Patents by Inventor Melanie Beauchemin
Melanie Beauchemin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11990386Abstract: A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.Type: GrantFiled: May 28, 2021Date of Patent: May 21, 2024Assignee: Google LLCInventors: Madhusudan K. Iyengar, Christopher Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin, Padam Jain, Teckgyu Kang, Yuan Li, Connor Burgess, Norman Paul Jouppi, Nicholas Stevens-Yu, Yingying Wang
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Patent number: 11895807Abstract: A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material (“PCM”) attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.Type: GrantFiled: May 28, 2020Date of Patent: February 6, 2024Assignee: Google LLCInventors: Madhusudan K. Iyengar, Melanie Beauchemin, Christopher Malone
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Publication number: 20230397378Abstract: A data center thermal control system includes a local cooler configured to cool a local coolant used for cooling electronic hardware, an outer heat exchanger configured to exchange heat from fluid to outside air, and a fluid circulation system configured to convey heat from the local cooler to the outer heat exchanger by circulating at least one fluid cooling medium, the fluid circulation system including a cold portion directed to the air cooler. The thermal control system also includes one or more processors and a non-transitory computer-readable medium storing instructions that, when executed by the one or more processors, would cause the one or more processors to govern the outer heat exchanger to cool fluid in the cold portion to a first target temperature during a hot season, and cool fluid in the cold portion to a lower target temperature during a cold season.Type: ApplicationFiled: June 1, 2022Publication date: December 7, 2023Inventors: Melanie Beauchemin, Madhusudan K. Iyengar, Reza H. Khiabani, Jeremy Rice, Jeffrey Ewin
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Publication number: 20230335928Abstract: An assembly includes a printed circuit board (“PCB”). An aperture extends through the PCB. The assembly also includes an array of pins and a processor package. The array of pins extends around a perimeter of the aperture, and the processor package extends over the aperture. The processor package is pressed against the array of pins by a compressive force couple.Type: ApplicationFiled: April 18, 2022Publication date: October 19, 2023Inventors: William F. Edwards, JR., Xu Zuo, Ryohei Urata, Melanie Beauchemin, Woon-Seong Kwon, Shinnosuke Yamamoto, Houle Gan, Yujeong Shim
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Publication number: 20230244046Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.Type: ApplicationFiled: April 6, 2023Publication date: August 3, 2023Inventors: William F. Edwards, JR., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
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Patent number: 11650384Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.Type: GrantFiled: February 9, 2022Date of Patent: May 16, 2023Assignee: Google LLCInventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
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Patent number: 11462852Abstract: The technology relates to a cage configured to removably receive a module. The cage may include a frame comprising a plurality of panels joined to one another, a lever pivotably coupled to the frame, and a heatsink pivotably coupled to the lever. The panels together may extend around a longitudinal recess configured to receive the module therein. The longitudinal recess may define a longitudinal axis thereof. A first one of the panels may have an aperture defined therein in communication with the longitudinal recess. A first end of the lever may extend into the longitudinal recess. The heatsink may be pivotably coupled to a second end of the lever opposite the first end. The heatsink may be movable in a translation direction transverse to the longitudinal axis. The heatsink may be translatable between a first position outside of the longitudinal recess and a second position partially inside the longitudinal recess.Type: GrantFiled: August 14, 2020Date of Patent: October 4, 2022Assignee: Google LLCInventors: Jerry Chiu, Melanie Beauchemin
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Publication number: 20220269019Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.Type: ApplicationFiled: February 9, 2022Publication date: August 25, 2022Inventors: William F. Edwards, JR., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
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Patent number: 11348859Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.Type: GrantFiled: October 8, 2019Date of Patent: May 31, 2022Assignee: Google LLCInventors: Melanie Beauchemin, Madhusudan Iyengar, Christopher Malone, Gregory Imwalle
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Publication number: 20220052474Abstract: The technology relates to a cage configured to removably receive a module. The cage may include a frame comprising a plurality of panels joined to one another, a lever pivotably coupled to the frame, and a heatsink pivotably coupled to the lever. The panels together may extend around a longitudinal recess configured to receive the module therein. The longitudinal recess may define a longitudinal axis thereof. A first one of the panels may have an aperture defined therein in communication with the longitudinal recess. A first end of the lever may extend into the longitudinal recess. The heatsink may be pivotably coupled to a second end of the lever opposite the first end. The heatsink may be movable in a translation direction transverse to the longitudinal axis. The heatsink may be translatable between a first position outside of the longitudinal recess and a second position partially inside the longitudinal recess.Type: ApplicationFiled: August 14, 2020Publication date: February 17, 2022Inventors: Jerry Chiu, Melanie Beauchemin
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Patent number: 11249264Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.Type: GrantFiled: December 15, 2020Date of Patent: February 15, 2022Assignee: Google LLCInventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
