Patents by Inventor Meizi Jiao
Meizi Jiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240126120Abstract: A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes (LEDs) on a printed circuit board. The display may have a notch to accommodate an input-output component. Reflective layers may be included in the notch. The backlight may include a color conversion layer with a property that varies as a function of position. The light-emitting diodes may be covered by a slab of encapsulant with recesses in an upper surface.Type: ApplicationFiled: December 8, 2023Publication date: April 18, 2024Inventors: Meizi Jiao, Joshua A. Spechler, Jie Xiang, Zhenyue Luo, Chungjae Lee, Morteza Amoorezaei, Mengyang Liang, Xinyu Zhu, Mingxia Gu, Jun Qi, Eric L. Benson, Victor H. Yin, Youchul Jeong, Xiang Fang, Yanming Li, Michael J. Lee, Marianna C. Sbordone, Ari P. Miller, Edward J. Cooper, Michael C. Sulkis, Francesco Ferretti, Seth G. McFarland, Mary M. Morrison, Eric N. Vergo, Terence Chan, Ian A. Guy, Keith J. Hendren, Sunitha Chandra
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Publication number: 20240088052Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.Type: ApplicationFiled: November 17, 2023Publication date: March 14, 2024Inventors: Bai NIE, Gang DUAN, Srinivas PIETAMBARAM, Jesse JONES, Yosuke KANAOKA, Hongxia FENG, Dingying XU, Rahul MANEPALLI, Sameer PAITAL, Kristof DARMAWIKARTA, Yonggang LI, Meizi JIAO, Chong ZHANG, Matthew TINGEY, Jung Kyu HAN, Haobo CHEN
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Patent number: 11923312Abstract: A die assembly is disclosed. The die assembly includes a die, one or more die pads on a first surface of the die and a die attach film on the die where the die attach film includes one or more openings that expose the one or more die pads and that extend to one or more edges of the die.Type: GrantFiled: March 27, 2019Date of Patent: March 5, 2024Assignee: Intel CorporationInventors: Bai Nie, Gang Duan, Srinivas Pietambaram, Jesse Jones, Yosuke Kanaoka, Hongxia Feng, Dingying Xu, Rahul Manepalli, Sameer Paital, Kristof Darmawikarta, Yonggang Li, Meizi Jiao, Chong Zhang, Matthew Tingey, Jung Kyu Han, Haobo Chen
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Patent number: 11874559Abstract: A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes (LEDs) on a printed circuit board. The display may have a notch to accommodate an input-output component. Reflective layers may be included in the notch. The backlight may include a color conversion layer with a property that varies as a function of position. The light-emitting diodes may be covered by a slab of encapsulant with recesses in an upper surface.Type: GrantFiled: November 4, 2021Date of Patent: January 16, 2024Assignee: Apple Inc.Inventors: Meizi Jiao, Joshua A. Spechler, Jie Xiang, Zhenyue Luo, Chungjae Lee, Morteza Amoorezaei, Mengyang Liang, Xinyu Zhu, Mingxia Gu, Jun Qi, Eric L. Benson, Victor H. Yin, Youchul Jeong, Xiang Fang, Yanming Li, Michael J. Lee, Marianna C. Sbordone, Ari P. Miller, Edward J. Cooper, Michael C. Sulkis, Francesco Ferretti, Seth G. McFarland, Mary M. Morrison, Eric N. Vergo, Terence Chan, Ian A. Guy, Keith J. Hendren, Sunitha Chandra
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Patent number: 11719978Abstract: A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes (LEDs) on a printed circuit board. The display may have a notch to accommodate an input-output component. Reflective layers may be included in the notch. The backlight may include a color conversion layer with a property that varies as a function of position. The light-emitting diodes may be covered by a slab of encapsulant with recesses in an upper surface.Type: GrantFiled: November 4, 2021Date of Patent: August 8, 2023Assignee: Apple Inc.Inventors: Zhenyue Luo, Meizi Jiao, Morteza Amoorezaei, Ling Han, Chungjae Lee, Ziruo Hong, Wei He, Rong Liu, Xinyu Zhu, Mingxia Gu, Jun Qi, Eric L. Benson, Victor H. Yin
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Patent number: 11721677Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a die having a first surface and an opposing second surface; a capacitor having a surface, wherein the surface of the capacitor is coupled to the first surface of the die; and a conductive pillar coupled to the first surface of the die. In some embodiments, a microelectronic assembly may include a capacitor in a first dielectric layer; a conductive pillar in the first dielectric layer; a first die having a surface in the first dielectric layer; and a second die having a surface in a second dielectric layer, wherein the second dielectric layer is on the first dielectric layer, and wherein the surface of the second die is coupled to the capacitor, to the surface of the first die, and to the conductive pillar.Type: GrantFiled: December 27, 2018Date of Patent: August 8, 2023Assignee: Intel CorporationInventors: Chong Zhang, Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao
