Patents by Inventor Mei-Wei WU

Mei-Wei WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing interconnect structures in semiconductor devices
    Patent number: 11978664
    Abstract: A method includes forming a first conductive feature over a semiconductor substrate, forming an ILD layer over the first conductive feature, patterning the ILD layer to form a trench, and forming a conductive layer over the patterned ILD layer to fill the trench. The method further includes polishing the conductive layer to form a via contact configured to interconnect the first conductive feature with a second conductive feature, where polishing the conductive layer exposes a top surface of the ILD layer, polishing the exposed top surface of the ILD layer, such that a top portion of the via contact protrudes from the exposed top surface of the ILD layer, and forming the second conductive feature over the via contact, such that the top portion of the via contact extends into the second conductive feature.
    Type: Grant
    Filed: July 29, 2022
    Date of Patent: May 7, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Pang-Sheng Chang, Chao-Hsun Wang, Kuo-Yi Chao, Fu-Kai Yang, Mei-Yun Wang, Li-Chieh Wu, Chun-Wei Hsu
  • Mechanisms for cleaning load ports of semiconductor process tools
    Patent number: 9691640
    Abstract: Embodiments of mechanisms for cleaning load ports of semiconductor process tools are provided. The automatic system includes a vacuum cleaner, a rail, and a transport mechanism. The transport mechanism is moveably disposed on the rail and transfers the vacuum cleaner along the rail. The automatic system also includes a system controller. The system controller is connected to the semiconductor process tools and the transport mechanism to detect which load port is unoccupied, such that the system controller controls the transport mechanism to transfer the vacuum cleaner to the unoccupied load port to perform a cleaning process.
    Type: Grant
    Filed: September 11, 2013
    Date of Patent: June 27, 2017
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Ching-Fa Chen, Hung-Wen Chen, Mei-Wei Wu
  • MECHANISMS FOR CLEANING LOAD PORTS OF SEMICONDUCTOR PROCESS TOOLS
    Publication number: 20150068554
    Abstract: Embodiments of mechanisms for cleaning load ports of semiconductor process tools are provided. The automatic system includes a vacuum cleaner, a rail, and a transport mechanism. The transport mechanism is moveably disposed on the rail and transfers the vacuum cleaner along the rail. The automatic system also includes a system controller. The system controller is connected to the semiconductor process tools and the transport mechanism to detect which load port is unoccupied, such that the system controller controls the transport mechanism to transfer the vacuum cleaner to the unoccupied load port to perform a cleaning process.
    Type: Application
    Filed: September 11, 2013
    Publication date: March 12, 2015
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Ching-Fa CHEN, Hung-Wen CHEN, Mei-Wei WU