Abstract: The embodiments of the present invention disclose a backplane and backplane system. The backplane includes at least two service slots with the same function and an exchange slot. Among the pins of different service slots with the same function respectively connected to the exchange slot, at least two pins are arranged to resemble a stepped form. When arranged in this manner, the distribution and orientation of the connection lines connecting the pins of the service slots with the same function to the exchange slot may be adjusted, and wiring density within a single wiring layer may be increased, which therefore enables the connection lines between the service slots and the exchange slot to be staggered from each other in less wiring layers or even one wiring layer, and as a result, decreases the number of the wiring layers to be used, and reduces the costs of the backplane.

Abstract: The embodiments of the present invention disclose a backplane and backplane system. The backplane includes at least two service slots with the same function and an exchange slot. Among the pins of different service slots with the same function respectively connected to the exchange slot, at least two pins are arranged to resemble a stepped form. When arranged in this manner, the distribution and orientation of the connection lines connecting the pins of the service slots with the same function to the exchange slot may be adjusted, and wiring density within a single wiring layer may be increased, which therefore enables the connection lines between the service slots and the exchange slot to be staggered from each other in less wiring layers or even one wiring layer, and as a result, decreases the number of the wiring layers to be used, and reduces the costs of the backplane.