Abstract: A semiconductor package comprises a lead frame, a die pad, bond pads, and leads. A die may be arranged on the die pad, the die comprising an integrated circuit. In an example, the die and at least a portion of the lead frame are encapsulated with a molding compound (MC). A first thickness of the MC over a first portion of the die is less than a second thickness over a second portion of the die to form a cavity in the MC and the MC directly contacts the first portion and the second portion of the die.

Abstract: A system for wireless data communication comprises first and second wireless networks. The first wireless network comprises nodes that receive and transmit wireless signals that exhibit a first frequency, wherein nodes of the first wireless network include first, second, and third repeater nodes. The second wireless network comprises nodes that receive and transmit wireless signals that exhibit a second frequency that is lower than the first frequency. The second wireless network is configured to serve as an overlay out-of-band control plane for the first wireless network. The third repeater node uses a digital IIR filter to recover and relay a data signal encoded by first and second wireless signals that are received by the third repeater node from the first and second repeater nodes. The first wireless network can be a current generation network (e.g., 5G) while the second wireless network can be a previous generation network (e.g., 4G).

Abstract: An antenna structure includes a substrate, a plurality of reflective plates, a grounding plate, a radiating member, a signal feeding via and a plurality of conductive vias. The substrate has opposite first and second surfaces and comprises liquid crystal polymer. The reflective plates are arrayed on the first surface of the substrate. The grounding plate is disposed on the second surface of the substrate and overlapped with the reflective plates in a normal direction of the substrate. The grounding plate further includes an opening. The radiating member is disposed on the first surface of the substrate and physically separated from the reflective plates. The signal feeding via is coupled with the radiating member and penetrates through the substrate to be exposed in the opening of the grounding plate. The conductive vias penetrate through the substrate and respectively connect the reflective plates and the grounding plate.

Abstract: Systems and methods are described for merging customer profiles, such as may be implemented by a computer-implemented contact center service. In some aspects, a subset of profiles may be determined that satisfy merging criteria, where individual profiles include a plurality of data fields. At least one value in a first data field that conflicts between at least two profiles may be identified. Next a merged value may be selected for the first data field based on data deduplication criteria, where the data deduplication criteria includes at least one indicator of accuracy of values of the plurality of data fields. As a result of a determination that at least the subset of profiles of the group of profiles meet the merging criteria, at least the subset of profiles may be combined into a combined profile using the merged value.

Abstract: A multi-band filter includes a circuit board, a first resonator, a second resonator, and a coupling element configured to couple the first resonator with the second resonator. The coupling element includes a first coupling capacitor, a second coupling capacitor, a first short-circuited stub and a second short-circuited stub. The first coupling capacitor has two terminals electrically connected to the first portion of the first resonator and the first portion of the second resonator respectively. The second coupling capacitor has two terminals electrically connected to the second portion of the first resonator and the second portion of the second resonator respectively. The first short-circuited stub is electrically connected to the first coupling capacitor and a ground plane. The second short-circuited stub is electrically connected to the second coupling capacitor and a ground plane.

Abstract: A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: A structure and method for the formation of a reflector structure having three-dimensional surface curvature is disclosed. Beam narrowing upon reflection from the three-dimensionally curved surface in embodiments can provide improved coupling efficiency in addition to the directional change provided by the reflector.

Abstract: A structure and method for the formation of a reflector structure having three-dimensional surface curvature is disclosed. Beam narrowing upon reflection from the three-dimensionally curved surface in embodiments can provide improved coupling efficiency in addition to the directional change provided by the reflector.

Abstract: An automatic connection and disconnection system and an automatic connection and disconnection method are provided. The method includes the following steps. A connection signal sent by an electronic device is received by a determining device. The connection signal includes intensity information obtained from measuring at least three identification signals by the electronic device. The at least three identification signals are from at least three peripheral devices, and the at least three peripheral devices are placed to form a geographical region. Also, a first position of the electronic device is located by the determining device according to the connection signal. Next, whether the first position is within the geographical region is determined by the determining device. When the first position is within the geographical region, the electronic device is communicatively connected to a connecting device. The connecting device is located within or outside the geographical region.

Abstract: An optical imaging lens includes, in order from an object side to an image side, an aperture, a first lens, a second lens, a third lens, a fourth lens and a fifth lens, wherein the first lens has positive refractive power and includes an object-side surface being convex; the second lens has negative refractive power and includes an object-side surface being concave; the third lens has positive refractive power and includes an object-side surface being convex and an image-side surface being convex; the fourth lens has positive refractive power and includes an object-side surface being concave and an image-side surface being convex; the fifth lens has negative refractive power and includes an object-side surface being concave. When specific conditions are satisfied, the optical imaging lens can have a compact size, high thermal endurance and good imaging qualities.

Abstract: A semiconductor package comprises a lead frame, a die pad, bond pads, and leads. A die may be arranged on the die pad, the die comprising an integrated circuit. In an example, the die and at least a portion of the lead frame are encapsulated with a molding compound (MC). A first thickness of the MC over a first portion of the die is less than a second thickness over a second portion of the die to form a cavity in the MC and the MC directly contacts the first portion and the second portion of the die.