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Publication number: 20230238368Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a die having a first surface and an opposing second surface; a capacitor having a surface, wherein the surface of the capacitor is coupled to the first surface of the die; and a conductive pillar coupled to the first surface of the die. In some embodiments, a microelectronic assembly may include a capacitor in a first dielectric layer; a conductive pillar in the first dielectric layer; a first die having a surface in the first dielectric layer; and a second die having a surface in a second dielectric layer, wherein the second dielectric layer is on the first dielectric layer, and wherein the surface of the second die is coupled to the capacitor, to the surface of the first die, and to the conductive pillar.Type: ApplicationFiled: March 30, 2023Publication date: July 27, 2023Inventors: Chong ZHANG, Cheng XU, Junnan ZHAO, Ying WANG, Meizi JIAO
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Publication number: 20230197351Abstract: Embodiments herein relate to systems, apparatuses, or processes directed to packages that include one or more glass cores that have thin film capacitors on one or more sides of the one or more glass cores. The film capacitors may be formed in-situ on the glass cores during substrate manufacturing. Other embodiments may be described and/or claimed.Type: ApplicationFiled: December 21, 2021Publication date: June 22, 2023Inventors: Chong ZHANG, Cheng XU, Junnan ZHAO, Ying WANG, Meizi JIAO
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Publication number: 20230187205Abstract: Embodiments may relate to a semiconductor package that includes a die and a glass core coupled with the die. The glass core may include a cavity with an interconnect structure therein. The interconnect structure may include pads on a first side that are coupled with the die, and pads on a second side opposite the first side. Other embodiments may be described and/or claimed.Type: ApplicationFiled: February 7, 2023Publication date: June 15, 2023Applicant: Intel CorporationInventors: Ying Wang, Chong Zhang, Meizi Jiao, Junnan Zhao, Cheng Xu, Yikang Deng
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Patent number: 11676891Abstract: A package substrate and package assembly including a package substrate including a substrate body including electrical routing features therein and a surface layer and a plurality of first and second contact points on the surface layer including a first pitch and a second pitch, respectively, wherein the plurality of first contact points and the plurality of second contact points are continuous posts to the respective ones of the electrical routing features. A method including forming first conductive vias in a package assembly, wherein the first conductive vias include substrate conductive vias to electrical routing features in a package substrate and bridge conductive vias to bridge surface routing features of a bridge substrate; forming a first surface layer and a second surface layer on the package substrate; and forming second conductive vias through each of the first surface layer and the second surface layer to the bridge conductive vias.Type: GrantFiled: June 30, 2021Date of Patent: June 13, 2023Assignee: Intel CorporationInventors: Hongxia Feng, Dingying David Xu, Sheng C. Li, Matthew L. Tingey, Meizi Jiao, Chung Kwang Christopher Tan
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Patent number: 11640934Abstract: Techniques for fabricating a package substrate comprising a via, a conductive line, and a pad are described. The package substrate can be included in a semiconductor package. For one technique, a package substrate includes: a pad in a dielectric layer; a via; and a conductive line. The via and the conductive line can be part of a structure. Alternatively, the conductive line can be adjacent to the via. The dielectric layer can include a pocket above the pad. One or more portions of the via may be formed in the pocket above the pad. Zero or more portions of the via can be formed on the dielectric layer outside the pocket. In some scenarios, no pad is above the via. The package substrate provides several advantages. One exemplary advantage is that the package substrate can assist with increasing an input/output density per millimeter per layer (IO/mm/layer) of the package substrate.Type: GrantFiled: March 30, 2018Date of Patent: May 2, 2023Assignee: Intel CorporationInventors: Meizi Jiao, Chong Zhang, Hongxia Feng, Kevin Mccarthy
