Patents by Inventor Mei-Ju Lu
Mei-Ju Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11982853Abstract: An optoelectronic package and a method of manufacturing an optoelectronic package are provided. The optoelectronic package includes a carrier. The carrier includes a first region and a second region. The first region is configured to supply power to a processing unit disposed on the carrier. The second region is for accommodating at least one optoelectronic device electrically coupled to the processing unit.Type: GrantFiled: October 1, 2021Date of Patent: May 14, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jr-Wei Lin, Mei-Ju Lu
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Publication number: 20240113061Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.Type: ApplicationFiled: December 5, 2023Publication date: April 4, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Ju LU, Chi-Han CHEN, Chang-Yu LIN, Jr-Wei LIN, Chih-Pin HUNG
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Publication number: 20240094460Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, a connection structure, and an electronic component. The photonic component has an active surface. The connection structure is in contact with the active surface of the photonic component. The electronic component is embedded in the connection structure. The connection structure includes a first redistribution structure in contact with the active surface of the photonic component.Type: ApplicationFiled: September 20, 2022Publication date: March 21, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Patent number: 11929357Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.Type: GrantFiled: October 20, 2021Date of Patent: March 12, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jr-Wei Lin, Mei-Ju Lu
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Publication number: 20240019647Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component, an optical component, and a connection element. The photonic component includes an optical transmission portion, which includes a plurality of first terminals exposed from a first surface of the photonic component. The optical component faces the first surface of the photonic component. The optical component is configured to transmit optical signals to or receive optical signals from the optical transmission portion. The connection element is disposed between the first surface of the photonic component and the optical component. The connection element is configured to reshape the optical signals.Type: ApplicationFiled: July 15, 2022Publication date: January 18, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Publication number: 20240006396Abstract: An optical device is provided. The optical device includes a processing component, a first electronic component, a second electronic component, a first pillar, and an encapsulant. The first electronic component is disposed over and electrically connected to the processing component. The second electronic component is disposed over the processing component and electrically connected to the first electronic component. The first pillar is disposed between the first electronic component and the second electronic component and electrically connected to the processing component. The encapsulant is disposed over the processing component. The encapsulant encapsulates the first electronic component, the second electronic component, and the first pillar.Type: ApplicationFiled: July 1, 2022Publication date: January 4, 2024Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Patent number: 11835757Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component. The photonic component has a bottom surface and a lateral surface. The lateral surface of the photonic component includes a light coupling region and a non-light coupling plane. The non-light coupling plane contacts the bottom surface. The light coupling region and the non-light coupling plane are not aligned.Type: GrantFiled: October 1, 2021Date of Patent: December 5, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Ju Lu, Jr-Wei Lin, Chang-Feng You
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Patent number: 11837566Abstract: An electronic device package includes a circuit layer, a first semiconductor die, a second semiconductor die, a plurality of first conductive structures and a second conductive structure. The first semiconductor die is disposed on the circuit layer. The second semiconductor die is disposed on the first semiconductor die, and has an active surface toward the circuit layer. The first conductive structures are disposed between a first region of the second semiconductor die and the first semiconductor die, and electrically connecting the first semiconductor die to the second semiconductor die. The second conductive structure is disposed between a second region of the second semiconductor die and the circuit layer, and electrically connecting the circuit layer to the second semiconductor die.Type: GrantFiled: November 23, 2021Date of Patent: December 5, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Mei-Ju Lu, Chi-Han Chen, Chang-Yu Lin, Jr-Wei Lin, Chih-Pin Hung
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Patent number: 11714243Abstract: A device is provided. The device may be an optical device, a light coupling device, or a device containing an optical structure. The device includes a waveguide, a cladding, and a light coupling material. The light coupling material is disposed adjacent to the waveguide and has a first surface and a second surface, where the second surface is disposed further away from the waveguide than the first surface and a thickness of the second surface is greater than that of the first surface.Type: GrantFiled: December 18, 2020Date of Patent: August 1, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jr-Wei Lin, Sin-Yuan Mu, Mei-Ju Lu
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Patent number: 11675136Abstract: An optoelectronic structure includes a substrate, an electronic die and a photonic die. The electronic die is disposed on the substrate and includes a first surface, wherein the first surface is configured to support an optical component. The photonic die is disposed on the first surface of the electronic die and has an active surface toward the first surface of the electronic die and a side surface facing the optical component.Type: GrantFiled: December 21, 2020Date of Patent: June 13, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jr-Wei Lin, Mei-Ju Lu
