Patents by Inventor Melanie M. Hagar

Melanie M. Hagar has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9825406
    Abstract: Embodiments of the present invention generally relate to communication connectors, and methods of manufacture thereof and their components. In some embodiments, the methods focus on reducing the net effect on electrical performance of communication connectors from variation in manufacturing, where the connectors include multiple stages of capacitive coupling.
    Type: Grant
    Filed: August 7, 2015
    Date of Patent: November 21, 2017
    Assignee: Panduit Corp.
    Inventors: Satish I. Patel, Robert E. Fransen, Frank M. Straka, Melanie M. Hagar
  • Publication number: 20150349463
    Abstract: A communication jack which includes a housing with an aperture for receiving a communication plug, and a circuit board at least partially within the housing. The circuit board includes crosstalk compensation elements. A plurality of plug interface contacts are connected to the circuit board. At least one of the plurality of plug interface contacts includes a contact element layered with at least one spring element.
    Type: Application
    Filed: August 7, 2015
    Publication date: December 3, 2015
    Applicant: PANDUIT CORP.
    Inventors: Satish I. Patel, Robert E. Fransen, Frank M. Straka, Melanie M. Hagar
  • Patent number: 9136647
    Abstract: A communication connector comprising plug interface contacts having a plurality of conductor pairs, and corresponding cable connector contacts. A printed circuit board connects the plug interface contacts to respective cable connector contacts. The printed circuit board includes circuitry between a first conductor pair and a second conductor pair. The circuitry has a first mutually inductive coupling between a first conductor of the first conductor pair and a first conductor of the second conductor pair, a first capacitive coupling between the first conductor of the first conductor pair and the first conductor of the second conductor pair. The first capacitive coupling is approximately concurrent with the first mutually inductive coupling. A shunt capacitive coupling connects the first conductor of the second conductor pair to a second conductor of the second conductor pair.
    Type: Grant
    Filed: May 30, 2013
    Date of Patent: September 15, 2015
    Assignee: Panduit Corp.
    Inventors: Frank M. Straka, Melanie M. Hagar, Masud Bolouri-Saransar, Ronald A. Nordin
  • Patent number: 9106021
    Abstract: A communication jack which includes a housing with an aperture for receiving a communication plug, and a circuit board at least partially within the housing. The circuit board includes crosstalk compensation elements. A plurality of plug interface contacts are connected to the circuit board. At least one of the plurality of plug interface contacts includes a contact element layered with at least one spring element.
    Type: Grant
    Filed: February 3, 2014
    Date of Patent: August 11, 2015
    Assignee: Panduit Corp.
    Inventors: Satish I. Patel, Robert E. Fransen, Frank M. Straka, Melanie M. Hagar
  • Publication number: 20140148057
    Abstract: A communication jack which includes a housing with an aperture for receiving a communication plug, and a circuit board at least partially within the housing. The circuit board includes crosstalk compensation elements. A plurality of plug interface contacts are connected to the circuit board. At least one of the plurality of plug interface contacts includes a contact element layered with at least one spring element.
    Type: Application
    Filed: February 3, 2014
    Publication date: May 29, 2014
    Applicant: PANDUIT CORP.
    Inventors: Satish I. Patel, Robert E. Fransen, Frank M. Straka, Melanie M. Hagar
  • Patent number: 8641452
    Abstract: A communication jack which includes a housing with an aperture for receiving a communication plug, and a circuit board at least partially within the housing. The circuit board includes crosstalk compensation elements. A plurality of plug interface contacts are connected to the circuit board. At least one of the plurality of plug interface contacts includes a contact element layered with at least one spring element.
    Type: Grant
    Filed: March 20, 2012
    Date of Patent: February 4, 2014
    Assignee: Panduit Corp.
    Inventors: Satish I. Patel, Robert E. Fransen, Frank M. Straka, Melanie M. Hagar
  • Publication number: 20140011393
    Abstract: A communication connector comprising plug interface contacts having a plurality of conductor pairs, and corresponding cable connector contacts. A printed circuit board connects the plug interface contacts to respective cable connector contacts. The printed circuit board includes circuitry between a first conductor pair and a second conductor pair. The circuitry has a first mutually inductive coupling between a first conductor of the first conductor pair and a first conductor of the second conductor pair, a first capacitive coupling between the first conductor of the first conductor pair and the first conductor of the second conductor pair. The first capacitive coupling is approximately concurrent with the first mutually inductive coupling. A shunt capacitive coupling connects the first conductor of the second conductor pair to a second conductor of the second conductor pair.
    Type: Application
    Filed: May 30, 2013
    Publication date: January 9, 2014
    Inventors: Frank M. Straka, Melanie M. Hagar, Masud Bolouri-Saransar, Ronald A. Nordin
  • Publication number: 20120244752
    Abstract: A communication jack which includes a housing with an aperture for receiving a communication plug, and a circuit board at least partially within the housing. The circuit board includes crosstalk compensation elements. A plurality of plug interface contacts are connected to the circuit board. At least one of the plurality of plug interface contacts includes a contact element layered with at least one spring element.
    Type: Application
    Filed: March 20, 2012
    Publication date: September 27, 2012
    Applicant: PANDUIT CORP.
    Inventors: Satish I. Patel, Robert E. Fransen, Frank M. Straka, Melanie M. Hagar