Abstract: The present invention concerns a layer structure comprising: a substrate having a glass or ceramic surface, a layer A at least partially covering the glass or ceramic surface of the substrate, wherein layer A comprises a glass in which at least two mutually different elements are contained as oxides, and a layer B at least partially covering the layer A. Layer B comprises: a resistance alloy having a temperature coefficient of electrical resistance less than 150 ppm/K, and optionally a glass containing at least two mutually different elements as oxides. Layer B contains not more than 20 weight percent of glass based on the total weight of layer B.

Abstract: The present invention concerns a layer structure comprising: a substrate having a glass or ceramic surface, a layer A at least partially covering the glass or ceramic surface of the substrate, wherein layer A comprises a glass in which at least two mutually different elements are contained as oxides, and a layer B at least partially covering the layer A. Layer B comprises: a resistance alloy having a temperature coefficient of electrical resistance less than 150 ppm/K, and optionally a glass containing at least two mutually different elements as oxides. Layer B contains not more than 20 weight percent of glass based on the total weight of layer B.

Abstract: Described is a process for preparing a ceramic substrate bonded with a metal foil. Moreover, described is a metal-ceramic-substrate provided with a thick-film layer and the use of a thick-film paste for bonding a metal foil onto a ceramic substrate.

Abstract: The invention relates generally to a process (100) comprising as process steps: a) providing a substrate having a substrate surface; b) providing a first composition, comprising: i) SnCl2, and ii) water; c) providing a second composition, comprising: i) sulfuric acid, and ii) a reducing agent; d) providing a third composition, obtainable by mixing: i) AgNO3, ii) nitric acid, iii) water, and iv) NH3; e) contacting the substrate surface with the first composition under obtaining an activated substrate surface; f) contacting the activated substrate surface with the second composition and the third composition, wherein the activated substrate surface has a temperature in a range from about 10 to about 50° C. The invention further relates to a composite obtainable by the above process; to a composite comprising an Ag-comprising layer; to a composition comprising AgNO3; and to a use of composition comprising AgNO3 for forming conducting paths.