Patents by Inventor Mei-Lin Hsieh
Mei-Lin Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11450596Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.Type: GrantFiled: November 22, 2019Date of Patent: September 20, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yi-Cheng Hsu, Chih-Hung Hsu, Mei-Lin Hsieh, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu, Chin Li Huang
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Device including a plurality of leads surrounding a die paddle and method for manufacturing the same
Patent number: 11139225Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.Type: GrantFiled: June 14, 2019Date of Patent: October 5, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Kuang-Hsiung Chen, Chih-Hung Hsu, Mei-Lin Hsieh, Yi-Cheng Hsu, Yuan-Chun Chen, Yu-Shun Hsieh, Ko-Pu Wu -
Publication number: 20210159155Abstract: A lead frame includes a die paddle, a plurality of leads, at least one connector and a bonding layer. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle and an outer lead portion opposite to the inner lead portion. The connector is connected to the die paddle and the inner lead portions of the leads. The bonding layer is disposed on a lower surface of the die paddle and a lower surface of each of the outer lead portions.Type: ApplicationFiled: November 22, 2019Publication date: May 27, 2021Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Yi-Cheng HSU, Chih-Hung HSU, Mei-Lin HSIEH, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU, Chin LI HUANG
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Publication number: 20200395275Abstract: A device includes a die paddle and a plurality of leads. The leads surround the die paddle. Each of the leads includes an inner lead portion adjacent to and spaced apart from the die paddle, an outer lead portion opposite to the inner lead portion and a bridge portion between the inner lead portion and the outer lead portion. The inner lead portion has an upper bond section connected to the bridge portion and a lower support section below the upper bond section. A sum of a thickness of the upper bond section and a thickness of the lower support section is greater than a thickness of the bridge portion.Type: ApplicationFiled: June 14, 2019Publication date: December 17, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Kuang-Hsiung CHEN, Chih-Hung HSU, Mei-Lin HSIEH, Yi-Cheng HSU, Yuan-Chun CHEN, Yu-Shun HSIEH, Ko-Pu WU
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Patent number: 8592962Abstract: A Quad Flat No Leads (QFN) package includes a lead frame, a chip, an encapsulant, and a protective layer. The lead frame includes a plurality of leads. Each of the leads has a lower surface that is divided into a contact area and a non-contact area. The chip is configured on and electrically connected to the lead frame. The encapsulant encapsulates the chip and the leads and fills spaces between the leads. The contact areas and the non-contact areas of the leads are exposed by the encapsulant. The protective layer covers the non-contact areas of the leads.Type: GrantFiled: August 29, 2011Date of Patent: November 26, 2013Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Kuang-Hsiung Chen, Sheng-Ming Wang, Hsiang-Ming Feng, Yu-Ying Lee, Mei-Lin Hsieh
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Patent number: 8304865Abstract: A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation.Type: GrantFiled: August 19, 2010Date of Patent: November 6, 2012Assignee: Advanced Semiconductor Engineering, Inc.Inventors: Yueh-Chen Hsu, Mei-Lin Hsieh, Chih-Hung Hsu, Kuang-Hsiung Chen, Yi-Cheng Hsu
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Patent number: 8214139Abstract: Techniques are described for position source selection. In an implementation, an electronic device provides a variety of functionality including at least functionality to determine position. The electronic device may be further configured to select between a plurality of position sources to determine position based upon a variety of selection criteria. In an implementation, a last known position may be stored when position is being determined through the plurality of position sources. The last known position may be used as an alternative to determining position via the position sources when one or more of the position sources are unavailable. In another implementation, the last known position may be employed to automatically select one of the plurality of position sources to be used by the electronic device for determining position.Type: GrantFiled: June 25, 2008Date of Patent: July 3, 2012Assignee: Garmin Switzerland GmbHInventors: Jason B. Yonker, Mei-Lin Hsieh, Bernhard P. Weisshaar, Haitao Huang, Merlin J. Smith
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Publication number: 20120104584Abstract: A Quad Flat No Leads (QFN) package includes a lead frame, a chip, an encapsulant, and a protective layer. The lead frame includes a plurality of leads. Each of the leads has a lower surface that is divided into a contact area and a non-contact area. The chip is configured on and electrically connected to the lead frame. The encapsulant encapsulates the chip and the leads and fills spaces between the leads. The contact areas and the non-contact areas of the leads are exposed by the encapsulant. The protective layer covers the non-contact areas of the leads.Type: ApplicationFiled: August 29, 2011Publication date: May 3, 2012Inventors: Kuang-Hsiung Chen, Sheng-Ming Wang, Hsiang-Ming Feng, Yu-Ying Lee, Mei-Lin Hsieh
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Publication number: 20110062567Abstract: A leadframe including a die pad, leads, an outer frame, connecting bars and grounding bars is provided. Each of the grounding bars is suspended between two connecting bars by being connected with branches of the two connecting bars, such that the grounding bars are spaced by the die pad. The leadframe and the chip package of the present invention can permit a great design variation.Type: ApplicationFiled: August 19, 2010Publication date: March 17, 2011Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yueh-Chen Hsu, Mei-Lin Hsieh, Chih-Hung Hsu, Kuang-Hsiung Chen, Yi-Cheng Hsu
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Publication number: 20090192709Abstract: Techniques are described for position source selection. In an implementation, an electronic device provides a variety of functionality including at least functionality to determine position. The electronic device may be further configured to select between a plurality of position sources to determine position based upon a variety of selection criteria. In an implementation, a last known position may be stored when position is being determined through the plurality of position sources. The last known position may be used as an alternative to determining position via the position sources when one or more of the position sources are unavailable. In another implementation, the last known position may be employed to automatically select one of the plurality of position sources to be used by the electronic device for determining position.Type: ApplicationFiled: June 25, 2008Publication date: July 30, 2009Applicant: Garmin Ltd.Inventors: Jason B. Yonker, Mei-Lin Hsieh, Bernhard P. Weisshaar, Haitao Huang, Merlin J. Smith
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Publication number: 20080230882Abstract: A chip package structure includes a die pad of which at least a notch is formed on at least one side and opposite to a mold gate. The die pad contributes to accelerating the injection of an encapsulating material, so as to exhaust the air in the mold in time, before the encapsulating material solidifies during the molding step, thereby overcoming or at least improving the problem of defects such as air bubbles in the encapsulation.Type: ApplicationFiled: March 19, 2008Publication date: September 25, 2008Inventors: Mei-Lin Hsieh, Chih-Hung Hsu, Kuang-Hsiung Chen
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Publication number: 20080185698Abstract: A semiconductor package structure is disclosed. The structure comprises a die pad, a chip, leads, a recess, and an encapsulant. The chip is disposed on the die pad. The leads are disposed on a periphery of the die pad and electrically connected to the chip. The recess is formed on the top surface of at least one of the leads and extends to the outside surface thereof. The encapsulant is used for encapsulating the die pad, the chip, the leads, and the recess.Type: ApplicationFiled: November 19, 2007Publication date: August 7, 2008Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Yen-Wen Tseng, Mei-Lin Hsieh, Chih-Hung Hsu, Kuang-Hsiung Chen