Abstract: Devices and methods related to an integrated circuit device are provided. The integrated circuit device includes a mother die and a daughter die, in which the daughter die embedded is in a substrate of the integrated circuit device. Micro bumps of the mother die and the daughter die interface together to form a direct down connection between the mother die and the daughter die.

Abstract: Devices and methods related to an integrated circuit device are provided. The integrated circuit device includes a mother die and a daughter die, in which the daughter die embedded is in a substrate of the integrated circuit device. Micro bumps of the mother die and the daughter die interface together to form a direct down connection between the mother die and the daughter die.

Abstract: The present disclosure relates to an innovative method of assigning signals to general-purpose input/output pads of an integrated circuit chip. An inductance matrix for the input/output pads is obtained. A candidate assignment is made of a differential signal to a pair of the input/output pads, and a differential mutual inductance is determined for each open pad location in relation to the pair of input/output pads. Single-ended signals are assigned to open pad locations having the lowest differential mutual inductances. The jitter contribution due to each assigned single-ended signal is computed, and a total jitter is updated. In a first embodiment, said assigning, computing and updating steps are repeated until the total jitter exceeds a total jitter budget. In a second embodiment, said assigning, computing and updating steps are repeated until a number of assigned single-ended signals is equal to a target number. Other embodiments and features are also disclosed.