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Publication number: 20230093750Abstract: A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes (LEDs) on a printed circuit board. The display may have a notch to accommodate an input-output component. Reflective layers may be included in the notch. The backlight may include a color conversion layer with a property that varies as a function of position. The light-emitting diodes may be covered by a slab of encapsulant with recesses in an upper surface.Type: ApplicationFiled: November 4, 2021Publication date: March 23, 2023Inventors: Zhenyue Luo, Meizi Jiao, Morteza Amoorezaei, Ling Han, Chungjae Lee, Ziruo Hong, Wei He, Rong Liu, Xinyu Zhu, Mingxia Gu, Jun Qi, Eric L. Benson, Victor H. Yin
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Publication number: 20230091389Abstract: A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes (LEDs) on a printed circuit board. The display may have a notch to accommodate an input-output component. Reflective layers may be included in the notch. The backlight may include a color conversion layer with a property that varies as a function of position. The light-emitting diodes may be covered by a slab of encapsulant with recesses in an upper surface.Type: ApplicationFiled: November 4, 2021Publication date: March 23, 2023Inventors: Meizi Jiao, Joshua A. Spechler, Jie Xiang, Zhenyue Luo, Chungjae Lee, Morteza Amoorezaei, Mengyang Liang, Xinyu Zhu, Mingxia Gu, Jun Qi, Eric L. Benson, Victor H. Yin, Youchul Jeong, Xiang Fang, Yanming Li, Michael J. Lee, Marianna C. Sbordone, Ari P. Miller, Edward J. Cooper, Michael C. Sulkis, Francesco Ferretti, Seth G. McFarland, Mary M. Morrison, Eric N. Vergo, Terence Chan, Ian A. Guy, Keith J. Hendren
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Publication number: 20230022714Abstract: A package substrate and package assembly including a package substrate including a substrate body including electrical routing features therein and a surface layer and a plurality of first and second contact points on the surface layer including a first pitch and a second pitch, respectively, wherein the plurality of first contact points and the plurality of second contact points are continuous posts to the respective ones of the electrical routing features. A method including forming first conductive vias in a package assembly, wherein the first conductive vias include substrate conductive vias to electrical routing features in a package substrate and bridge conductive vias to bridge surface routing features of a bridge substrate; forming a first surface layer and a second surface layer on the package substrate; and forming second conductive vias through each of the first surface layer and the second surface layer to the bridge conductive vias.Type: ApplicationFiled: September 29, 2022Publication date: January 26, 2023Inventors: Hongxia Feng, Dungying David Xu, Sheng C. Li, Matthew L. Tingey, Meizi Jiao, Chung Kwang Christopher Tan
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Patent number: 11557579Abstract: Microelectronic assemblies, related devices, and methods are disclosed herein. In some embodiments, a microelectronic assembly may include a die having a first surface and an opposing second surface; a capacitor having a surface, wherein the surface of the capacitor is coupled to the first surface of the die; and a conductive pillar coupled to the first surface of the die. In some embodiments, a microelectronic assembly may include a capacitor in a first dielectric layer; a conductive pillar in the first dielectric layer; a first die having a surface in the first dielectric layer; and a second die having a surface in a second dielectric layer, wherein the second dielectric layer is on the first dielectric layer, and wherein the surface of the second die is coupled to the capacitor, to the surface of the first die, and to the conductive pillar.Type: GrantFiled: December 21, 2020Date of Patent: January 17, 2023Assignee: Intel CorporationInventors: Chong Zhang, Cheng Xu, Junnan Zhao, Ying Wang, Meizi Jiao
