Patents by Inventor Meng Chu Li

Meng Chu Li has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190139801
    Abstract: A wafer carrying fork includes a fork body, a plurality of wafer suction holes, a plurality of gas purging elements, a plurality of gas purging pipes, a plurality of gas suction elements, and a plurality of gas suction pipes. The fork body has a top surface, a bottom surface opposite to the top surface, and a plurality of lateral surfaces connecting the top surface and the bottom surface. The wafer suction holes are located on the top surface of the fork body. The gas purging elements are located on the lateral surfaces of the fork body. The gas purging pipes are connected to the gas purging elements. The gas suction elements are located on the bottom surface of the fork body. The gas suction pipes are connected to the gas suction elements.
    Type: Application
    Filed: January 12, 2018
    Publication date: May 9, 2019
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yan-Hong Liu, Che-Fu Chen, Meng-Chu Li
  • Patent number: 10283393
    Abstract: A wafer carrying fork includes a fork body, a plurality of wafer suction holes, a plurality of gas purging elements, a plurality of gas purging pipes, a plurality of gas suction elements, and a plurality of gas suction pipes. The fork body has a top surface, a bottom surface opposite to the top surface, and a plurality of lateral surfaces connecting the top surface and the bottom surface. The wafer suction holes are located on the top surface of the fork body. The gas purging elements are located on the lateral surfaces of the fork body. The gas purging pipes are connected to the gas purging elements. The gas suction elements are located on the bottom surface of the fork body. The gas suction pipes are connected to the gas suction elements.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: May 7, 2019
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yan-Hong Liu, Che-Fu Chen, Meng-Chu Li
  • Publication number: 20100242501
    Abstract: An energy efficient cooling system that employs liquid air in order to eliminate potentially harmful effects associated with some refrigerants with regard to both humans and the environment. The system includes an insulated container configured to contain liquid air at the appropriate low temperature so that it can remain in its liquefied state. The system further includes at least one air flow device, which may be a compressor and/or a fan. The system also includes a valve-controlled piping system for moving the cool air to an outlet, such as a duct system. Thereafter, the cool air may be distributed throughout a room, building or other area for which cooling is desired.
    Type: Application
    Filed: March 26, 2009
    Publication date: September 30, 2010
    Inventors: Laura L. Li, Guang Shun Li, Meng Chu Li