Abstract: A Fan-Out package having a main die and a dummy die side-by-side is provided. A molding material is formed along sidewalls of the main die and the dummy die, and a redistribution layer having a plurality of vias and conductive lines is positioned over the main die and the dummy die, where the plurality of vias and the conductive lines are electrically connected to connectors of the main die.

Abstract: An electrical heating device of low electromagnetic wave effect comprises a power wire connected to a power source and a corresponding heating wire connected in series to the power wire. Said heating wire and said power wire each have two ends, one of the ends of said heating wire and one of the ends of said power wire being connected in series and the other one of the ends of said heating wire and the other one of the ends of said power wire being connected to said same power source, and said heating wire and said power wire being in spaced arrangement at a predetermined distance. The electrical heating device further comprises an insulator for providing a common spaced arrangement of the heating wire and the power wire inside the insulator. According to such structure, the present invention can effectively offset the electromagnetic wave and thereby lower the overall electromagnetic wave effect.

Abstract: A float includes a hollow main body having four upper corners each having a first recess defined in therein, a cavity defined below the first recess, and a lug extending outwardly therefrom at a position below the cavity. The hollow main body further includes a second recess defined in an upper side thereof. An anti-slip cover is removably mounted to the second recess.