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Patent number: 11513392Abstract: A display may have a pixel array such as a liquid crystal pixel array. The pixel array may be illuminated with backlight illumination from a direct-lit backlight unit. The backlight unit may include an array of light-emitting diodes (LEDs) on a printed circuit board. The display may have a notch to accommodate an input-output component. Reflective layers may be included in the notch. The backlight may include a color conversion layer with a property that varies as a function of position. The light-emitting diodes may be covered by a slab of encapsulant with recesses in an upper surface.Type: GrantFiled: November 4, 2021Date of Patent: November 29, 2022Assignee: Apple Inc.Inventors: Zhenyue Luo, Morteza Amoorezaei, Qingbing Wang, Chenhua You, Meizi Jiao, Chungjae Lee, Joshua A. Spechler, Xinyu Zhu, Mingxia Gu, Jun Qi, Eric L. Benson, Victor H. Yin
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Publication number: 20220102261Abstract: Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.Type: ApplicationFiled: December 7, 2021Publication date: March 31, 2022Inventors: Adel A. ELSHERBINI, Mathew J. MANUSHAROW, Krishna BHARATH, William J. LAMBERT, Robert L. SANKMAN, Aleksandar ALEKSOV, Brandon M. RAWLINGS, Feras EID, Javier SOTO GONZALEZ, Meizi JIAO, Suddhasattwa NAD, Telesphor KAMGAING
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Patent number: 11227825Abstract: Embodiments of the invention include an electrical package and methods of forming the package. In one embodiment, a transformer may be formed in the electrical package. The transformer may include a first conductive loop that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first conductive loop from a second conductive loop that is formed in the package. Additional embodiments of the invention include forming a capacitor formed in the electrical package. For example, the capacitor may include a first capacitor plate that is formed over a first dielectric layer. A thin dielectric spacer material may be used to separate the first capacitor plate form a second capacitor plate that is formed in the package. The thin dielectric spacer material in the transformer and capacitor allow for increased coupling factors and capacitance density in electrical components.Type: GrantFiled: December 21, 2015Date of Patent: January 18, 2022Assignee: Intel CorporationInventors: Adel A. Elsherbini, Mathew J. Manusharow, Krishna Bharath, William J. Lambert, Robert L. Sankman, Aleksandar Aleksov, Brandon M. Rawlings, Feras Eid, Javier Soto Gonzalez, Meizi Jiao, Suddhasattwa Nad, Telesphor Kamgaing
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Publication number: 20210327800Abstract: A package substrate and package assembly including a package substrate including a substrate body including electrical routing features therein and a surface layer and a plurality of first and second contact points on the surface layer including a first pitch and a second pitch, respectively, wherein the plurality of first contact points and the plurality of second contact points are continuous posts to the respective ones of the electrical routing features. A method including forming first conductive vias in a package assembly, wherein the first conductive vias include substrate conductive vias to electrical routing features in a package substrate and bridge conductive vias to bridge surface routing features of a bridge substrate; forming a first surface layer and a second surface layer on the package substrate; and forming second conductive vias through each of the first surface layer and the second surface layer to the bridge conductive vias.Type: ApplicationFiled: June 30, 2021Publication date: October 21, 2021Inventors: Hongxia FENG, Dingying David XU, Sheng C. LI, Matthew L. TINGEY, Meizi JIAO, Chung Kwang Christopher TAN
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Patent number: 11088062Abstract: A package substrate and package assembly including a package substrate including a substrate body including electrical routing features therein and a surface layer and a plurality of first and second contact points on the surface layer including a first pitch and a second pitch, respectively, wherein the plurality of first contact points and the plurality of second contact points are continuous posts to the respective ones of the electrical routing features. A method including forming first conductive vias in a package assembly, wherein the first conductive vias include substrate conductive vias to electrical routing features in a package substrate and bridge conductive vias to bridge surface routing features of a bridge substrate; forming a first surface layer and a second surface layer on the package substrate; and forming second conductive vias through each of the first surface layer and the second surface layer to the bridge conductive vias.Type: GrantFiled: July 19, 2017Date of Patent: August 10, 2021Assignee: Intel CorporationInventors: Hongxia Feng, Dingying David Xu, Sheng C. Li, Matthew L. Tingey, Meizi Jiao, Chung Kwang Christopher Tan