Abstract: According to a first aspect of the present invention there is provided a semiconductor device comprising: a die having a central active region, a top surface, a bottom surface, and sidewalls having a plurality of perforations therein, each perforation extending from a top end at the top surface to a bottom end at the bottom surface; a plurality of die pads on the top surface and extending from the central active region to respective top ends; a patterned back-side-metallization layer on the bottom surface, comprising a plurality of electrically isolated regions extending to respective bottom ends; metal coating partially filling the perforations and providing electrical connection between respective ones of the plurality of die pads and respective ones of the plurality of electrically isolated regions; and a passivation layer covering the top surface and the die pads.

Abstract: There is disclosed a packaged semiconductor device comprising: a leadframe having a first thickness; the leadframe comprising a die pad; a semiconductor die thereabove; and epoxy therebetween and arranged to bond the semiconductor die to the die pad; wherein in at least one region under the semiconductor die, the die pad has a second thickness less than the first thickness; wherein the die pad has at least one through-hole in the at least one region; and wherein the epoxy fills the at least one through-hole and extends thereunder and laterally beyond the through-hole. Corresponding leadframes, and an associated method of manufacture are also disclosed.

Abstract: An optical imaging lens including an optical lens assembly with an optical axis, a lens barrel and a conductive element is disclosed. The optical lens assembly includes a plurality of lenses. The lens barrel includes an inner wall surface and a heating film, wherein the inner wall surface surrounds the optical axis and is made of electrical insulating material, and the heating film is formed on the inner wall surface. The optical lens assembly is disposed in the lens barrel in order from an object side to an image side. An edge of at least one lens of the optical lens assembly contacts the heating film. The conductive element is extended along the inner wall surface of the lens barrel, and is electrically connected to the heating film. One terminal of the conductive element is connected to an external power supply.

Abstract: A magnetically reconfigurable robot joint motor includes a coil stator, a permanent magnet rotor and a magnetic reconfiguration unit. The magnetic reconfiguration unit is arranged around an outer periphery of the permanent magnet rotor, and a coil connected to a control circuit is wound on an outer layer of the magnetic reconfiguration unit. When it is necessary to execute low rotation speed or zero rotation speed operating conditions, the control circuit inputs current pulses of different strengths, so that the magnetic reconfiguration unit obtains permanent magnetization of corresponding degree, and generates a magnetic field which acts together with a magnetic field of the permanent magnet rotor, so as to maintain a torque required for output.

Abstract: An automatic connection and disconnection system and an automatic connection and disconnection method are provided. The method includes the following steps. A connection signal sent by an electronic device is received by a determining device. The connection signal includes intensity information obtained from measuring at least three identification signals by the electronic device. The at least three identification signals are from at least three peripheral devices, and the at least three peripheral devices are placed to form a geographical region. Also, a first position of the electronic device is located by the determining device according to the connection signal. Next, whether the first position is within the geographical region is determined by the determining device. When the first position is within the geographical region, the electronic device is communicatively connected to a connecting device. The connecting device is located within or outside the geographical region.

Abstract: A carrier tracking system is applied to a predetermined space. Carriers with optical recognizable marks are operating in the predetermined space, in which each of the optical recognizable mark is associated with information of materials carried by the carrier. The carrier tracking system includes at least one optical capturing device and a computing unit. The at least one optical capturing device is configured to capture images of the predetermined space. The computing unit is configured to determine an optical recognized coordinate of the optical recognizable mark in the images. The computing unit converts the optical recognized coordinate to a real-space coordinate in the predetermined space. In order to locate the carrier, the computing unit further associates the real-space coordinate with the information of materials carried by the carrier.

Abstract: A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: A structure and method for the wafer level testing of interposer-based photonic integrated circuits is described that includes the formation of an upturned mirror structure and the method of utilizing the interposer-based mirror structure for electrical and optical testing of optoelectrical circuits that include emitting components such as lasers, detecting components such as photodetectors, and both emitting and detecting components. Electrical activation of the optoelectrical emitting or sending devices and the subsequent detection and measurement of the optical signals in detecting or receiving devices provides information on the operability or functionality of the PIC on the die at the wafer level, prior to die separation or singulation, using the electrical and optical components of the PIC circuit.

Abstract: A magnetically reconfigurable robot joint motor includes a coil stator, a permanent magnet rotor and a magnetic reconfiguration unit. The magnetic reconfiguration unit is arranged around an outer periphery of the permanent magnet rotor, and a coil connected to a control circuit is wound on an outer layer of the magnetic reconfiguration unit. When it is necessary to execute low rotation speed or zero rotation speed operating conditions, the control circuit inputs current pulses of different strengths, so that the magnetic reconfiguration unit obtains permanent magnetization of corresponding degree, and generates a magnetic field which acts together with a magnetic field of the permanent magnet rotor, so as to maintain a torque required for output.