Patents by Inventor Mercedes Keyser

Mercedes Keyser has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Cooling structure and method of manufacturing the same
    Patent number: 6602053
    Abstract: A method of forming a cooling feature (28) on a surface (14) of a substrate (12) to protect the substrate from a high temperature environment. The cooling feature is formed by first depositing a layer of a masking material (16) such as epoxy resin on the surface of the substrate. A pattern of voids (18) is then cut into the masking material by a laser engraving process which exposes portions of the substrate surface. A plurality of supports (20) are then formed by electroplating a support material onto the exposed portions of the substrate surface. A layer of material is then electroplated onto the supports and over the masking material to form a skin that interconnects the supports. Finally, the remaining portions of the masking material are removed to form a plurality of cooling channels (26) defined by the supports, skin and substrate surface. An additional layer of material (42) may be deposited onto a top surface (50) of the cooling feature to provide additional thermal and/or mechanical protection.
    Type: Grant
    Filed: August 2, 2001
    Date of Patent: August 5, 2003
    Assignee: Siemens Westinghouse Power Corporation
    Inventors: Ramesh Subramanian, Mercedes Keyser
  • Cooling structure and method of manufacturing the same
    Publication number: 20030026697
    Abstract: A method of forming a cooling feature (28) on a surface (14) of a substrate (12) to protect the substrate from a high temperature environment. The cooling feature is formed by first depositing a layer of a masking material (16) such as epoxy resin on the surface of the substrate. A pattern of voids (18) is then cut into the masking material by a laser engraving process which exposes portions of the substrate surface. A plurality of supports (20) are then formed by electroplating a support material onto the exposed portions of the substrate surface. A layer of material is then electroplated onto the supports and over the masking material to form a skin that interconnects the supports. Finally, the remaining portions of the masking material are removed to form a plurality of cooling channels (26) defined by the supports, skin and substrate surface. An additional layer of material (42) may be deposited onto a top surface (50) of the cooling feature to provide additional thermal and/or mechanical protection.
    Type: Application
    Filed: August 2, 2001
    Publication date: February 6, 2003
    Applicant: Siemens Westinghouse Power Corporation
    Inventors: Ramesh Subramanian, Mercedes Keyser