Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for processing a substrate comprises applying a DC target voltage to a target disposed within a processing volume of a plasma processing chamber, rotating a magnet disposed above the target at a default speed to direct sputter material from the target toward a substrate support disposed within the processing volume, measuring in-situ DC voltage in the processing volume, the in-situ DC voltage different from the DC target voltage, determining if a measured in-situ DC voltage is greater than a preset value, if the measured in-situ DC voltage is less than or equal to the preset value, maintaining the magnet at the default speed, and if the measured in-situ DC voltage is greater than the preset value, rotating the magnet at a speed less than the default speed to decrease the in-situ DC voltage.

Abstract: Methods and apparatus for processing substrates are provided herein. For example, a magnet to target spacing system configured for use with an apparatus for processing a substrate comprises a sensor configured to provide a signal corresponding to a distance between a front of a magnet and a back of a target while rotating the magnet with respect to the target and a magnet controller configured to control the distance between the front of the magnet and the back of the target based upon the signal provided by the sensor.

Abstract: A movable system for automatically monitoring the correlated wind and temperature filed of a bridge, including a bridge monitoring subsystem, a cloud server, and a client. The system monitors the meteorological parameters of a bridge surface and a temperature of a bridge structure, performs data analysis and processing on a cloud server, and performs visual data interaction by using a client. A bridge surface-specific meteorological parameter monitoring module is movable, such that the location of the sensor for meteorological data monitoring can be adjusted at any time to monitor an entire bridge deck in a time-sharing manner. A lower cantilever structure has an adjustable height, such that the sensor for meteorological data monitoring can track a height of a boundary layer of the bridge surface. A bridge structure-specific temperature monitoring module adopts distributed patch-type temperature sensors, which can detect the temperature of the bridge structure in all directions.

Abstract: A movable system for automatically monitoring the correlated wind and temperature filed of a bridge, including a bridge monitoring subsystem, a cloud server, and a client. The system monitors the meteorological parameters of a bridge surface and a temperature of a bridge structure, performs data analysis and processing on a cloud server, and performs visual data interaction by using a client. A bridge surface-specific meteorological parameter monitoring module is movable, such that the location of the sensor for meteorological data monitoring can be adjusted at any time to monitor an entire bridge deck in a time-sharing manner. A lower cantilever structure has an adjustable height, such that the sensor for meteorological data monitoring can track a height of a boundary layer of the bridge surface. A bridge structure-specific temperature monitoring module adopts distributed patch-type temperature sensors, which can detect the temperature of the bridge structure in all directions.

Abstract: Methods and apparatus for processing substrates are provided herein. For example, a magnet to target spacing system configured for use with an apparatus for processing a substrate comprises a sensor configured to provide a signal corresponding to a distance between a front of a magnet and a back of a target while rotating the magnet with respect to the target and a magnet controller configured to control the distance between the front of the magnet and the back of the target based upon the signal provided by the sensor.

Abstract: Methods and apparatus for processing a substrate are provided herein. For example, a method for processing a substrate comprises applying a DC target voltage to a target disposed within a processing volume of a plasma processing chamber, rotating a magnet disposed above the target at a default speed to direct sputter material from the target toward a substrate support disposed within the processing volume, measuring in-situ DC voltage in the processing volume, the in-situ DC voltage different from the DC target voltage, determining if a measured in-situ DC voltage is greater than a preset value, if the measured in-situ DC voltage is less than or equal to the preset value, maintaining the magnet at the default speed, and if the measured in-situ DC voltage is greater than the preset value, rotating the magnet at a speed less than the default speed to decrease the in-situ DC voltage.