Abstract: A thermally conductive board is a laminated structure comprising a metal substrate, a thermally conductive and electrically insulating layer and a metal layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate, and the metal layer is disposed on the thermally conductive and electrically insulating layer. The thermally conductive and electrically insulating layer comprises polymer and non-spherical thermally conductive filler dispersed therein. The polymer comprises at least two straight-chain epoxy resins with different EEW. The product of a mean particle size and a BET surface area of the non-spherical thermally conductive filler is 7.5-15 ?m·m2/g. The thermally conductive and electrically insulating layer has a Tg of 40-90° C. and a thermal conductivity of 1-6 W/m·K.

Abstract: An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.

Abstract: An adhesive material comprises a polymeric component, a heat conductive filler and a curing agent. The polymeric component comprises 30%-60% by volume of the adhesive material, and comprises thermoset epoxy resin and polymeric modifier configured to improve impact resistance of the thermoset epoxy resin. The polymeric modifier comprises thermoplastic, rubber or the mixture thereof. The polymeric modifier comprises 4%-45% by volume of the polymeric component. The heat conductive filler is evenly dispersed in the polymeric component, and comprises 40%-70% by volume of the adhesive material. The curing agent is capable of curing the thermoset epoxy resin at a temperature below 140° C. The adhesive material has a heat conductivity greater than 3 W/m-K.