Patents by Inventor Meng-Yuan Hsieh

Meng-Yuan Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11939664
    Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.
    Type: Grant
    Filed: August 30, 2021
    Date of Patent: March 26, 2024
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Meng-Chun Hsieh, Tsung-Yu Tsai, Hsing-Yuan Huang, Chih-Chang Wu, Szu-Hua Wu, Chin-Szu Lee
  • Patent number: 11935841
    Abstract: A semiconductor package structure and a method for manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a device package and a shielding layer. The device package includes an electronic device unit and has a first surface, a second surface opposite to the first surface, and a third surface connecting the first surface to the second surface. The shielding layer is disposed on the first surface and the second surface of the device package. A common edge of the second surface and the third surface includes a first portion exposed from the shielding layer by a first length, and a common edge of the first surface and the third surface includes a second portion exposed from the shielding layer by a second length that is different from the first length.
    Type: Grant
    Filed: November 18, 2022
    Date of Patent: March 19, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Yuan Kung, Hung-Yi Lin, Meng-Wei Hsieh, Yu-Pin Tsai
  • Patent number: 11923825
    Abstract: A semiconductor device and a method of manufacturing a semiconductor device are provided. The semiconductor device includes a carrier, an element, and a first electronic component. The element is disposed on the carrier. The first electronic component is disposed above the element. The element is configured to adjust a first bandwidth of a first signal transmitted from the first electronic component.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: March 5, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Cheng-Yuan Kung, Meng-Wei Hsieh
  • Patent number: 11045372
    Abstract: An anti-bedsore bed may comprise a bed unit, a first bed body, and a second bed body. The bed unit has a first mattress, and a bottom portion is coupled on a bottom surface thereof. Moreover, the bottom portion comprises a plurality of first supporting units at positions corresponding to a user's upper back, middle portion of back and lower back, and each of the first supporting units has a first sliding block moveably mounted on the bottom portion. Each of the first sliding blocks has a first supporting rod, and an abutting unit is pivotally connected to an upper end of the first supporting rod. Each of first power units secured on a bottom surface of the first sliding block is engaged with the first supporting rod while each of second power units secured on the bottom portion is engaged with the first sliding block.
    Type: Grant
    Filed: September 6, 2018
    Date of Patent: June 29, 2021
    Inventors: Meng-Yuan Hsieh, Tsair-Rong Chen, Yi-Lung Lee, Yu-Lin Juan
  • Publication number: 20200078240
    Abstract: An anti-bedsore bed may comprise a bed unit, a first bed body, and a second bed body. The bed unit has a first mattress, and a bottom portion is coupled on a bottom surface thereof. Moreover, the bottom portion comprises a plurality of first supporting units at positions corresponding to a user's upper back, middle portion of back and lower back, and each of the first supporting units has a first sliding block moveably mounted on the bottom portion. Each of the first sliding blocks has a first supporting rod, and an abutting unit is pivotally connected to an upper end of the first supporting rod. Each of first power units secured on a bottom surface of the first sliding block is engaged with the first supporting rod while each of second power units secured on the bottom portion is engaged with the first sliding block.
    Type: Application
    Filed: September 6, 2018
    Publication date: March 12, 2020
    Applicants: TERA AUTOTECH CORPORATION, Department of Electrical Engineering, National Changhua University of Education
    Inventors: Meng-Yuan Hsieh, Tsair-Rong Chen, Yi-Lung Lee, Yu-Lin Juan
  • Publication number: 20200046371
    Abstract: A tourniquet is presented with a strap including two patterns of cavities and ridges on top and bottom surfaces respectively. The pattern includes a plurality of spaced cavities arranged in parallel rows, the cavity being rectangular and including two first slopes on two short sides respectively and two second slopes on two elongated sides respectively, the first slopes having an elevation greater than that of the second slopes, and the second slopes having an inclined degree greater than that of the first slopes; and a plurality of spaced depressions arranged in parallel rows, the depression being adjacent to the cavity widthwise, the depression being rectangular, and the depression including two third slopes on two short sides respectively and two fourth slopes on two elongated sides respectively. Depths of the cavity and the depression are different.
    Type: Application
    Filed: August 9, 2018
    Publication date: February 13, 2020
    Inventor: Meng-Yuan Hsieh