Abstract: A method for manufacturing a semiconductor structure includes: forming a semiconductor device on a main region of the device substrate, the device substrate having a peripheral region surrounding the main region; forming a first filling layer on the peripheral region of the device substrate; forming a second filling layer over the first filling layer and the semiconductor device after forming the first filling layer, the second filling layer having a polishing rate different from that of the first filling layer; performing a planarization process over the second filling layer to remove a portion of the second filling layer so that a remaining portion of the second filling layer has a planarized surface opposite to the device substrate; and bonding the device substrate to a carrier substrate through the first filling layer and the remaining portion of the second filling layer.

Abstract: The present disclosure includes a voltage provision circuit. In one aspect of the present disclosure, a voltage provision circuit is disclosed. The voltage provision circuit includes a first NMOS transistor gated with a first control signal and sourced with a ground voltage. The voltage provision circuit includes a second NMOS transistor gated with a second control signal complementary to the first control signal and sourced with the ground voltage. The voltage provision circuit includes a first PMOS transistor sourced with a first supply voltage. The voltage provision circuit includes a second PMOS transistor sourced with the first supply voltage. The voltage provision circuit includes a voltage modulation circuit, coupled between the first to second PMOS transistors and the first to second NMOS transistors, that is configured to provide a first intermediate signal based on the first and second control signals.

Abstract: A device includes a fin extending from a semiconductor substrate; a gate stack over the fin; a first spacer on a sidewall of the gate stack; a source/drain region in the fin adjacent the first spacer; an inter-layer dielectric layer (ILD) extending over the gate stack, the first spacer, and the source/drain region, the ILD having a first portion and a second portion, wherein the second portion of the ILD is closer to the gate stack than the first portion of the ILD; a contact plug extending through the ILD and contacting the source/drain region; a second spacer on a sidewall of the contact plug; and an air gap between the first spacer and the second spacer, wherein the first portion of the ILD extends across the air gap and physically contacts the second spacer, wherein the first portion of the ILD seals the air gap.

Abstract: A semiconductor device and a method of forming the same are provided. The semiconductor device includes a substrate, a gate structure, a dielectric structure and a contact structure. The substrate has source/drain (S/D) regions. The gate structure is on the substrate and between the S/D regions. The dielectric structure covers the gate structure. The contact structure penetrates through the dielectric structure to connect to the S/D region. A lower portion of a sidewall of the contact structure is spaced apart from the dielectric structure by an air gap therebetween, while an upper portion of the sidewall of the contact structure is in contact with the dielectric structure.

Abstract: A fixing structure used to connect a display panel to a housing of an electronic device during manufacture of the electronic device includes a fixing member, an auxiliary member spaced apart from the fixing member, and supporting posts disposed between the fixing member and the auxiliary member. The fixing member is to be bonded to the display panel. A projection of an outer edge of the auxiliary member on a plane of the fixing member is outside of an outer edge of the fixing member. The supporting posts and the auxiliary member are removed after the display panel is bonded to the fixing member. A method for assembling the display panel with the fixing structure is also disclosed.

Abstract: A multi-fuse memory cell is disclosed. The circuit includes: a first fuse element electrically coupled to a first transistor, a gate of the first transistor is electrically coupled to a first selection signal; a second fuse element electrically coupled to a second transistor, a gate of the second transistor is electrically coupled to a second selection signal, both the first transistor and the second transistor are grounded; and a programming transistor electrically coupled to the first fuse element and the second fuse element, wherein a gate of the programming transistor is electrically coupled to a programming signal.

Abstract: A hinge assembly includes two hinge arms, a fixing structure, and a plurality of balls. Each of the two hinge arms includes a gear portion. A shaft hole and at least one groove are defined on the gear portion, and the shaft hole connects to the at least one groove. The fixing structure includes two central shafts, each of the two central shafts passes through the shaft hole respectively. Each ball is accommodated in the at least one groove. The balls are in interference fit with the two central shafts. The balls and the two central shafts generate a damping force while they rotate relative to each other or tend to rotate relative to each other to maintain the position of the two hinge arms. The hinge assembly has a long service life and sufficient space. A terminal device is provided according to the present disclosure.

Abstract: An air purification equipment and an air purification method are provided, including a housing, a purification device, a guiding assembly, and an air driving device. The housing defines an air inlet and an air outlet, the air inlet imports air into the housing, the air outlet exports air out of the housing. The purification device purifies the air in the housing. The guiding assembly guides the air from the air inlet to the purification device. The air driving device drives the air from the air inlet to the purification device, and drives the air to the air outlet. The guiding assembly forms a first channel and a second channel, the first channel is corresponding to the air inlet, the first channel guides the air to flow into the second channel, at least a part of the purification device is positioned in the second channel.

Abstract: A fixing device for accurately fixing an optical assembly to a rear housing of an electronic device fixes the optical assembly in a predetermined position and includes a cover plate. The cover plate defines a hole and a limiting portion. The hole corresponds to a photosensitive portion of the optical assembly and the photosensitive portion is configured to protrude out of the cover plate. The limiting portion is configured to limit a movement of the optical assembly away from the rear housing before being fixed in position. The fixing device fixes the optical assembly in the predetermined position so that the assembly accuracy and efficiency are improved. An optical module including the fixing device, and an electronic device including the optical module are also provided.

Abstract: A fixing device for accurately fixing an optical assembly to a rear housing of an electronic device fixes the optical assembly in a predetermined position and includes a cover plate. The cover plate defines a hole and a limiting portion. The hole corresponds to a photosensitive portion of the optical assembly and the photosensitive portion is configured to protrude out of the cover plate. The limiting portion is configured to limit a movement of the optical assembly away from the rear housing before being fixed in position. The fixing device fixes the optical assembly in the predetermined position so that the assembly accuracy and efficiency are improved. An optical module including the fixing device, and an electronic device including the optical module are also provided.

Abstract: A fixing structure used to connect a display panel to a housing of an electronic device during manufacture of the electronic device includes a fixing member, an auxiliary member spaced apart from the fixing member, and supporting posts disposed between the fixing member and the auxiliary member. The fixing member is to be bonded to the display panel. A projection of an outer edge of the auxiliary member on a plane of the fixing member is outside of an outer edge of the fixing member. The supporting posts and the auxiliary member are removed after the display panel is bonded to the fixing member. A method for assembling the display panel with the fixing structure is also disclosed.