Patents by Inventor Meng Heng
Meng Heng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11779079Abstract: The present invention relates to a composition of a hot-melt adhesive film and a method for producing a shoe sole. The composition of the hot-melt adhesive film comprises a hot-melt adhesive material and an electromagnetic radiation absorbing material. The hot-melt adhesive material includes ethylene vinyl acetate and thermoplastic materials. The electromagnetic radiation absorbing material is uniformly dispersed in the hot-melt adhesive material. Energy of an electromagnetic radiation can be absorbed by the electromagnetic radiation absorbing material, thereby producing thermal energy, further increasing temperature and adhering property of the hot-melt adhesive film. Therefore, a midsole and an outsole of the shoe sole can be adhered by the hot-melt adhesive film. Further, the hot-melt adhesive film is made from recyclable materials. Therefore, the hot-melt adhesive film is fully recyclable.Type: GrantFiled: August 25, 2019Date of Patent: October 10, 2023Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: Chuh-Yung Chen, Cheng-Wei Huang, Meng-Heng Wu, Chao-Yu Lai, Yu-Ning Shu, Chen-Chien Wang
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Patent number: 11401917Abstract: The invention relates to a power plant controller for controlling wind turbine generators. More particularly, the invention relates to a method for compensating data obtained from measurements at a connection point to the grid in case of a communication failure where communication of such data is lost or becomes unreliable. The measured data are used in the power plant controller for determining setpoints for controlling the wind turbine generators' production of active and reactive power. In response to detection of a communication fault a new setpoint is determined independently of new measured grid data by reconfiguring parts of the power plant controller.Type: GrantFiled: December 20, 2019Date of Patent: August 2, 2022Assignee: VESTAS WIND SYSTEMS A/SInventors: Jorge Martinez Garcia, Rasmus Lærke, Henrik Møller, Kouroush Nayebi, Rubin Panni, Chun Meng Heng
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Patent number: 11376366Abstract: A syringe apparatus is provided for stirring and delivering single or multi-component compositions. The syringe apparatus comprises a syringe barrel, a plunger, a stirring paddle, and a connecting member. The plunger partially disposed within the syringe barrel is movable along an axial direction of the syringe barrel. The stirring paddle disposed within the syringe barrel has one end passing through the plunger and slidably disposed within the plunger. The syringe apparatus of the disclosure can stir the components and deliver the mixture safely for maintaining a good hygiene condition during the therapeutic process.Type: GrantFiled: February 24, 2017Date of Patent: July 5, 2022Inventors: Ching-Ho Hsieh, Kuang-Ying Hsueh, Tsung-Hsuen Wu, Wen-Lin Lin, Ting-Chun Yu, Jin-He Ke, Li-Lun Chen, Meng-Heng Lai
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Patent number: 11278083Abstract: The present invention relates to a midsole material composition, a method for producing the midsole material and a shoe sole. The midsole material composition comprises an elastomer, a thermoplastic polymer, a suitable crosslinker and a catalyst, such that the midsole material of the present invention can be fabricated by subjecting the midsole material composition to a phase-inversion crosslinking reaction and a foaming process. The aforementioned thermoplastic polymer, which is a recyclable material, is inverted into a continuous phase after the phase-inversion crosslinking reaction, thereby enhancing a recycling property of the midsole material and improving a reusability of the shoe sole.Type: GrantFiled: November 26, 2018Date of Patent: March 22, 2022Assignee: NATIONAL CHENG KUNG UNIVERSITYInventors: Chuh-Yung Chen, Cheng-Chien Wang, Cheng-Wei Huang, Meng-Heng Wu, Chao-Yu Lai, Yu-Ning Shu
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Publication number: 20210195991Abstract: The present invention relates to a shoe sole material composition, a shoe sole material and a method for producing the same. The shoe sole material composition comprises a blending mixture and a crosslinking agent. The blending mixture includes an elastomer and a thermoplastic material. An amount of the elastomer is larger than an amount of the thermoplastic material. The crosslinking agent is subjected the elastomer to a crosslinking reaction during a heating and blending process, such that the elastomer can invert into a discontinuous phase dispersed in the thermoplastic material, thereby producing the shoe sole of the present invention. Therefore, the shoe sole material has an excellent recycling property, further improving reusability of the shoe sole.Type: ApplicationFiled: July 2, 2020Publication date: July 1, 2021Inventors: Chuh-Yung CHEN, Cheng-Wei HUANG, Meng-Heng WU, Chao-Yu LAI
