Abstract: A circuit assembly comprises a planar substrate 10 supporting, on a surface 11, connectors 14 and modules 12, the connectors having a common bridging member secured to the substrate and permits movement of an electrical insulating block 15 of each connector in a plane normal to the surface 11, to ensure that the manufacturing tolerances in relation to the block are larger than otherwise would be required, and to facilitate alignment of the block in a predetermined position, when the connector is mated with an associated connector 20 (shown in FIG. 2). Possibly, aligning means for example, comprising pin and hole arrangements is provided, a part of which aligning means, for example, comprising holes 40 and 41, is provided within at least the insulating block of the connector of the circuit assembly, to co-operate with a complementary part, of pins (not shown), of the aligning means provided within the associated connector.

Abstract: A circuit assembly having a plurality of planar substrates 14 with modules and/or components 13 mounted thereon, has the substrates comprising at least parts of walls of substantially enclosed hollow structures 15, for example, the substrates comprising two opposing and parallel walls of each structure, the structures are mounted spaced apart within a container 10, and the arrangement is such that cooling fluid is to flow from a supply to the circuit assembly, and is to be discharged from the circuit assembly, the cooling fluid to flow between the regions within the container surrounding the structures and the interiors of at least some of the structures, via holes 26 in the walls of the structures, so that the cooling fluid can be supplied easily and efficiently to points within the circuit assembly where generated heat is required to be removed, the construction of the circuit assembly being flexible in this manner.

Abstract: A circuit assembly has at least one component comprising a thin film module, or a discrete component, with leads extending therefrom, the assembly also including a substantially planar substrate supporting the component, and at least one connector with a block of electrical insulating material either adhering to or integral with the substrate, and with a plurality of connector pieces, secured to the block, co-operating with the leads, and comprising terminals of the circuit assembly.

Abstract: A circuit assembly comprises a planar substrate 10 supporting, on a surface 11, connectors 14 and modules 12, the connector pieces of the connectors, and the module leads, both extending at least substantially parallel to said one major substrate surface, and the modules are clamped to the substrate in a readily releasable manner by means 40, so that a module can be replaced readily, for example, when faulty, and there may be a resilient part 48 of the clamping means between each module and a rigid part 41 of the clamping means, so that the module is not damaged by the clamping action; possibly the resilient part being provided by a composite structure of the resilient part and insulating sleeves 13' for module leads; and the clamping means including at least part of the connectors, so that the required clamping action is at least partially between the substrate and the connectors.

Abstract: A circuit assembly comprises a planar substrate 10 supporting, on a surface 11, connectors 14 and modules 12, each module having leads 13 extending from two opposing module surfaces, with the leads from one surface extending exclusively in one or two planes parallel to the module-bearing substrate surface, and with the leads from the other surface extending exclusively in the other such plane, the connectors each having an electrical insulating block 15 comprising two separable parts stacked one on the other, and rigidly secured to the substrate, and with connector pieces 17 secured to the block, such that there is facilitated, possible, at least partial, protection of connections between the module leads and the connector pieces, by the connections being on, or within, or adjacent to the block, before the module and the block are supported on the substrate.