Inventors: Wen-Lo Shieh, Fu-Yu Huang, Ning Huang, Hui-Pin Chen, Shu-Wan Lu, Zhe-Sung Wu, Chih-Yu Tsai, Mei-Hua Chen, Chia-Ling Lu, Yu-Ju Wang, Yu-Chun Huang, Tzu-Lin Liu, Wen-Tsung Weng, Ya-Hsin Tseng
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Publication number: 20040082174Abstract: A method of wire bonding of a semiconductor device for resolving oxidation of copper bonding pad is disclosed. The method comprises the steps of exposing the copper bonding pad of a wafer which has been completed with semiconductor circuit fabrication; covering the copper bonding pad of the wafer with a protective anti-oxidization film which will be vaporized when heated; performing wire bonding directly without requiring the removal of the protective film, employing ultrasonic vibration energy, pressurizing deformation energy and heat energy in the course of bonding to vaporize the protective film so that the metal wire and the copper pad form a large area intermetallic compound layer for bonding.Type: ApplicationFiled: October 21, 2003Publication date: April 29, 2004Inventors: Wen-Lo Shieh, Fu-Yu Huang, Ning Huang, Hui-Pin Chen, Shu-Wan Lu, Zhe-Sung Wu, Chih-Yu Tsai, Mei-Hua Chen, Chia-Ling Lu, Yu-Ju Wang, Yu-Chun Huang, Tzu-Lin Liu, Wen-Tsung Weng, Ya-Hsin Tseng
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Publication number: 20030160316Abstract: An open-typed multi-chip stack-packaging is disclosed and the packaging comprises a substrate having a first surface and a second surface, at least a through opening formed on the substrate, and including at least two layers of circuitry to electrically transmit signals; at least a first chip positioned on the upper section of the opening of the first surface and a plurality of protruded blocks being soldered onto the circuitry on the first surface of the substrate at the external region of the substrate for electrically connection; at least a second chip stacked onto the first chip and the second chip being connected electrically to the circuitry of the first surface with gold lines; at least a third chip positioned at the lower section of the opening of the second surface and having a size smaller than the first chip, and a plurality of protruded blocks being used to electrically bond with the center position of the first chip, and adhesive being used to fill the first chip and the third chip, and the regioType: ApplicationFiled: January 13, 2003Publication date: August 28, 2003Inventors: Wen-Lo Shieh, Fu-Yu Huang, Ning Huang, Hui-Pin Chen, Shu-Wan Lu, Tou-Sung Wu, Chih-Yu Tsai, Mei-Hua Chen, Chia-Ling Lu, Yu-Ju Wang
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Publication number: 20020124903Abstract: A light weight and fast drying warp weaving fabric that is capable of absorbing and dispersing perspiration in one direction is fabricated by warp or weft yarns made from P.P. or PVC fibers or yarns which have water absorption and dispersion capability and low water content and low specific weight property, and weft or warp yarns made from natural fibers, manmade fibers or synthetic fibers which have high water absorption and dispersion capability. The weft yarns are formed linearly in the fabric texture and the warp yarns are formed in an undulant manner threading around the weft yarns such that the warp yarns are woven at the inner layer of the fabric texture for constantly contact the skin of human body and the weft yarns are woven at the outer layer of the texture remote from the skin.Type: ApplicationFiled: December 29, 2000Publication date: September 12, 2002Inventor: Mei-Hua Chen
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Patent number: 6439270Abstract: A light weight and fast drying warp weaving fabric that is capable of absorbing and dispersing perspiration in one direction is fabricated by warp or weft yarns made from P.P. or PVC fibers or yarns having water absorption and dispersion capability, low water content and low specific weight, and weft or warp yarns made from natural fibers, or synthetic fibers having high water absorption and dispersion capability. The weft yarns of the fabric are linear while the warp yarns are undulantly threaded around the weft yarns such that the warp yarns contact a person's skin and the weft yarns are remote from the skin. The warp yarns absorb perspiration from the skin and transport the moisture to the weft yarns so that the warp yarns keep the skin dry and comfortable, while the moisture in the weft yarns is dispersed and vaporized for fast drying.Type: GrantFiled: December 29, 2000Date of Patent: August 27, 2002Inventor: Mei-Hua Chen
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Patent number: 6397397Abstract: A ladies' underwear fabrication method and structure that in addition to addressing the difficulty of effectively keeping conventionally fabricated women's underwear in position while worn also provides a newly researched and developed fabrication method that improves finished product appearance and comfort. A double-layer elastic fabric material is overlapped, a punch cutting pattern of a bust-shaped section is traced, breast cups are emplaced, and the fabric material is folded back and cut into shape. Tension-adjustable straps are then attached to the torso band section extending from the bottom of the brassiere and, furthermore, the upper end of the torso band section to effectively provide for stronger positioning and an enhanced bustline profile while the ladies underwear of the present invention is worn.Type: GrantFiled: October 19, 2001Date of Patent: June 4, 2002Inventor: Mei-Hua Chen