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Publication number: 20200204960Abstract: A control method for an electronic device is provided. Firstly, a host device establishes a group and sets an effect with respective to the group. Then, the host device determines that whether a client device joins in the group or not. When the client device joins in the group, the host device transmits a synchronization signal at a predetermined time interval to the client device to synchronize timing of the effect of the host device and the client device.Type: ApplicationFiled: December 24, 2019Publication date: June 25, 2020Inventors: Po-Han LIN, Shang-Yu HUNG, Meng-Heng HO
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Publication number: 20200132046Abstract: The invention relates to a power plant controller for controlling wind turbine generators. More particularly, the invention relates to a method for compensating data obtained from measurements at a connection point to the grid in case of a communication failure where communication of such data is lost or becomes unreliable. The measured data are used in the power plant controller for determining setpoints for controlling the wind turbine generators' production of active and reactive power. In response to detection of a communication fault a new setpoint is determined independently of new measured grid data by reconfiguring parts of the power plant controller.Type: ApplicationFiled: December 20, 2019Publication date: April 30, 2020Inventors: Jorge Martinez GARCIA, Rasmus LÆRKE, Henrik MØLLER, Kouroush NAYEBI, Rubin PANNI, Chun Meng HENG
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Publication number: 20200060387Abstract: The present invention relates to a composition of a hot-melt adhesive film and a method for producing a shoe sole. The composition of the hot-melt adhesive film comprises a hot-melt adhesive material and an electromagnetic radiation absorbing material. The hot-melt adhesive material includes ethylene vinyl acetate and thermoplastic materials. The electromagnetic radiation absorbing material is uniformly dispersed in the hot-melt adhesive material. Energy of an electromagnetic radiation can be absorbed by the electromagnetic radiation absorbing material, thereby producing thermal energy, further increasing temperature and adhering property of the hot-melt adhesive film. Therefore, a midsole and an outsole of the shoe sole can be adhered by the hot-melt adhesive film. Further, the hot-melt adhesive film is made from recyclable materials. Therefore, the hot-melt adhesive film is fully recyclable.Type: ApplicationFiled: August 25, 2019Publication date: February 27, 2020Inventors: Chuh-Yung CHEN, Cheng-Wei HUANG, Meng-Heng WU, Chao-Yu LAI, Yu-Ning SHU, Chen-Chien WANG
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Patent number: 10539117Abstract: The invention relates to a power plant controller for controlling wind turbine generators. More particularly, the invention relates to a method for compensating data obtained from measurements at a connection point to the grid in case of a communication failure where communication of such data is lost or becomes unreliable. The measured data are used in the power plant controller for determining setpoints for controlling the wind turbine generators' production of active and reactive power. In response to detection of a communication fault a new setpoint is determined independently of new measured grid data by reconfiguring parts of the power plant controller.Type: GrantFiled: November 7, 2014Date of Patent: January 21, 2020Assignee: VESTAS WIND SYSTEMS A/SInventors: Jorge Martinez Garcia, Rasmus Lærke, Henrik Møller, Kouroush Nayebi, Rubin Panni, Chun Meng Heng
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Publication number: 20190322091Abstract: A waterborne polyurethane complex and composition comprise a waterborne polyurethane layer being attached to a functional adhesive layer. The waterborne polyurethane layer contains a catalyst with content less than 0.001 wt %, and the catalyst is organic zinc or organic bismuth. The waterborne polyurethane complex is biocompatible and non-irritable, and is adapted for cell therapy or biomedical application.Type: ApplicationFiled: April 15, 2019Publication date: October 24, 2019Inventors: Chi-Hau Fang, Ting-Chun Yu, Meng-Heng Lai, Kuang-Ying Hsueh
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Publication number: 20190246739Abstract: The present invention relates to a midsole material composition, a method for producing the midsole material and a shoe sole. The midsole material composition comprises an elastomer, a thermoplastic polymer, a suitable crosslinker and a catalyst, such that the midsole material of the present invention can be fabricated by subjecting the midsole material composition to a phase-inversion crosslinking reaction and a foaming process. The aforementioned thermoplastic polymer, which is a recyclable material, is inverted into a continuous phase after the phase-inversion crosslinking reaction, thereby enhancing a recycling property of the midsole material and improving a reusability of the shoe sole.Type: ApplicationFiled: November 26, 2018Publication date: August 15, 2019Inventors: Chuh-Yung CHEN, Cheng-Chien WANG, Cheng-Wei HUANG, Meng-Heng WU, Chao-Yu LAI, Yu-Ning SHU
