Abstract: A method for forming a package structure is provided. The method includes forming first conductive structures and a first semiconductor die on a same side of a redistribution structure. The method includes forming an interposer substrate over the redistribution structure, wherein the first semiconductor die is between the interposer substrate and the redistribution structure, and edges of the interposer substrate extend beyond edges of the first semiconductor die. The method includes forming a second semiconductor die on the redistribution structure, wherein the first semiconductor die and the second semiconductor die are disposed on opposite sides of the redistribution structure.

Abstract: Structures and methods of forming fan-out packages are provided. The packages described herein may include a cavity substrate, one or more semiconductor devices located in a cavity of the cavity substrate, and one or more redistribution structures. Embodiments include a cavity preformed in a cavity substrate. Various devices, such as integrated circuit dies, packages, or the like, may be placed in the cavity. Redistribution structures may also be formed.

Abstract: A continuous type wastewater purifying device includes a wastewater tank defining a predetermined level of wastewater received in the wastewater tank. A purifying piping unit is mounted on a base and includes a wastewater pipe, a purified water pipe, and at least one heat conduction pipe having an inlet end and an outlet end respectively connected to and in communication with the wastewater pipe and the purified water pipe. The wastewater pipe has a first height from a mounting portion of the base in a height direction. The purified water pipe has a second height from the mounting portion in the height direction. The second height is greater than the first height. The inlet end and the outlet end of the at least one heat conduction pipe has a height difference therebetween. The outlet end of the at least one heat conduction pipe is higher than the predetermined level.