Abstract: Pixel structural designs on a display panel are disclosed. Each pixel on the display panel includes a plurality of sub-pixels. The sub-pixels are arranged sequentially along a vertical direction and used for displaying different colors in a circle. The display panel in the disclosure can be switched between a two-dimensional mode and a three-dimensional mode. In the three-dimensional mode, parts of the sub-pixels are disabled for forming a shielding area. Other adjacent sub-pixels form a pixel displaying unit.

Abstract: A pixel includes sub-pixels each of which includes a first display region, a second display region, a third display region, a first capacitor, and a second capacitor. The first capacitor connects the second display region with the third display region. The second capacitor connects the first display region to the third display region via a switch. When the switch is activated, the potential of the third display region is decreased via the second capacitor, the potential of the first display region is increased via the second capacitor, and the potential of the second display region is decreased via the first capacitor. A display panel and driving method in a display panel are also disclosed herein.

Abstract: An array substrate and a pixel unit of a display panel include a plurality of subpixels arranged in a pixel array (N row*M column). Only one data line is disposed in a portion of two adjacent columns of subpixels in the pixel array, and two data lines are disposed in another portion of two adjacent columns of subpixels in the pixel array.

Abstract: An array substrate and a pixel unit of a display panel include a plurality of subpixels arranged in a pixel array (N row*M column). Only one data line is disposed in a portion of two adjacent columns of subpixels in the pixel array, and two data lines are disposed in another portion of two adjacent columns of subpixels in the pixel array.

Abstract: A pixel circuit is provided. The pixel circuit is electrically coupled to a data line, a first scan line, and a second scan line. The pixel circuit includes a first pixel unit, a second pixel unit, and a third pixel unit. The first pixel unit is electrically coupled to the data line and the second scan line, to determine a first displayed gray scale of the first pixel unit. The second pixel unit is electrically coupled to the data line and the first scan line, to determine a second displayed gray scale of the second pixel unit. The third pixel unit is electrically coupled to the data line, the first scan line, and the second scan line, to determine a third displayed gray scale of the third pixel unit.

Abstract: A pixel includes sub-pixels each of which includes a first display region, a second display region, a third display region, a first capacitor, and a second capacitor. The first capacitor connects the second display region with the third display region. The second capacitor connects the first display region to the third display region via a switch. When the switch is activated, the potential of the third display region is decreased via the second capacitor, the potential of the first display region is increased via the second capacitor, and the potential of the second display region is decreased via the first capacitor. A display panel and driving method in a display panel are also disclosed herein.

Abstract: A driving method of a display panel is described. A display panel including a pixel array is provided. The pixel array includes N scan lines, M data lines, and a plurality of first pixel units and a plurality of second pixel units electrically connected to the scan lines and the data lines. When an image is displayed with a wide-viewing angle mode, a first scanning procedure is performed to sequentially scan the first scan line of the scan lines to the Nth scan line of the scan lines in order. When the image is displayed with a narrow-viewing angle mode, the second scanning procedure is performed to sequentially scan the Nth scan line of the scan lines to the first scan line of the scan lines in order.

Abstract: A liquid crystal display includes a date line for transmitting a data signal, a first gate line for transmitting a first gate signal, a second gate line for transmitting a second gate signal, a first sub-pixel unit for being written to by a first sub-pixel voltage according to the data signal and the first gate signal, a second sub-pixel unit for being written to by a second sub-pixel voltage according to the data signal and the first gate signal, a third sub-pixel unit for being written to by a third sub-pixel voltage according to the data signal and the first gate signal, and a charge sharing control unit. The charge sharing control unit is utilized for controlling a charge sharing operation over the first and third sub-pixel units according to the second gate signal, thereby adjusting the first and third sub-pixel voltages.

Abstract: An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages are batch processed on a substrate panel. The panel includes a plurality of through-holes drilled through the panel and subsequently filled with metal such as copper or gold. These filled through-holes lie along the cut line between adjacent packages so that, upon singulation, the filled through holes are cut and a portion of the filled through-holes are exposed at the side edges of the singulated packages. These exposed portions of the filled through-holes form vertical surface mount technology (SMT) pads. After the semiconductor packages are singulated and the SMT pads are defined in the side edges, SMT is used to solder the SMT pads of a first semiconductor package to the respective SMT pads of a second semiconductor package to structurally and electrically couple the two packages together side-by-side.

Abstract: An electronic component is disclosed including a plurality of semiconductor packages soldered together in a side-by-side configuration. The packages are batch processed on a substrate panel. The panel includes a plurality of through-holes drilled through the panel and subsequently filled with metal such as copper or gold. These filled through-holes lie along the cut line between adjacent packages so that, upon singulation, the filled through holes are cut and a portion of the filled through-holes are exposed at the side edges of the singulated packages. These exposed portions of the filled through-holes form vertical surface mount technology (SMT) pads. After the semiconductor packages are singulated and the SMT pads are defined in the side edges, SMT is used to solder the SMT pads of a first semiconductor package to the respective SMT pads of a second semiconductor package to structurally and electrically couple the two packages together side-by-side.

Abstract: A semiconductor die substrate is disclosed for preventing delamination of the die and/or die cracking due to air bubbles trapped beneath the die, and a semiconductor package incorporating the substrate. A solder mask may be laminated on a surface of the substrate which is patterned with one or more passageways, or canals, allowing air bubbles to be expelled from beneath the semiconductor die during the semiconductor package fabrication. The canals may have a variety of shapes, including for example a wavy, undulating shape.