Patents by Inventor Meng-Ying Chuang

Meng-Ying Chuang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Adhesive structure with hybrid adhesive layer
    Patent number: 9333725
    Abstract: An adhesive structure is disclosed. The adhesive structure includes a first layer, a second layer, and a hybrid adhesive layer for adhering the first layer to the second layer. The hybrid adhesive layer includes two or more adhesive units made of different adhesive materials, and the two or more adhesive units are arranged in a planar pattern.
    Type: Grant
    Filed: June 26, 2013
    Date of Patent: May 10, 2016
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Meng-Ying Chuang, Kuo-Feng Chen, Chih-Chia Chang, Chen-Pang Kung
  • PANEL PACKAGE STRUCTURE
    Publication number: 20150309628
    Abstract: A package structure includes a first panel having a first surface and a second surface opposite to the first surface, a second panel having a third surface and a fourth surface opposite to the third surface, a first adhesive layer disposed between the first surface of the first panel and the third surface of the second panel, and a frame disposed on the side of the first panel and the first adhesive layer and disposed on the second surface of the first panel and the third surface of the second panel. The difference of the adhesive strength between the frame and the first adhesive layer is equal to or larger than 0.5N/25 mm. The width of the first panel is larger than the width of the frame, and the ratio of the width of the first panel to the width of the frame is between 15 and 83.
    Type: Application
    Filed: October 21, 2014
    Publication date: October 29, 2015
    Inventors: Kuo-Feng Chen, Shu-Hsing Lee, Meng-Ying Chuang, Chih-Chia Chang