Abstract: A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated. A specific grinding parameter combination is selected based on each of the grinding simulation result combinations, and the wafer processing equipment is set accordingly.

Abstract: In accordance with some embodiments, a package-on-package (PoP) structure includes a first semiconductor package having a first side and a second side opposing the first side, a second semiconductor package having a first side and a second side opposing the first side, and a plurality of inter-package connector coupled between the first side of the first semiconductor package and the first side of the second semiconductor package. The PoP structure further includes a first molding material on the second side of the first semiconductor package. The second side of the second semiconductor package is substantially free of the first molding material.

Abstract: An air intake module of a water feeding apparatus is provided, which includes a body and a valve, and the body includes a water inlet channel and a water outlet channel. An air intake hole runs through the body outward from a joint between the water inlet channel and the water outlet channel, and the valve is disposed at the joint. With the change of a cross-sectional area of the joint, a phenomenon of a high flow rate and a low pressure occurs to force the valve plate open, and air is sucked in mixed with the water flow. When a back pressure of the water flow is larger than an atmospheric pressure outside, the valve plate is forced to close the air intake hole, so as to avoid leakage of the water flow and prevent the air intake hole from being clogged by impurities.

Abstract: An adjustable module spray head and adjusting method thereof comprises a module core unit having a holder, a distributing set rotating relative to the holder, two plugs, and a rotatable positioning structure between the holder and the distributing set; the module core unit is used to assembled with various spray heads with different watering levels to meet different demands by selecting an installing position of a levering pin of the rotatable positioning structure and by removing at least one stator or a rotor of the adjustable levering assembly.

Abstract: A fluid spraying device comprises a fluid oscillator used to oscillate fluid to generate spraying water and including an inlet, at least one power nozzle, an interacting chamber, and an outlet, characterized in that: the fluid oscillator including a first portion and a second portion; a connection of the first and the second portions communicates with the power nozzle to flow fluid through a predetermined traveling position, and the first portion includes the inlet and a section of the power nozzle, and the second portion includes the outlet and another section of the power nozzle, by using an interaction of the first and the second portions, a cross sectional area of the fluid at the connection of the first and the second portions is changed to adjust spraying water from the outlet.

Abstract: An air intake module of a water feeding apparatus is provided, which includes a body and a valve, and the body includes a water inlet channel and a water outlet channel. An air intake hole runs through the body outward from a joint between the water inlet channel and the water outlet channel, and the valve is disposed at the joint. With the change of a cross-sectional area of the joint, a phenomenon of a high flow rate and a low pressure occurs to force the valve plate open, and air is sucked in mixed with the water flow. When a back pressure of the water flow is larger than an atmospheric pressure outside, the valve plate is forced to close the air intake hole, so as to avoid leakage of the water flow and prevent the air intake hole from being clogged by impurities.

Abstract: An adjustable module spray head and adjusting method thereof comprises a module core unit having a holder, a distributing set rotating relative to the holder, two plugs, and a rotable positioning structure between the holder and the distributing set; the module core unit is used to assembled with various spray heads with different watering levels to meet different demands by selecting an installing position of a levering pin of the rotable positioning structure and by removing at least one stator or a rotor of the adjustable levering assembly.

Abstract: A fluid spraying device comprises a fluid oscillator used to oscillate fluid to generate spraying water and including an inlet, at least one power nozzle, an interacting chamber, and an outlet, characterized in that: the fluid oscillator including a first portion and a second portion; a connection of the first and the second portions communicates with the power nozzle to flow fluid through a predetermined traveling position, and the first portion includes the inlet and a section of the power nozzle, and the second portion includes the outlet and another section of the power nozzle, by using an interaction of the first and the second portions, a cross sectional area of the fluid at the connection of the first and the second portions is changed to adjust spraying water from the outlet.