Abstract: A power measurement and protection apparatus includes a first connector, a second connector, a setting element, a power setting unit, a power measurement unit, a control unit, and a switch. The first connector is electrically connected to an electronic device. The second connector is electrically connected to a power supply. The power setting unit sets a reference power according to signals input by the setting element, and outputs the reference power to the control unit. The electronic device is powered by the power supply through the second connector, the switch, and the first connector in that order. The power measurement unit measures an actual power of the electronic device, and outputs the actual power to the control unit. The control unit turns off the switch to stop the electronic device from being powered by the power supply, when the actual power is greater than the reference power.

Abstract: A control system and method for controlling the speeds of heat-dissipating fans is applied to a plurality of voltage regulator downs (VRD), a plurality of chip devices, and a detecting chip. The VRD provides voltages for a plurality of chip devices, and outputs information as to electrical consumption of the corresponding chip device. The detecting chip controls rotation speed of the corresponding fan and of fans adjacent to that according to the consumption information.

Abstract: An integrated circuit includes a main body, a number of connection tabs molded on the main body, and a number of pins respectively connected to the connection tabs. The connection tabs and the pins are made of metal. The connection tabs are electrically connected to a logic circuit in the main body.

Abstract: A device to simulate an integrated circuit (IC) includes a main body, a simulating signal generating module, and a converting module. The simulating signal generating module is positioned on the main body and generates signals indicative of signals of the IC. The converting module is positioned on the main body and converts the signals from digital to analog form. The connecting board is assembled to the main body and sends the converted signals to a printed circuit board (PCB).

Abstract: A power supply system supplying electrical power to a storage device includes a main board, a first power supply circuit and a first electrical connector positioned on the main board, an expansion board separate from the main board, and a second electrical connector plus a first energy storage circuit positioned on the expansion board. The first power supply circuit provides a first voltage to the storage device. The second electrical connector is detachably connected to the first electrical connector. The first energy storage circuit receives the first voltage from the first power supply circuit, stores energy from the first voltage, and supplies a third voltage to the storage device if the first power supply circuit suddenly stops providing the first voltage.

Abstract: A quartz oscillator module includes a first quartz oscillator, a second quartz oscillator, a first electronic switch, and a second electronic switch. The first and second quartz oscillators provide two different clock signals. When the first electronic switch is turned on, the first quartz oscillator is activated. When the second electronic switch is turned on, the second quartz oscillator is activated.

Abstract: A quartz oscillator module includes a first quartz oscillator, a second quartz oscillator, a first electronic switch, and a second electronic switch. The first and second quartz oscillators provide two different clock signals. When the first electronic switch is turned on, the first quartz oscillator is activated. When the second electronic switch is turned on, the second quartz oscillator is activated.

Abstract: A dummy memory card includes a circuit board and a golden finger board. The circuit board includes a first conductive element and a second conductive element connected to a first electrical load. The golden finger board extends from the circuit board and is inserted into a memory slot of a motherboard. The golden finger board includes a first power pin and a first ground pin. The first conductive element is electrically connected to the first power pin. The second conductive element is electrically connected to the second power pin.

Abstract: An exemplary power-on control circuit includes power supplies and a control chip. Each power supply includes a power good pin to output a power good signal and an enable pin to receive an enable signal. When the enable pin of one power supply receives an enable signal, the one power supply will be powered on. When one power supply is powered on successfully, the power good pin of the one power supply will output a power good signal. The control chip includes input ports and output ports. Each input port corresponding to one output port. Each input port is connected to the power good pin of one power supply to receive a power good signal from the one power supply, and its corresponding output ports is connected to the enable pin of the one power supply to output an enable signal to the one power supply.

Abstract: A device to simulate an integrated circuit (IC) includes a main body, a simulating signal generating module, and a converting module. The simulating signal generating module is positioned on the main body and generates signals indicative of signals of the IC. The converting module is positioned on the main body and converts the signals from digital to analog form. The connecting board is assembled to the main body and sends the converted signals to a printed circuit board (PCB).

Abstract: A solar collection device includes a circular bottom wall; a peripheral sidewall, and a flexible solar cell panel. The peripheral sidewall is extending from a periphery of the bottom wall. The bottom wall and the sidewall cooperatively form a bucket. The bucket includes an opening. The area of the opening is two to three times the area of the bottom wall. The flexible solar cell panel is attached over an entire interior surface of the sidewall in the bucket.

Abstract: An exemplary heat-dissipating device includes a base having a first surface, and a number of fins extending from the first surface. Each fin includes a main body perpendicular to the first surface and an extending portion perpendicularly extending from an end of the main body distal from the first surface.

Abstract: A dummy memory card includes a circuit board and a golden finger board. The circuit board includes a first conductive element and a second conductive element connected to a first electrical load. The golden finger board extends from the circuit board and is inserted into a memory slot of a motherboard. The golden finger board includes a first power pin and a first ground pin. The first conductive element is electrically connected to the first power pin. The second conductive element is electrically connected to the second power pin.

Abstract: A chip includes a body, a number of pins, and conductive pieces. The body includes a top surface and a bottom surface. The pins are arranged on the bottom surface. The conductive pieces are arranged on the top surface. The number of the conductive pieces equals to the number of the pins. Each pin is electrically connected to one conductive piece.