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Patent number: 10297556Abstract: A semiconductor device has a substrate with a stiffening layer disposed over the substrate. The substrate has a circular shape or rectangular shape. A plurality of semiconductor die is disposed over a portion of the substrate while leaving an open area of the substrate devoid of the semiconductor die. The open area of the substrate devoid of the semiconductor die includes a central area or interstitial locations among the semiconductor die. The semiconductor die are disposed around a perimeter of the substrate. An encapsulant is deposited over the semiconductor die and substrate. The substrate is removed and an interconnect structure is formed over the semiconductor die. By leaving the predetermined areas of the substrate devoid of semiconductor die, the warping effect of any mismatch between the CTE of the semiconductor die and the CTE of the encapsulant on the reconstituted wafer after removal of the substrate is reduced.Type: GrantFiled: January 25, 2017Date of Patent: May 21, 2019Assignee: STATS ChipPAC Pte. Ltd.Inventors: Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Seng Guan Chow, Yaojian Lin
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Publication number: 20190054243Abstract: A syringe apparatus is provided for stirring and delivering single or multi-component compositions. The syringe apparatus comprises a syringe barrel, a plunger, a stirring paddle, and a connecting member. The plunger partially disposed within the syringe barrel is movable along an axial direction of the syringe barrel. The stirring paddle disposed within the syringe barrel has one end passing through the plunger and slidably disposed within the plunger. The syringe apparatus of the disclosure can stir the components and deliver the mixture safely for maintaining a good hygiene condition during the therapeutic process.Type: ApplicationFiled: February 24, 2017Publication date: February 21, 2019Inventors: Ching-Ho Hsieh, Kuang-Ying Hsueh, Tsung-Hsuen Wu, Wen-Lin Lin, Ting-Chun Yu, Jin-He Ke, Li-Lun Chen, Meng-Heng Lai
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Patent number: 10163747Abstract: A semiconductor device has a substrate with a plurality of active semiconductor die disposed over a first portion of the substrate and a plurality of non-functional semiconductor die disposed over a second portion of the substrate while leaving a predetermined area of the substrate devoid of the active semiconductor die and non-functional semiconductor die. The predetermined area of the substrate devoid of the active semiconductor die and non-functional semiconductor die includes a central area, checkerboard pattern, linear, or diagonal area of the substrate. The substrate can be a circular shape or rectangular shape. An encapsulant is deposited over the active semiconductor die, non-functional semiconductor die, and substrate. An interconnect structure is formed over the semiconductor die. The absence of active semiconductor die and non-functional semiconductor die from the predetermined areas of the substrate reduces bending stress in that area of the substrate.Type: GrantFiled: March 17, 2017Date of Patent: December 25, 2018Assignee: STATS ChipPAC Pte. Ltd.Inventors: Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Seng Guan Chow, Yaojian Lin
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Patent number: 10132009Abstract: The present invention provides a fabricating method for natural cellulose fiber blended with nano silver. The fabricating method comprises following steps: Firstly, prepare nano silver colloidal sol by reduction titration for mixture of polyvinyl alcohol (PVA), silver nitrate (AgNO3) and sodium borohydride (NaBH4). Secondly, prepare mixing cellulose serum by blending agitation for mixture of wood pulp, N-methylmorpholine N-oxide (NMMO) and stabilizer. Thirdly, produce spinning dope by blending and dehydrating the nano silver colloidal sol and mixing cellulose serum. Fourthly, produce fibrous tow by Dry-Jet Wet Spinning method in association with coagulation, regeneration in coagulation bath, and water rinse. Finally, obtain final product of natural cellulose fiber blended with nano silver by post treatments of dry, oil and coil in proper order.Type: GrantFiled: November 9, 2015Date of Patent: November 20, 2018Assignee: ACELON CHEMICALS AND FIBER CORPORATIONInventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang, Shao-Hua Chou, Meng-Heng Hsieh
