Patents by Inventor Melvin S. Campbell

Melvin S. Campbell has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle
    Patent number: 8453314
    Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
    Type: Grant
    Filed: February 7, 2012
    Date of Patent: June 4, 2013
    Assignee: Raytheon Company
    Inventors: Alberto F. Viscarra, Ethan S. Heinrich, Melvin S. Campbell, David T. Winslow, Kevin C. Rolston, Rosalio S. Vidaurri
  • PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE
    Publication number: 20120137505
    Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
    Type: Application
    Filed: February 7, 2012
    Publication date: June 7, 2012
    Inventors: Alberto F. Viscarra, Ethan S. Heinrich, Melvin S. Campbell, David T. Winslow, Kevin C. Rolston, Rosalio S. Vidaurri
  • Process for fabricating an origami formed antenna radiating structure
    Patent number: 8127432
    Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
    Type: Grant
    Filed: November 17, 2009
    Date of Patent: March 6, 2012
    Assignee: Raytheon Company
    Inventors: Alberto F. Viscarra, Ethan S. Heinrich, Melvin S. Campbell, David T. Winslow, Kevin C. Rolston, Rosalio S. Vidaurri
  • PROCESS FOR FABRICATING AN ORIGAMI FORMED ANTENNA RADIATING STRUCTURE
    Publication number: 20110113618
    Abstract: A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
    Type: Application
    Filed: November 17, 2009
    Publication date: May 19, 2011
    Inventors: Alberto F. Viscarra, Ethan S. Heinrich, Melvin S. Campbell, David T. Winslow, Kevin C. Rolston, Rosalio S. Vidaurri