Abstract: A wafer grinding parameter optimization method and an electronic device are provided. The method includes the following. A natural frequency of a grinding wheel spindle of wafer processing equipment is obtained, and a grinding stability lobe diagram is generated accordingly. A grinding speed is selected based on a speed range of the grinding wheel spindle. Multiple grinding parameter combinations are determined based on the grinding speed. Multiple grinding simulation result combinations corresponding to the grinding parameter combinations are generated. A specific grinding parameter combination is selected based on each of the grinding simulation result combinations, and the wafer processing equipment is set accordingly.

Abstract: A multi-diameter clamp for clamping on tires of different sizes is provided. The multi-diameter clamp comprises at least one clamping unit, at least one actuator, and at least one sensing unit. The at least one clamping unit further includes at least one movable member and a fixed member. Wherein the at least one movable member moves within a tire housing space having a starting position and a clamping position. The tire housing space locates between the movable member and the fixed member for clamping on a tire. The at least one actuator connects to the at least one movable member, and enables the at least one moveable member to move between the starting position and the clamping position. The at least a sensing unit obtains a diameter size of the tire, and based on the diameter size, actuates the at least one actuator corresponding to the diameter size.

Abstract: A multi-diameter clamp for clamping on tires of different sizes is provided. The multi-diameter clamp comprises at least one clamping unit, at least one actuator, and at least one sensing unit. The at least one clamping unit further includes at least one movable member and a fixed member. Wherein the at least one movable member moves within a tire housing space having a starting position and a clamping position. The tire housing space locates between the movable member and the fixed member for clamping on a tire. The at least one actuator connects to the at least one movable member, and enables the at least one moveable member to move between the starting position and the clamping position. The at least a sensing unit obtains a diameter size of the tire, and based on the diameter size, actuates the at least one actuator corresponding to the diameter size.