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Patent number: 10132007Abstract: The present invention provides a fabricating method for meltblown nonwoven from natural cellulose fiber blended with nano silver, which comprises following steps. Firstly, prepare nano silver colloidal sol by reduction titration for mixture of polyvinyl alcohol (PVA), silver nitrate (AgNO3) and sodium borohydride (NaBH4). Secondly, prepare mixing cellulose serum by blending agitation for mixture of wood pulp, N-methylmorpholine N-oxide (NMMO) and stabilizer. Thirdly, prepare blending mucilage from mixing cellulose serum via blending process. Fourthly, produce spinning dope by blending and dehydrating the nano silver colloidal sol and mixing cellulose serum. Fifthly, produce molten filament tow by meltblown spinning method in association with coagulation, regeneration in coagulation bath, and water rinse.Type: GrantFiled: November 10, 2015Date of Patent: November 20, 2018Assignee: ACELON CHEMICALS AND FIBER CORPORATIONInventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang, Shao-Hua Chou, Meng-Heng Hsieh
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Patent number: 10094049Abstract: The present invention provides a fabricating method for spunbond nonwoven from natural cellulose fiber blended with nano silver, which comprises following steps. Firstly, prepare nano silver colloidal sol by reduction titration for mixture of polyvinyl alcohol (PVA), silver nitrate (AgNO3) and sodium borohydride (NaBH4). Secondly, prepare mixing cellulose serum by blending agitation for mixture of wood pulp, N-methylmorpholine N-oxide (NMMO) and stabilizer. Thirdly, prepare blending mucilage from mixing cellulose serum via blending process. Fourthly, produce spinning dope by blending and dehydrating the nano silver colloidal sol and mixing cellulose serum. Fifthly, produce molten filament tow by spunbond spinning method in association with coagulation, regeneration, water rinse and high-speed stretching process.Type: GrantFiled: November 12, 2015Date of Patent: October 9, 2018Assignee: ACELON CHEMICALS AND FIBER CORPORATIONInventors: Wen-Tung Chou, Ming-Yi Lai, Kun-Shan Huang, Shao-Hua Chou, Meng-Heng Hsieh
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Patent number: 9899078Abstract: A high-reliability resistive random access memory (RRAM). A memory cell of a memory cell array is controlled via a word line, a bit line and a source line. The control unit of the RRAM has a word line decoder, a bit line decoder, and a source line decoder and switch circuit. The word line decoder, the bit line decoder and the source line decoder respectively control the voltage applied to the word line, the voltage applied to the bit line, and the voltage applied to the source line. The switch circuit is switched between a first state and a second state to operate the bit line decoder to apply a voltage to the bit line to read the memory cell and to operate the source line decoder to apply a voltage to the source line to read the memory cell alternately.Type: GrantFiled: November 24, 2015Date of Patent: February 20, 2018Assignee: WINBOND ELECTRONICS CORP.Inventors: Meng-Heng Lin, Bo-Lun Wu, Chien-Min Wu
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Publication number: 20170292498Abstract: The invention relates to a power plant controller for controlling wind turbine generators. More particularly, the invention relates to a method for compensating data obtained from measurements at a connection point to the grid in case of a communication failure where communication of such data is lost or becomes unreliable. The measured data are used in the power plant controller for determining setpoints for controlling the wind turbine generators' production of active and reactive power. In response to detection of a communication fault a new setpoint is determined independently of new measured grid data by reconfiguring parts of the power plant controller.Type: ApplicationFiled: November 7, 2014Publication date: October 12, 2017Inventors: Jorge Martinez GARCIA, Rasmus LÆRKE, Henrik MØLLER, Kouroush NAYEBI, Rubin PANNI, Chun Meng HENG
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Publication number: 20170194228Abstract: A semiconductor device has a substrate with a plurality of active semiconductor die disposed over a first portion of the substrate and a plurality of non-functional semiconductor die disposed over a second portion of the substrate while leaving a predetermined area of the substrate devoid of the active semiconductor die and non-functional semiconductor die. The predetermined area of the substrate devoid of the active semiconductor die and non-functional semiconductor die includes a central area, checkerboard pattern, linear, or diagonal area of the substrate. The substrate can be a circular shape or rectangular shape. An encapsulant is deposited over the active semiconductor die, non-functional semiconductor die, and substrate. An interconnect structure is formed over the semiconductor die. The absence of active semiconductor die and non-functional semiconductor die from the predetermined areas of the substrate reduces bending stress in that area of the substrate.Type: ApplicationFiled: March 17, 2017Publication date: July 6, 2017Applicant: STATS ChipPAC Pte. Ltd.Inventors: Kian Meng Heng, Hin Hwa Goh, Jose Alvin Caparas, Kang Chen, Seng Guan Chow, Yaojian Lin