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Publication number: 20220003946Abstract: Heat dissipation and electric shielding techniques and apparatuses are disclosed to enable the operation of OSFP modules at higher bandwidths. OSFP compatible techniques are discussed including the use of water cooling, addition of heat pipes, use of intercoolers, air-fins and air-foils, optimization of cooling fins, use of vapor chambers are discussed.Type: ApplicationFiled: December 15, 2020Publication date: January 6, 2022Inventors: William F. Edwards, Jr., Melanie Beauchemin, Timothy Conrad Lee, Federico Pio Centola, Madhusudan K. Iyengar, Michael Chi Kin Lau, Zuowei Shen, Justin Sishung Lee
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Publication number: 20210378132Abstract: A data rack system includes a data center rack frame, a shelf positioned within the data center rack frame; and a modular battery unit disposed on the shelf. The modular battery unit further includes a housing having an outer surface, a plurality of strips of phase change material (“PCM”) attached to the outer surface and spaced apart from one another; and air flow channels. The air flow channels are formed in spaces between two adjacent strips of the plurality of strips and defined by a shape and size of the spaces between the two adjacent strips.Type: ApplicationFiled: May 28, 2020Publication date: December 2, 2021Inventors: Madhusudan K. Iyengar, Melanie Beauchemin, Christopher Malone
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Publication number: 20210378106Abstract: A method of manufacturing a chip assembly comprises joining an in-process unit to a printed circuit board; reflowing a bonding material disposed between and electrically connecting the in-process unit with the printed circuit board, the bonding material having a first reflow temperature; and then joining a heat distribution device to the plurality of semiconductor chips using a thermal interface material (“TIM”) having a second reflow temperature that is lower than the first reflow temperature. The in-process unit further comprises a substrate having an active surface, a passive surface, and contacts exposed at the active surface; an interposer electrically connected to the substrate; a plurality of semiconductor chips overlying the substrate and electrically connected to the substrate through the interposer, and a stiffener overlying the substrate and having an aperture extending therethrough, the plurality of semiconductor chips being positioned within the aperture.Type: ApplicationFiled: May 28, 2021Publication date: December 2, 2021Inventors: Madhusudan K. Iyengar, Christopher Malone, Woon-Seong Kwon, Emad Samadiani, Melanie Beauchemin, Padam Jain, Teckgyu Kang, Yuan Li, Connor Burgess, Norman Paul Jouppi, Nicholas Stevens-Yu, Yingying Wang
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Patent number: 10905038Abstract: An electromagnetic interference (“EMI”) sheet attenuator includes a planar conductive layer, a first flexible substrate and a second flexible substrate. The first flexible substrate overlies the metal backing layer and including a conductive pattern on a surface of the first flexible substrate. The second flexible substrate overlies the first flexible substrate and also includes the conductive pattern. The conductive pattern on the second flexible substrate is aligned with the conductive pattern on the first flexible substrate.Type: GrantFiled: November 19, 2019Date of Patent: January 26, 2021Assignee: Google LLCInventors: Federico Pio Centola, Zuowei Shen, Xu Gao, Shawn Emory Bender, Melanie Beauchemin, Mark Villegas, Gregory Sizikov, Chee Yee Chung
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Publication number: 20200035583Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.Type: ApplicationFiled: October 8, 2019Publication date: January 30, 2020Inventors: Melanie Beauchemin, Madhusudan Iyengar, Christopher Malone, Gregory Imwalle
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Patent number: 10504816Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.Type: GrantFiled: September 6, 2017Date of Patent: December 10, 2019Assignee: Google LLCInventors: Melanie Beauchemin, Madhusudan Iyengar, Christopher Malone, Gregory Imwalle
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Publication number: 20190074237Abstract: While the use of 2.5D/3D packaging technology results in a compact IC package, it also raises challenges with respect to thermal management. Integrated component packages according to the present disclosure provide a thermal management solution for 2.5D/3D IC packages that include a high-power component integrated with multiple lower-power components. The thermal solution provided by the present disclosure includes a mix of passive cooling by traditional heatsink or cold plate and active cooling by thermoelectric cooling (TEC) elements. Certain methods according to the present disclosure include controlling a temperature during normal operation in an IC package that includes a plurality of lower-power components located adjacent to a high-power component in which the high-power component generates a greater amount of heat relative to each of the lower-power components during normal operation.Type: ApplicationFiled: September 6, 2017Publication date: March 7, 2019Inventors: Melanie Beauchemin, Madhusudan Iyengar, Christopher Malone, Gregory Imwalle
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Patent number: 9918377Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.Type: GrantFiled: April 4, 2017Date of Patent: March 13, 2018Assignee: Google LLCInventors: Zuowei Shen, Kyle Fukuchi, Melanie Beauchemin, Ryohei Urata
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Patent number: 9641254Abstract: The present disclosure discusses an improved optical transceiver. The optical transceiver of the present disclosure includes an optical transmitter and an optical receiver coupled to an area of a printed circuit board that includes a plurality of thermal microvias. The thermal microvias are coupled to a heat sink or other heat dissipater and provide a path from the components of the optical transceiver to the heat dissipater for heat to travel.Type: GrantFiled: April 3, 2015Date of Patent: May 2, 2017Assignee: Google Inc.Inventors: Zuowei Shen, Kyle Fukuchi, Melanie Beauchemin, Ryohei Urata