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Publication number: 20230120036Abstract: An optoelectronic package structure is provided. The optoelectronic package includes a carrier, an electronic component, a photonic component and a first power supply path in the carrier. The carrier includes a first region and the electronic component is disposed over the first region of the carrier. A first power supply path is electrically connects the electronic component.Type: ApplicationFiled: October 20, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Publication number: 20230121954Abstract: An optoelectronic package structure is provided. The optoelectronic package structure includes a heat source, a thermal conductive element, and a first optoelectronic component and a second optoelectronic component. The thermal conductive element is disposed over the heat source. The thermal conductive element defines a thermal conduction path P2 by which heat is transferred from the heat source to the thermal conductive element. The first optoelectronic component and the second optoelectronic component are arranged along an axis different from a thermal conduction path P2.Type: ApplicationFiled: October 15, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Publication number: 20230122292Abstract: An optoelectronic package includes an input/output (I/O) component, a photonic component, and an electronic component configured to modulate optical signals in the photonic component. The I/O component is electrically connected to the photonic component via the electronic component.Type: ApplicationFiled: October 20, 2021Publication date: April 20, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Jung Jui KANG
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Publication number: 20230103713Abstract: An optoelectronic package and a method of manufacturing an optoelectronic package are provided. The optoelectronic package includes a carrier. The carrier includes a first region and a second region. The first region is configured to supply power to a processing unit disposed on the carrier. The second region is for accommodating at least one optoelectronic device electrically coupled to the processing unit.Type: ApplicationFiled: October 1, 2021Publication date: April 6, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Publication number: 20230105803Abstract: An optoelectronic package is provided. The optoelectronic package includes a photonic component. The photonic component has a bottom surface and a lateral surface. The lateral surface of the photonic component includes a light coupling region and a non-light coupling plane. The non-light coupling plane contacts the bottom surface. The light coupling region and the non-light coupling plane are not aligned.Type: ApplicationFiled: October 1, 2021Publication date: April 6, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Ju LU, Jr-Wei LIN, Chang-Feng YOU
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Publication number: 20230081194Abstract: An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.Type: ApplicationFiled: September 10, 2021Publication date: March 16, 2023Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU, Jung Jui KANG
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Patent number: 11598927Abstract: An optoelectronic device includes a carrier, an electronic component, a photonic component and a supportive component. The electronic component is electrically coupled to the carrier. The photonic component is electrically coupled to the electronic component. The supportive component is disposed outside the photonic component and the electronic component and configured to support an optical component.Type: GrantFiled: September 10, 2021Date of Patent: March 7, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Jr-Wei Lin, Mei-Ju Lu, Jung Jui Kang
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Publication number: 20220196934Abstract: A device is provided. The device may be an optical device, a light coupling device, or a device containing an optical structure. The device includes a waveguide, a cladding, and a light coupling material. The light coupling material is disposed adjacent to the waveguide and has a first surface and a second surface, where the second surface is disposed further away from the waveguide than the first surface and a thickness of the second surface is greater than that of the first surface.Type: ApplicationFiled: December 18, 2020Publication date: June 23, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Sin-Yuan MU, Mei-Ju LU
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Publication number: 20220196918Abstract: An optoelectronic structure includes a substrate, an electronic die and a photonic die. The electronic die is disposed on the substrate and includes a first surface, wherein the first surface is configured to support an optical component. The photonic die is disposed on the first surface of the electronic die and has an active surface toward the first surface of the electronic die and a side surface facing the optical component.Type: ApplicationFiled: December 21, 2020Publication date: June 23, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Jr-Wei LIN, Mei-Ju LU
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Publication number: 20220181264Abstract: An electronic device package includes a substrate, a first semiconductor die, a second semiconductor die and an encapsulant. The substrate includes a first surface, and a second surface opposite to the first surface. The substrate defines a cavity recessed from the first surface. The first semiconductor die is disposed in the cavity. The second semiconductor die is disposed over and electrically connected to the first semiconductor die. The encapsulant is disposed in the cavity of the substrate. The encapsulant encapsulates a first sidewall of the first semiconductor die, and exposes a second sidewall of the first semiconductor die.Type: ApplicationFiled: February 22, 2022Publication date: June 9, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Mei-Ju LU, Jr-Wei LIN